DE69017555D1 - Verfahren und Vorrichtung zum Sputterauftragen von Filmen. - Google Patents

Verfahren und Vorrichtung zum Sputterauftragen von Filmen.

Info

Publication number
DE69017555D1
DE69017555D1 DE69017555T DE69017555T DE69017555D1 DE 69017555 D1 DE69017555 D1 DE 69017555D1 DE 69017555 T DE69017555 T DE 69017555T DE 69017555 T DE69017555 T DE 69017555T DE 69017555 D1 DE69017555 D1 DE 69017555D1
Authority
DE
Germany
Prior art keywords
sputtering films
sputtering
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69017555T
Other languages
English (en)
Other versions
DE69017555T2 (de
Inventor
Stanislav Kadlec
Jindrich Musil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IHI Hauzer Techno Coating BV
Original Assignee
HAUZER HOLDING
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HAUZER HOLDING filed Critical HAUZER HOLDING
Application granted granted Critical
Publication of DE69017555D1 publication Critical patent/DE69017555D1/de
Publication of DE69017555T2 publication Critical patent/DE69017555T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Preparation Of Compounds By Using Micro-Organisms (AREA)
DE1990617555 1989-08-14 1990-08-13 Verfahren und Vorrichtung zum Sputterauftragen von Filmen. Expired - Fee Related DE69017555T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS894804A CZ278295B6 (en) 1989-08-14 1989-08-14 Process of sputtering layers and apparatus for making the same

Publications (2)

Publication Number Publication Date
DE69017555D1 true DE69017555D1 (de) 1995-04-13
DE69017555T2 DE69017555T2 (de) 1995-07-13

Family

ID=5391610

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1990617555 Expired - Fee Related DE69017555T2 (de) 1989-08-14 1990-08-13 Verfahren und Vorrichtung zum Sputterauftragen von Filmen.

Country Status (6)

Country Link
EP (1) EP0413291B1 (de)
JP (1) JP3045752B2 (de)
CA (1) CA2023092A1 (de)
CZ (1) CZ278295B6 (de)
DE (1) DE69017555T2 (de)
SK (1) SK277865B6 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0816266B2 (ja) * 1990-10-31 1996-02-21 インターナショナル・ビジネス・マシーンズ・コーポレーション 高アスペクト比の穴に材料を付着させる装置
US5178739A (en) * 1990-10-31 1993-01-12 International Business Machines Corporation Apparatus for depositing material into high aspect ratio holes
WO1995004368A1 (en) * 1993-07-29 1995-02-09 Institute Of Physics Academy Of Sciences Of The Czech Republic Method and device for magnetron sputtering
JP3125907B2 (ja) * 1993-09-27 2001-01-22 株式会社ミツバ 結晶配向薄膜製造装置
GB2306510B (en) * 1995-11-02 1999-06-23 Univ Surrey Modification of metal surfaces
DE10018143C5 (de) † 2000-04-12 2012-09-06 Oerlikon Trading Ag, Trübbach DLC-Schichtsystem sowie Verfahren und Vorrichtung zur Herstellung eines derartigen Schichtsystems
US7166199B2 (en) 2002-12-18 2007-01-23 Cardinal Cg Company Magnetron sputtering systems including anodic gas distribution systems
US7850828B2 (en) 2006-09-15 2010-12-14 Cardinal Cg Company Enhanced virtual anode
CN107208249B (zh) 2015-02-03 2019-08-20 卡迪奈尔镀膜玻璃公司 包括气体分配系统的喷溅装置
CN109473334B (zh) * 2018-12-28 2024-07-26 上海福宜真空设备有限公司 一种离子源
CN115461491B (zh) * 2020-07-01 2024-08-23 应用材料公司 用于操作腔室的方法、用于处理基板的装置和基板处理系统
FR3120125B1 (fr) * 2021-02-25 2023-09-08 Saint Gobain Dispositif de mesure de pression vide secondaire et système embarqué pour mesure de pression de vide résiduel

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3458426A (en) * 1966-05-25 1969-07-29 Fabri Tek Inc Symmetrical sputtering apparatus with plasma confinement
US4853102A (en) * 1987-01-07 1989-08-01 Hitachi, Ltd. Sputtering process and an apparatus for carrying out the same

Also Published As

Publication number Publication date
CZ480489A3 (en) 1993-10-13
SK480489A3 (en) 1994-06-08
SK277865B6 (en) 1995-05-10
JPH03193871A (ja) 1991-08-23
DE69017555T2 (de) 1995-07-13
EP0413291A3 (en) 1992-03-11
EP0413291B1 (de) 1995-03-08
JP3045752B2 (ja) 2000-05-29
CA2023092A1 (en) 1991-02-15
EP0413291A2 (de) 1991-02-20
CZ278295B6 (en) 1993-11-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HAUZER TECHNO COATING EUROPE B.V., VENLO, NL

8327 Change in the person/name/address of the patent owner

Owner name: HAUZER TECHNO-COATING B.V., VENLO, NL

8339 Ceased/non-payment of the annual fee