DE69117322D1 - Heizungs- und Überwachungssystem für eine Halbleiterscheibe und Wirkungsweise - Google Patents

Heizungs- und Überwachungssystem für eine Halbleiterscheibe und Wirkungsweise

Info

Publication number
DE69117322D1
DE69117322D1 DE69117322T DE69117322T DE69117322D1 DE 69117322 D1 DE69117322 D1 DE 69117322D1 DE 69117322 T DE69117322 T DE 69117322T DE 69117322 T DE69117322 T DE 69117322T DE 69117322 D1 DE69117322 D1 DE 69117322D1
Authority
DE
Germany
Prior art keywords
heating
mode
semiconductor wafer
monitoring system
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69117322T
Other languages
English (en)
Other versions
DE69117322T2 (de
Inventor
Jaim Nulman
Dan Maydan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24031855&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69117322(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE69117322D1 publication Critical patent/DE69117322D1/de
Application granted granted Critical
Publication of DE69117322T2 publication Critical patent/DE69117322T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
DE69117322T 1990-04-19 1991-04-09 Heizungs- und Überwachungssystem für eine Halbleiterscheibe und Wirkungsweise Expired - Fee Related DE69117322T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US51071090A 1990-04-19 1990-04-19

Publications (2)

Publication Number Publication Date
DE69117322D1 true DE69117322D1 (de) 1996-04-04
DE69117322T2 DE69117322T2 (de) 1996-10-02

Family

ID=24031855

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69117322T Expired - Fee Related DE69117322T2 (de) 1990-04-19 1991-04-09 Heizungs- und Überwachungssystem für eine Halbleiterscheibe und Wirkungsweise

Country Status (5)

Country Link
EP (1) EP0452777B1 (de)
JP (1) JP2965737B2 (de)
KR (1) KR100190357B1 (de)
DE (1) DE69117322T2 (de)
ES (1) ES2085368T3 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2939771B2 (ja) * 1990-04-09 1999-08-25 アネルバ 株式会社 半導体ウエハーの処理方法および装置
US5551982A (en) * 1994-03-31 1996-09-03 Applied Materials, Inc. Semiconductor wafer process chamber with susceptor back coating
US6600138B2 (en) * 2001-04-17 2003-07-29 Mattson Technology, Inc. Rapid thermal processing system for integrated circuits

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07119647B2 (ja) * 1985-07-15 1995-12-20 日本電気株式会社 光強度測定装置
JPS62118519A (ja) * 1985-11-19 1987-05-29 Mitsubishi Electric Corp 半導体基板加熱装置
US4978567A (en) * 1988-03-31 1990-12-18 Materials Technology Corporation, Subsidiary Of The Carbon/Graphite Group, Inc. Wafer holding fixture for chemical reaction processes in rapid thermal processing equipment and method for making same
US4891499A (en) * 1988-09-09 1990-01-02 Texas Instruments Incorporated Method and apparatus for real-time wafer temperature uniformity control and slip-free heating in lamp heated single-wafer rapid thermal processing systems

Also Published As

Publication number Publication date
EP0452777A2 (de) 1991-10-23
KR910019167A (ko) 1991-11-30
JPH04226047A (ja) 1992-08-14
KR100190357B1 (ko) 1999-06-01
EP0452777A3 (en) 1992-09-09
JP2965737B2 (ja) 1999-10-18
DE69117322T2 (de) 1996-10-02
ES2085368T3 (es) 1996-06-01
EP0452777B1 (de) 1996-02-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee