DE69023308D1 - Verfahren zur Herstellung von Strukturen aus verbundenen synthetischen Einkristallen. - Google Patents
Verfahren zur Herstellung von Strukturen aus verbundenen synthetischen Einkristallen.Info
- Publication number
- DE69023308D1 DE69023308D1 DE69023308T DE69023308T DE69023308D1 DE 69023308 D1 DE69023308 D1 DE 69023308D1 DE 69023308 T DE69023308 T DE 69023308T DE 69023308 T DE69023308 T DE 69023308T DE 69023308 D1 DE69023308 D1 DE 69023308D1
- Authority
- DE
- Germany
- Prior art keywords
- structures
- production
- single crystals
- synthetic single
- connected synthetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1207212A JP2595102B2 (ja) | 1989-08-09 | 1989-08-09 | 主成分及び結晶系を同じくする合成単結晶体を化学結合させて一体同化した同軸結晶結合体の製造方法 |
JP11256890A JPH0412100A (ja) | 1990-04-27 | 1990-04-27 | 主成分及び結晶系を同じくする合成単結晶体を化学結合させて一体同化した同軸結晶結合体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69023308D1 true DE69023308D1 (de) | 1995-12-07 |
DE69023308T2 DE69023308T2 (de) | 1996-06-13 |
Family
ID=26451698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69023308T Expired - Fee Related DE69023308T2 (de) | 1989-08-09 | 1990-08-07 | Verfahren zur Herstellung von Strukturen aus verbundenen synthetischen Einkristallen. |
Country Status (3)
Country | Link |
---|---|
US (1) | US5201977A (de) |
EP (1) | EP0416301B1 (de) |
DE (1) | DE69023308T2 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6025060A (en) * | 1988-08-30 | 2000-02-15 | Onyx Optics, Inc. | Method and apparatus for composite gemstones |
US5846638A (en) * | 1988-08-30 | 1998-12-08 | Onyx Optics, Inc. | Composite optical and electro-optical devices |
DE69112900T2 (de) * | 1990-04-27 | 1996-05-23 | Hiroaki Aoshima | Verfahren zum Verbinden synthetischer Einkristalle. |
US5599278A (en) * | 1994-03-15 | 1997-02-04 | Erich M. N. Hibbard | Autoclavable rigid endoscope |
US6484585B1 (en) | 1995-02-28 | 2002-11-26 | Rosemount Inc. | Pressure sensor for a pressure transmitter |
US5637802A (en) | 1995-02-28 | 1997-06-10 | Rosemount Inc. | Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates |
EP0742598B1 (de) * | 1995-05-08 | 2000-08-02 | Matsushita Electric Industrial Co., Ltd. | Verfahren zur Herstellung eines Verbundsubstrats und eine dieses Substrat benutzende piezoelektrischer Anordnung |
JPH0952184A (ja) * | 1995-08-14 | 1997-02-25 | Natl Res Inst For Metals | 単結晶積層材 |
KR100245794B1 (ko) * | 1997-09-22 | 2000-03-02 | 윤종용 | 리드 프레임 이송장치 및 이를 구비한 와이어 본딩 장치 |
US5942343A (en) * | 1997-10-16 | 1999-08-24 | Raytheon Company | Bonded sapphire, and method of making same |
CA2299236A1 (en) | 1998-02-20 | 1999-08-26 | Brian L. Lawrence | Optical amplifier and process for amplifying an optical signal propagating in a fiber optic employing an overlay waveguide and stimulated emission |
WO1999043121A2 (en) | 1998-02-20 | 1999-08-26 | Molecular Optoelectronics Corporation | Communications link optical amplification and dispersion compensation |
US6141475A (en) * | 1998-07-23 | 2000-10-31 | Molecular Optoelectronics Corporation | Optical waveguide with dissimilar core and cladding materials, and light emitting device employing the same |
US6270604B1 (en) * | 1998-07-23 | 2001-08-07 | Molecular Optoelectronics Corporation | Method for fabricating an optical waveguide |
US6236793B1 (en) | 1998-09-23 | 2001-05-22 | Molecular Optoelectronics Corporation | Optical channel waveguide amplifier |
US6160824A (en) * | 1998-11-02 | 2000-12-12 | Maxios Laser Corporation | Laser-pumped compound waveguide lasers and amplifiers |
US6858274B2 (en) | 1998-12-22 | 2005-02-22 | Rion Co., Ltd. | Synthetic corundum cell |
WO2000037720A1 (fr) * | 1998-12-22 | 2000-06-29 | Japan Cell Co., Ltd. | Procede de liaison de corindon de synthese, procede de production d'une cellule a base de corindon de synthese et cellule a base de corindon de synthese correspondante |
US6208456B1 (en) | 1999-05-24 | 2001-03-27 | Molecular Optoelectronics Corporation | Compact optical amplifier with integrated optical waveguide and pump source |
WO2000071342A1 (en) * | 1999-05-26 | 2000-11-30 | Ii-Vi Incorporated | Contacted crystal surface protector and method |
US6505516B1 (en) | 2000-01-06 | 2003-01-14 | Rosemount Inc. | Capacitive pressure sensing with moving dielectric |
US6508129B1 (en) | 2000-01-06 | 2003-01-21 | Rosemount Inc. | Pressure sensor capsule with improved isolation |
JP3620795B2 (ja) | 2000-01-06 | 2005-02-16 | ローズマウント インコーポレイテッド | 超小型電気機械システム用電気的相互接続部の結晶粒成長 |
US6561038B2 (en) | 2000-01-06 | 2003-05-13 | Rosemount Inc. | Sensor with fluid isolation barrier |
US6520020B1 (en) | 2000-01-06 | 2003-02-18 | Rosemount Inc. | Method and apparatus for a direct bonded isolated pressure sensor |
US6663736B1 (en) * | 2001-11-07 | 2003-12-16 | Saint-Gobain Ceramics & Plastics, Inc. | Method for making a bonded sapphire structure |
US6605544B2 (en) * | 2001-11-07 | 2003-08-12 | Saint-Gobain Ceramics & Plastics, Inc. | Bonded sapphire polygon shield |
US6848316B2 (en) * | 2002-05-08 | 2005-02-01 | Rosemount Inc. | Pressure sensor assembly |
FR2939151A1 (fr) * | 2008-12-01 | 2010-06-04 | Soitec Silicon On Insulator | Lingots formes d'au moins deux lingots elementaires, un procede de fabrication et une plaquette qui en est issue |
US8652281B2 (en) * | 2011-01-31 | 2014-02-18 | The United States Of America, As Represented By The Secretary Of The Navy | Spinel ceramics via edge bonding |
EP3113210B1 (de) * | 2014-02-28 | 2018-11-07 | Nikon Corporation | Optisches calciumfluoridelement, herstellungsverfahren dafür, gasbehälter und lichtquellenvorrichtung |
CN107022792A (zh) * | 2017-02-28 | 2017-08-08 | 梧州市东麟宝石机械有限公司 | 一种人工合成蓝宝石的制备方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3116175A (en) * | 1958-01-27 | 1963-12-31 | Marvalaud Inc | Method for forming bicrystalline specimens |
US3950596A (en) * | 1971-12-20 | 1976-04-13 | Astrid Corporation, Limited | Altering the appearance of corundum crystals |
US4407566A (en) * | 1981-09-29 | 1983-10-04 | Lockheed Missiles & Space Co., Inc. | Optical filter |
US4884855A (en) * | 1983-07-12 | 1989-12-05 | Barnes Engineering Company | Narrow-band optical absorption filter |
JPS6051700A (ja) * | 1983-08-31 | 1985-03-23 | Toshiba Corp | シリコン結晶体の接合方法 |
JPS6246996A (ja) * | 1985-08-22 | 1987-02-28 | Matsushita Graphic Commun Syst Inc | 大面積薄膜単結晶ウエハの製造方法 |
US4721541A (en) * | 1985-09-26 | 1988-01-26 | Trak Microwave Corporation | Ceramic diffusion bonding method |
JPS62154614A (ja) * | 1985-12-27 | 1987-07-09 | Toshiba Corp | 接合型半導体基板の製造方法 |
US4800474A (en) * | 1986-05-15 | 1989-01-24 | Vari-Lite, Inc. | Color wheel assembly for lighting equipment |
US4897770A (en) * | 1988-03-04 | 1990-01-30 | Dennis Solomon | Symmetrical color changer system |
EP0355340A1 (de) * | 1988-07-04 | 1990-02-28 | Hiroaki Aoshima | Verfahren zur Herstellung von Gefügen durch Zusammenfügen synthetischer Einkristalle aus Korund |
JPH02124800A (ja) * | 1988-07-04 | 1990-05-14 | Hiroaki Aoshima | 一体同化した合成コランダムの単結晶構造体の製造方法 |
US4939101A (en) * | 1988-09-06 | 1990-07-03 | General Electric Company | Method of making direct bonded wafers having a void free interface |
US4925608A (en) * | 1988-09-27 | 1990-05-15 | Norton Company | Joining of SiC parts by polishing and hipping |
JPH07101679B2 (ja) * | 1988-11-01 | 1995-11-01 | 三菱電機株式会社 | 電子デバイス用ウエハ,ウエハ用棒状基材および電子デバイス |
-
1990
- 1990-07-31 US US07/560,838 patent/US5201977A/en not_active Expired - Lifetime
- 1990-08-07 EP EP90115194A patent/EP0416301B1/de not_active Expired - Lifetime
- 1990-08-07 DE DE69023308T patent/DE69023308T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5201977A (en) | 1993-04-13 |
EP0416301B1 (de) | 1995-11-02 |
DE69023308T2 (de) | 1996-06-13 |
EP0416301A3 (en) | 1991-10-30 |
EP0416301A2 (de) | 1991-03-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |