DE69016823D1 - Vorrichtung zum Aufbringen eines Leiterbahnmusters unter Verwendung eines Rastertunnelmikroskops. - Google Patents

Vorrichtung zum Aufbringen eines Leiterbahnmusters unter Verwendung eines Rastertunnelmikroskops.

Info

Publication number
DE69016823D1
DE69016823D1 DE69016823T DE69016823T DE69016823D1 DE 69016823 D1 DE69016823 D1 DE 69016823D1 DE 69016823 T DE69016823 T DE 69016823T DE 69016823 T DE69016823 T DE 69016823T DE 69016823 D1 DE69016823 D1 DE 69016823D1
Authority
DE
Germany
Prior art keywords
applying
conductor track
track pattern
scanning tunneling
tunneling microscope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69016823T
Other languages
English (en)
Other versions
DE69016823T2 (de
Inventor
Hiroko Ohta
Ryouhei Shimizu
Toshihito Kouchi
Akitoshi Toda
Yasuo Isono
Yoshiyuki Mimura
Hiroshi Kajimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Publication of DE69016823D1 publication Critical patent/DE69016823D1/de
Application granted granted Critical
Publication of DE69016823T2 publication Critical patent/DE69016823T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0121—Patterning, e.g. plating or etching by moving electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1338—Chemical vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y10S977/855—Manufacture, treatment, or detection of nanostructure with scanning probe for manufacture of nanostructure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y10S977/86—Scanning probe structure
    • Y10S977/861—Scanning tunneling probe
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y10S977/86—Scanning probe structure
    • Y10S977/872—Positioner
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y10S977/86—Scanning probe structure
    • Y10S977/874—Probe tip array
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/887—Nanoimprint lithography, i.e. nanostamp

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
DE69016823T 1989-05-09 1990-05-07 Vorrichtung zum Aufbringen eines Leiterbahnmusters unter Verwendung eines Rastertunnelmikroskops. Expired - Fee Related DE69016823T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1115821A JPH02295050A (ja) 1989-05-09 1989-05-09 μ―ＳＴＭを用いた回路パターン作製装置および回路パターン作製方法

Publications (2)

Publication Number Publication Date
DE69016823D1 true DE69016823D1 (de) 1995-03-23
DE69016823T2 DE69016823T2 (de) 1995-09-21

Family

ID=14671941

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69016823T Expired - Fee Related DE69016823T2 (de) 1989-05-09 1990-05-07 Vorrichtung zum Aufbringen eines Leiterbahnmusters unter Verwendung eines Rastertunnelmikroskops.

Country Status (4)

Country Link
US (1) US5216254A (de)
EP (1) EP0397073B1 (de)
JP (1) JPH02295050A (de)
DE (1) DE69016823T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5047649A (en) * 1990-10-09 1991-09-10 International Business Machines Corporation Method and apparatus for writing or etching narrow linewidth patterns on insulating materials
WO1992012528A1 (en) * 1991-01-11 1992-07-23 Hitachi Limited Surface atom machining method and apparatus
JP2981804B2 (ja) * 1991-07-31 1999-11-22 キヤノン株式会社 情報処理装置、それに用いる電極基板、及び情報記録媒体
JP3246987B2 (ja) * 1992-09-10 2002-01-15 キヤノン株式会社 マルチプローブ制御回路を具備する情報処理装置
DE4342314C2 (de) * 1993-12-11 1997-08-14 Joachim Behrendt Verfahren zur Erzeugung von Strukturen
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
IL182371A0 (en) * 2006-04-04 2007-07-24 Hanita Coatings R C A Ltd Patterns of conductive objects on a substrate and method of producing thereof
US7992293B2 (en) * 2006-04-04 2011-08-09 Hanita Coatings R.C.A. Ltd Method of manufacturing a patterned conductive layer
US20090165296A1 (en) * 2006-04-04 2009-07-02 Yoash Carmi Patterns of conductive objects on a substrate and method of producing thereof
US9268622B2 (en) * 2010-05-28 2016-02-23 The Mathworks, Inc. Message-based model verification

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4477729A (en) * 1982-10-01 1984-10-16 International Business Machines Corporation Continuously writing electron beam stitched pattern exposure system
EP0194323B1 (de) * 1985-03-07 1989-08-02 International Business Machines Corporation Tunneleffektabtastungsmikroskop
JPH0712013B2 (ja) * 1985-04-29 1995-02-08 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 低エネルギ電子ビーム・リソグラフイ露光装置及びその方法
US4785189A (en) * 1985-04-29 1988-11-15 International Business Machines Corporation Method and apparatus for low-energy scanning electron beam lithography
EP0247219B1 (de) * 1986-05-27 1991-05-15 International Business Machines Corporation Speichereinheit mit direktem Zugriff
US4906840A (en) * 1988-01-27 1990-03-06 The Board Of Trustees Of Leland Stanford Jr., University Integrated scanning tunneling microscope
DE3850968T2 (de) * 1988-10-14 1995-03-16 Ibm Abstandsgesteuerter Tunneleffektwandler und den Wandler verwendende Speichereinheit mit direktem Zugriff.
US4968390A (en) * 1988-11-03 1990-11-06 Board Of Regents, The University Of Texas System High resolution deposition and etching in polymer films
JP2547869B2 (ja) * 1988-11-09 1996-10-23 キヤノン株式会社 プローブユニット，該プローブの駆動方法及び該プローブユニットを備えた走査型トンネル電流検知装置
US5015850A (en) * 1989-06-20 1991-05-14 The Board Of Trustees Of The Leland Stanford Junior University Microfabricated microscope assembly

Also Published As

Publication number Publication date
US5216254A (en) 1993-06-01
EP0397073A3 (de) 1991-09-11
JPH02295050A (ja) 1990-12-05
EP0397073B1 (de) 1995-02-15
EP0397073A2 (de) 1990-11-14
DE69016823T2 (de) 1995-09-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee