DE69103436D1 - Wärme-Isolator von hoher Wirksamkeit. - Google Patents

Wärme-Isolator von hoher Wirksamkeit.

Info

Publication number
DE69103436D1
DE69103436D1 DE69103436T DE69103436T DE69103436D1 DE 69103436 D1 DE69103436 D1 DE 69103436D1 DE 69103436 T DE69103436 T DE 69103436T DE 69103436 T DE69103436 T DE 69103436T DE 69103436 D1 DE69103436 D1 DE 69103436D1
Authority
DE
Germany
Prior art keywords
highly effective
heat insulator
effective heat
insulator
highly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69103436T
Other languages
English (en)
Other versions
DE69103436T2 (de
Inventor
Hernandez Bernardo
Raymond Robert Horton
Ismail Cevdet Noyan
Michael Jon Palmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69103436D1 publication Critical patent/DE69103436D1/de
Publication of DE69103436T2 publication Critical patent/DE69103436T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B23K20/025—Bonding tips therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/20—Arrangements of heat reflectors, e.g. separately-insertible reflecting walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Manipulator (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69103436T 1990-02-05 1991-01-22 Wärme-Isolator von hoher Wirksamkeit. Expired - Fee Related DE69103436T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47497890A 1990-02-05 1990-02-05

Publications (2)

Publication Number Publication Date
DE69103436D1 true DE69103436D1 (de) 1994-09-22
DE69103436T2 DE69103436T2 (de) 1995-03-30

Family

ID=23885751

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69103436T Expired - Fee Related DE69103436T2 (de) 1990-02-05 1991-01-22 Wärme-Isolator von hoher Wirksamkeit.

Country Status (4)

Country Link
US (2) US5669437A (de)
EP (1) EP0441165B1 (de)
JP (1) JPH0652747B2 (de)
DE (1) DE69103436T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0652747B2 (ja) * 1990-02-05 1994-07-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 断熱装置
DE19540140B4 (de) * 1995-10-27 2006-08-24 Coherent Lübeck GmbH Substrat, Modul und Verfahren zum Befestigen von Komponenten des Moduls auf dem Substrat
US6220503B1 (en) 1999-02-02 2001-04-24 International Business Machines Corporation Rework and underfill nozzle for electronic components
US6839965B2 (en) * 2003-02-06 2005-01-11 R-Tec Corporation Method of manufacturing a resistor connector
JP4091096B2 (ja) * 2004-12-03 2008-05-28 株式会社 ハリーズ インターポーザ接合装置
US20110300050A1 (en) * 2010-06-08 2011-12-08 Memc Electronic Materials, Inc. Trichlorosilane Vaporization System
US9399271B2 (en) 2010-12-28 2016-07-26 Rolls-Royce Corporation Heat treating and brazing of an object
US9585257B2 (en) 2015-03-25 2017-02-28 Globalfoundries Inc. Method of forming a glass interposer with thermal vias

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE654435C (de) * 1937-12-17 Carl Geissen Einrichtung zum Kuehlen des Maschinengestells mehrzylindriger Kolbendampfmaschinen
US2474615A (en) * 1944-07-27 1949-06-28 Maschf Gebr Stork & Co Coupling cooling
US2891308A (en) * 1952-11-15 1959-06-23 Metallizing Company Of America Method and apparatus for applying solder
US3161478A (en) * 1959-05-29 1964-12-15 Horst Corp Of America V D Heat resistant porous structure
US3186811A (en) * 1960-03-24 1965-06-01 Pilkington Brothers Ltd Methods of an apparatus for correcting a deviation from true form of a casting roll
US3267997A (en) * 1962-09-20 1966-08-23 Aero Chatillon Corp Fluid cooled washer
US3437965A (en) * 1963-12-27 1969-04-08 Ogallala Electronics Mfg Inc Heat exchange apparatus for cooling electromagnetic devices
US3327776A (en) * 1965-10-24 1967-06-27 Trane Co Heat exchanger
US3732919A (en) * 1970-07-01 1973-05-15 J Wilson Heat exchanger
US3946720A (en) * 1974-02-25 1976-03-30 International Solarthermics Corporation Solar heat collector
JPS5444047B2 (de) * 1974-07-18 1979-12-24
US3943323A (en) * 1974-08-23 1976-03-09 The Bendix Corporation Bonding apparatus
US3941297A (en) * 1975-06-02 1976-03-02 Western Electric Company, Inc. Method and apparatus for simultaneously bonding a plurality of lead frames to a plurality of planar articles
US4300715A (en) * 1977-09-01 1981-11-17 The Jade Corporation Mechanical pulse reflow bonding process
US4295596A (en) * 1979-12-19 1981-10-20 Western Electric Company, Inc. Methods and apparatus for bonding an article to a metallized substrate
US4593754A (en) * 1980-06-24 1986-06-10 Holl Richard A Shell and tube heat transfer apparatus and process therefor
US4431474A (en) * 1982-08-13 1984-02-14 Western Electric Company, Inc. Thermocompression bonding apparatus
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US4531146A (en) * 1983-07-14 1985-07-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US4730665A (en) * 1983-07-14 1988-03-15 Technology Enterprises Company Apparatus for cooling high-density integrated circuit packages
US4600052A (en) * 1984-03-02 1986-07-15 Southwest Research Institute Compact heat exchanger
JPS61293656A (ja) * 1985-06-19 1986-12-24 Shin Meiwa Ind Co Ltd 鋳造用ロボツト
SE454334B (sv) * 1986-09-01 1988-04-25 Asea Ab Anordning vid industrirobot
IT1200308B (it) * 1986-10-29 1989-01-12 Ansaldo Spa Schermo termico a nido d ape per scambiatori di calore
US4937006A (en) * 1988-07-29 1990-06-26 International Business Machines Corporation Method and apparatus for fluxless solder bonding
JPH0652747B2 (ja) * 1990-02-05 1994-07-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 断熱装置
US5042708A (en) * 1990-09-24 1991-08-27 International Business Machines Corporation Solder placement nozzle assembly
US5065932A (en) * 1990-09-24 1991-11-19 International Business Machines Corporation Solder placement nozzle with inert cover gas and inert gas bleed
JPH06129365A (ja) * 1992-10-16 1994-05-10 Ntn Corp ベーンポンプのベーン

Also Published As

Publication number Publication date
DE69103436T2 (de) 1995-03-30
EP0441165B1 (de) 1994-08-17
US5669437A (en) 1997-09-23
JPH0652747B2 (ja) 1994-07-06
US5915462A (en) 1999-06-29
JPH03296241A (ja) 1991-12-26
EP0441165A3 (en) 1992-03-25
EP0441165A2 (de) 1991-08-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee