DE69104968D1 - Verfahren und Vorrichtung zur Laserbearbeitung. - Google Patents

Verfahren und Vorrichtung zur Laserbearbeitung.

Info

Publication number
DE69104968D1
DE69104968D1 DE69104968T DE69104968T DE69104968D1 DE 69104968 D1 DE69104968 D1 DE 69104968D1 DE 69104968 T DE69104968 T DE 69104968T DE 69104968 T DE69104968 T DE 69104968T DE 69104968 D1 DE69104968 D1 DE 69104968D1
Authority
DE
Germany
Prior art keywords
laser processing
laser
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69104968T
Other languages
English (en)
Other versions
DE69104968T2 (de
Inventor
Tsugito Nakazeki
Tomoshige Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTN Corp
Original Assignee
NTN Corp
NTN Toyo Bearing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NTN Corp, NTN Toyo Bearing Co Ltd filed Critical NTN Corp
Application granted granted Critical
Publication of DE69104968D1 publication Critical patent/DE69104968D1/de
Publication of DE69104968T2 publication Critical patent/DE69104968T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lenses (AREA)
  • Microscoopes, Condenser (AREA)
DE69104968T 1990-12-19 1991-11-26 Verfahren und Vorrichtung zur Laserbearbeitung. Expired - Lifetime DE69104968T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP40356390 1990-12-19
JP3126295A JP2648892B2 (ja) 1990-12-19 1991-05-30 レーザ加工装置

Publications (2)

Publication Number Publication Date
DE69104968D1 true DE69104968D1 (de) 1994-12-08
DE69104968T2 DE69104968T2 (de) 1995-03-23

Family

ID=26462517

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69104968T Expired - Lifetime DE69104968T2 (de) 1990-12-19 1991-11-26 Verfahren und Vorrichtung zur Laserbearbeitung.

Country Status (5)

Country Link
US (1) US5260965A (de)
EP (1) EP0491192B1 (de)
JP (1) JP2648892B2 (de)
KR (1) KR960005214B1 (de)
DE (1) DE69104968T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19618533A1 (de) * 1996-05-08 1997-11-13 Siemens Ag Vorrichtung zur ortsgenauen Fixierung von Mikrochips
US6538229B1 (en) 1996-05-08 2003-03-25 Infineon Technologies Ag Method for the positionally accurate adjustment and fixing of a microoptical element
DE19780783D2 (de) * 1996-08-06 1999-09-23 A R C Lasertechnik Gmbh Lasereinrichtung
DE19951482C2 (de) * 1999-10-26 2003-01-09 Zeiss Carl Jena Gmbh Fluoreszenzmikroskop
DE19955383A1 (de) * 1999-10-29 2001-05-03 Orga Kartensysteme Gmbh Verfahren zum Aufbringen von farbigen Informationen auf einen Gegenstand
US7158145B1 (en) 1999-11-18 2007-01-02 Orga Systems Gmbh Method for applying colored information on an object
DE10057298A1 (de) * 2000-11-17 2002-05-29 Baasel Carl Lasertech Lasrbearbeitungsgeräte mit Beobachtungseinrichtung
KR20050027608A (ko) * 2003-09-16 2005-03-21 주식회사 정우인터내셔날 미세 절제 시스템용 광학 채널
KR100536461B1 (ko) * 2003-09-16 2005-12-14 주식회사 정우인터내셔날 미세 절제 시스템
KR100696396B1 (ko) * 2004-10-14 2007-03-20 주식회사 이오테크닉스 레이저 가공 장치
GB0524366D0 (en) * 2005-11-30 2006-01-04 Gsi Group Ltd Laser processing tool
JP5154145B2 (ja) * 2007-05-31 2013-02-27 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置
CN102227667B (zh) 2008-11-28 2014-08-06 浜松光子学株式会社 光调制装置
JP5474340B2 (ja) * 2008-11-28 2014-04-16 浜松ホトニクス株式会社 光変調装置
FR2947918B1 (fr) * 2009-07-07 2011-08-26 Air Liquide Welding France Tete de focalisation laser avec cassette pour lentille
WO2011056900A2 (en) * 2009-11-03 2011-05-12 Applied Materials, Inc. Multi-wavelength laser-scribing tool
WO2013063316A1 (en) 2011-10-25 2013-05-02 Daylight Solutions, Inc. Infrared imaging microscope
US9823451B2 (en) 2013-04-12 2017-11-21 Daylight Solutions, Inc. Infrared refractive objective lens assembly
KR101533336B1 (ko) * 2013-05-30 2015-07-03 주식회사 이오테크닉스 레이저 가공 장치 및 방법
KR101480769B1 (ko) * 2013-11-28 2015-01-22 한국생산기술연구원 입체 형상물 제조장치 및 입체 형상물 제조방법
JP6388823B2 (ja) * 2014-12-01 2018-09-12 株式会社ディスコ レーザー加工装置
JP6969459B2 (ja) * 2018-03-15 2021-11-24 オムロン株式会社 センサヘッド

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57175093A (en) * 1981-04-20 1982-10-27 Toshiba Corp Laser working device
FR2541468B1 (fr) * 1983-02-17 1986-07-11 Commissariat Energie Atomique Dispositif d'alignement d'un faisceau laser par l'intermediaire de moyens optiques de visee, procede de reperage de l'axe d'emission du faisceau laser et procede de mise en oeuvre du dispositif, pour controler l'alignement
US4526447A (en) * 1983-05-07 1985-07-02 Xanar, Inc. Beam directing micromanipulator for laser device
JP2614843B2 (ja) * 1985-12-02 1997-05-28 オリンパス光学工業株式会社 自動焦点顕微鏡
US4749840A (en) * 1986-05-16 1988-06-07 Image Micro Systems, Inc. Intense laser irradiation using reflective optics

Also Published As

Publication number Publication date
JPH04251686A (ja) 1992-09-08
EP0491192B1 (de) 1994-11-02
EP0491192A3 (en) 1992-12-16
DE69104968T2 (de) 1995-03-23
EP0491192A2 (de) 1992-06-24
KR960005214B1 (ko) 1996-04-23
US5260965A (en) 1993-11-09
JP2648892B2 (ja) 1997-09-03
KR920011632A (ko) 1992-07-24

Similar Documents

Publication Publication Date Title
DE69112272D1 (de) Verfahren und Gerät zur Laserbearbeitung.
DE69129163D1 (de) Verfahren und Vorrichtung zur Texteingabe
DE69131350D1 (de) Verfahren und vorrichtung zur bildverarbeitung
DE69000870D1 (de) Verfahren und vorrichtung zur abfallbeseitigung.
DE69104968D1 (de) Verfahren und Vorrichtung zur Laserbearbeitung.
DE69102311D1 (de) Vorrichtung und Verfahren zur Oberflächenreinigung.
DE69230022D1 (de) Verfahren und Vorrichtung zur Gewinnung von Objekttypen
DE69013790D1 (de) Verfahren und Vorrichtung zur Positionsbestimmung.
DE69132110D1 (de) Verfahren und vorrichtung zur belichtung
DE69415484D1 (de) Vorrichtung und verfahren zum laserbearbeiten
DE68927413D1 (de) Verfahren und Vorrichtung zur Datenbankverarbeitung
DE69111352D1 (de) Verfahren und vorrichtung zur ungefähr vertikal ausgerichteten abwicklung von schläuchen.
DE69500955D1 (de) Verfahren und Vorrichtung zur Bearbeitung von Tieren
DE69107834D1 (de) Verfahren und vorrichtung zur tierfütterung.
DE69009091D1 (de) Verfahren und Vorrichtung zur Signalverarbeitung.
DE68917413D1 (de) Verfahren und Vorrichtung zur Bildsignalverarbeitung.
DE3751540D1 (de) Verfahren und Vorrichtung zur Datenverarbeitung.
DE69009368D1 (de) Vorrichtung und Verfahren zur Drahtbearbeitung.
DE69102868D1 (de) Verfahren und vorrichtung zur fütterung von kühen.
DE68922872D1 (de) Vorrichtung und Verfahren zur Fokussierungssteuerung.
DE69115234D1 (de) Verfahren und Vorrichtung zur Handhabung von Wafern.
DE58902492D1 (de) Verfahren und vorrichtung zur sanierung kontaminierter standorte.
DE69215851D1 (de) Verfahren und vorrichtung zum laserbearbeiten
DE3766124D1 (de) Verfahren und vorrichtung zur sprachverarbeitung.
DE3580254D1 (de) Vorrichtung und verfahren zur bildabtastung und -verarbeitung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: GROSSE, BOCKHORNI, SCHUMACHER, 81476 MUENCHEN

8328 Change in the person/name/address of the agent

Representative=s name: GROSSE, SCHUMACHER, KNAUER, VON HIRSCHHAUSEN, 8033