DE69026297D1 - Polyamid-Polyimid- und Polybenzoxazol-Polyimid-Polymere - Google Patents

Polyamid-Polyimid- und Polybenzoxazol-Polyimid-Polymere

Info

Publication number
DE69026297D1
DE69026297D1 DE69026297T DE69026297T DE69026297D1 DE 69026297 D1 DE69026297 D1 DE 69026297D1 DE 69026297 T DE69026297 T DE 69026297T DE 69026297 T DE69026297 T DE 69026297T DE 69026297 D1 DE69026297 D1 DE 69026297D1
Authority
DE
Germany
Prior art keywords
polyimide
polybenzoxazole
polyamide
polymers
polyimide polymers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69026297T
Other languages
English (en)
Other versions
DE69026297T2 (de
Inventor
Dinesh N Khanna
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EMD Performance Materials Corp
Original Assignee
Hoechst Celanese Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst Celanese Corp filed Critical Hoechst Celanese Corp
Publication of DE69026297D1 publication Critical patent/DE69026297D1/de
Application granted granted Critical
Publication of DE69026297T2 publication Critical patent/DE69026297T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
DE69026297T 1989-03-09 1990-03-08 Polyamid-Polyimid- und Polybenzoxazol-Polyimid-Polymere Expired - Lifetime DE69026297T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/321,021 US4980447A (en) 1989-03-09 1989-03-09 Polyamide-polyimide and polybenzoxazole-polyimide polymer

Publications (2)

Publication Number Publication Date
DE69026297D1 true DE69026297D1 (de) 1996-05-09
DE69026297T2 DE69026297T2 (de) 1996-09-05

Family

ID=23248834

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69026297T Expired - Lifetime DE69026297T2 (de) 1989-03-09 1990-03-08 Polyamid-Polyimid- und Polybenzoxazol-Polyimid-Polymere

Country Status (5)

Country Link
US (1) US4980447A (de)
EP (1) EP0393826B1 (de)
JP (1) JP3010187B2 (de)
CA (1) CA2010772A1 (de)
DE (1) DE69026297T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206091A (en) * 1988-06-28 1993-04-27 Amoco Corporation Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings
US5071948A (en) * 1989-03-09 1991-12-10 Hoechst Celanese Corporation Polyamide-polyimide and polybenzoxazole-polyimide polymer
US5173561A (en) * 1990-07-24 1992-12-22 Daychem Laboratories, Inc. Heat resistant polyimide-benzoxazole polymers and composites thereof
US5061784A (en) * 1990-08-06 1991-10-29 Hoechst Celanese Corporation Polymers prepared from 4,4'-bis(3,4-dicarboxyphenyl) hexafluoroisopropyl) diphenyl dianhydride
AT398770B (de) * 1992-09-17 1995-01-25 Chemie Linz Gmbh Thermostabile polyimide und polyamidimide mit modifizierten benzhydrolstrukturelementen und deren herstellung
JPH07179605A (ja) * 1993-06-18 1995-07-18 Shin Etsu Chem Co Ltd ポリイミド及びその製造方法
US5478914A (en) * 1993-07-16 1995-12-26 Shin-Etsu Chemical Co., Ltd. Polyimides and processes for preparaing the same
US5919892A (en) * 1994-10-31 1999-07-06 The Dow Chemical Company Polyamic acids and methods to convert polyamic acids into polyimidebenzoxazole films
US5741585A (en) * 1995-04-24 1998-04-21 The Dow Chemical Company Polyamic acid precursors and methods for preparing higher molecular weight polyamic acids and polyimidebenzoxazole
US5670262A (en) * 1995-05-09 1997-09-23 The Dow Chemical Company Printing wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof
US5716677A (en) * 1996-03-21 1998-02-10 Ohio Aerospace Institute Protective coatings for polyimide composites
EP1051440B1 (de) 1998-01-16 2006-08-30 Maverick Corporation Hochtemperaturbeständige polyimide mit niedriger toxizität
JP2000290374A (ja) * 1999-04-09 2000-10-17 Central Glass Co Ltd 含フッ素ポリベンゾオキサゾール
US6384182B2 (en) * 1999-04-09 2002-05-07 Central Glass Company, Limited Fluorine-containing polybenzoxazole
US8633284B2 (en) 2006-05-12 2014-01-21 General Electric Company Tailorable polyimide prepolymer blends, crosslinked polymides and articles formed therefrom
KR100932765B1 (ko) * 2008-02-28 2009-12-21 한양대학교 산학협력단 폴리이미드-폴리벤조옥사졸 공중합체, 이의 제조방법, 및이를 포함하는 기체 분리막
CA2640517A1 (en) * 2008-05-19 2009-11-19 Industry-University Cooperation Foundation, Hanyang University Polyamic acids dope composition, preparation method of hollow fiber using the same and hollow fiber prepared therefrom
US8013103B2 (en) * 2008-10-10 2011-09-06 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
US8487064B2 (en) 2008-10-10 2013-07-16 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
US10406791B2 (en) 2011-05-12 2019-09-10 Elantas Pdg, Inc. Composite insulating film
US10253211B2 (en) 2011-05-12 2019-04-09 Elantas Pdg, Inc. Composite insulating film
US11130320B2 (en) 2014-07-11 2021-09-28 Samsung Electronics Co., Ltd. Transparent polymer film and electronic device including the same
WO2017221776A1 (ja) * 2016-06-24 2017-12-28 東レ株式会社 ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179635A (en) * 1963-07-08 1965-04-20 Westinghouse Electric Corp Linear polymeric amide-modified polyimides and process of making same
US4111906A (en) * 1976-07-19 1978-09-05 Trw Inc. Polyimides prepared from perfluoroisopropylidene diamine
JPS6270424A (ja) * 1985-09-24 1987-03-31 Idemitsu Kosan Co Ltd ポリアミドイミド樹脂およびその製造方法
GB2188936B (en) * 1986-03-06 1988-12-21 Central Glass Co Ltd Aromatic polyamides and polybenoxazoles having diphenylhexafluoropropane units
US4847353A (en) * 1986-11-20 1989-07-11 Nippon Steel Chemical Co., Ltd. Resins of low thermal expansivity

Also Published As

Publication number Publication date
EP0393826B1 (de) 1996-04-03
JP3010187B2 (ja) 2000-02-14
US4980447A (en) 1990-12-25
CA2010772A1 (en) 1990-09-09
JPH03200838A (ja) 1991-09-02
EP0393826A2 (de) 1990-10-24
DE69026297T2 (de) 1996-09-05
EP0393826A3 (de) 1991-02-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: CLARIANT FINANCE (BVI) LTD., ROAD TOWN, TORTOLA, V

8328 Change in the person/name/address of the agent

Free format text: SPOTT WEINMILLER & PARTNER, 80336 MUENCHEN

8327 Change in the person/name/address of the patent owner

Owner name: AZ ELECTRONIC MATERIALS USA CORP. (N.D.GES.D. STAA

8328 Change in the person/name/address of the agent

Representative=s name: PATENTANWAELTE ISENBRUCK BOESL HOERSCHLER WICHMANN HU