DE69016626D1 - Direktverbundene Struktur. - Google Patents

Direktverbundene Struktur.

Info

Publication number
DE69016626D1
DE69016626D1 DE69016626T DE69016626T DE69016626D1 DE 69016626 D1 DE69016626 D1 DE 69016626D1 DE 69016626 T DE69016626 T DE 69016626T DE 69016626 T DE69016626 T DE 69016626T DE 69016626 D1 DE69016626 D1 DE 69016626D1
Authority
DE
Germany
Prior art keywords
directly connected
connected structure
directly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69016626T
Other languages
English (en)
Other versions
DE69016626T2 (de
Inventor
Harold Frank Webster
Constantine Alois Neugebauer
James Francis Burgess
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harris Corp
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE69016626D1 publication Critical patent/DE69016626D1/de
Application granted granted Critical
Publication of DE69016626T2 publication Critical patent/DE69016626T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12576—Boride, carbide or nitride component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/1266—O, S, or organic compound in metal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y10T428/12833—Alternative to or next to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12868—Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
DE69016626T 1989-12-21 1990-12-14 Direktverbundene Struktur. Expired - Fee Related DE69016626T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/454,547 US4996116A (en) 1989-12-21 1989-12-21 Enhanced direct bond structure

Publications (2)

Publication Number Publication Date
DE69016626D1 true DE69016626D1 (de) 1995-03-16
DE69016626T2 DE69016626T2 (de) 1995-05-24

Family

ID=23805056

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69016626T Expired - Fee Related DE69016626T2 (de) 1989-12-21 1990-12-14 Direktverbundene Struktur.

Country Status (4)

Country Link
US (1) US4996116A (de)
EP (1) EP0434313B1 (de)
JP (1) JP3126977B2 (de)
DE (1) DE69016626T2 (de)

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DE3924225C2 (de) * 1988-07-22 1994-01-27 Mitsubishi Electric Corp Verfahren zur Herstellung eines Keramik-Metall-Verbundsubstrats sowie Keramik-Metall-Verbundsubstrat
US5296310A (en) * 1992-02-14 1994-03-22 Materials Science Corporation High conductivity hydrid material for thermal management
US5544038A (en) * 1992-09-21 1996-08-06 General Electric Company Synchronous rectifier package for high-efficiency operation
US5777259A (en) * 1994-01-14 1998-07-07 Brush Wellman Inc. Heat exchanger assembly and method for making the same
CA2140311A1 (en) * 1994-01-14 1995-07-15 Joseph P. Mennucci Multilayer laminate product and process
US5876859A (en) * 1994-11-10 1999-03-02 Vlt Corporation Direct metal bonding
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
JP2732823B2 (ja) * 1995-02-02 1998-03-30 ヴィエルティー コーポレーション はんだ付け方法
US6022426A (en) * 1995-05-31 2000-02-08 Brush Wellman Inc. Multilayer laminate process
JPH09275182A (ja) * 1996-04-02 1997-10-21 Seiichi Serizawa 半導体装置用リ−ドフレ−ム
JP3746594B2 (ja) * 1997-06-20 2006-02-15 日本碍子株式会社 セラミックスの接合構造およびその製造方法
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6337513B1 (en) * 1999-11-30 2002-01-08 International Business Machines Corporation Chip packaging system and method using deposited diamond film
AT4290U1 (de) * 2000-12-27 2001-05-25 Plansee Ag Verfahren zur herabsetzung des spezifischen widerstandes einer elektrisch leitenden schicht
US6985341B2 (en) * 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
US6699571B1 (en) 2002-03-27 2004-03-02 Morgan Advanced Ceramics, Inc. Devices and methods for mounting components of electronic circuitry
JP4014549B2 (ja) * 2003-09-18 2007-11-28 富士電機システムズ株式会社 ヒートシンク及びその製造方法
DE102004033933B4 (de) * 2004-07-08 2009-11-05 Electrovac Ag Verfahren zum Herstellen eines Metall-Keramik-Substrates
CN100389371C (zh) * 2004-09-16 2008-05-21 中芯国际集成电路制造(上海)有限公司 具有低待机电流的调压器用器件和方法
US20070231590A1 (en) * 2006-03-31 2007-10-04 Stellar Industries Corp. Method of Bonding Metals to Ceramics
US7719194B2 (en) * 2006-05-12 2010-05-18 General Electric Company Inhibited oxidation foil connector for a lamp
JP4531114B2 (ja) * 2008-03-19 2010-08-25 日鉱金属株式会社 基材上にバリア兼シード層が形成された電子部材
DE102010025313A1 (de) * 2010-06-28 2011-12-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen einer strukturierten, elektrisch leitfähigen Schicht auf einem Keramikträger
US8957531B2 (en) 2011-10-20 2015-02-17 International Business Machines Corporation Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
US9941376B2 (en) 2015-04-30 2018-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Metal gate scheme for device and methods of forming
JP6744488B2 (ja) * 2017-05-26 2020-08-19 京セラ株式会社 パワーモジュール用基板およびパワーモジュール
WO2019165579A1 (zh) * 2018-02-27 2019-09-06 南方科技大学 单质非晶钯及其制备方法和用途
KR20200097375A (ko) * 2019-02-07 2020-08-19 삼성디스플레이 주식회사 마스크 어셈블리 및 마스크 어셈블리 제조 방법

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DE1005346B (de) * 1955-07-30 1957-03-28 Heraeus Gmbh W C Zum Loeten von Metallteilen, insbesondere elektrischen Kontaktteilen, geeignete Flaeche
US3006069A (en) * 1957-05-23 1961-10-31 Rca Corp Method of sealing a metal member to a ceramic member
US3160798A (en) * 1959-12-07 1964-12-08 Gen Electric Semiconductor devices including means for securing the elements
US3147547A (en) * 1960-03-10 1964-09-08 Gen Electric Coating refractory metals
US3273979A (en) * 1964-07-06 1966-09-20 Rca Corp Semiconductive devices
US3593412A (en) * 1969-07-22 1971-07-20 Motorola Inc Bonding system for semiconductor device
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3854892A (en) * 1972-04-20 1974-12-17 Gen Electric Direct bonding of metals with a metal-gas eutectic
US3744120A (en) * 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
US3993411A (en) * 1973-06-01 1976-11-23 General Electric Company Bonds between metal and a non-metallic substrate
GB1457806A (en) * 1974-03-04 1976-12-08 Mullard Ltd Semiconductor device manufacture
US3911553A (en) * 1974-03-04 1975-10-14 Gen Electric Method for bonding metal to ceramic
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
US4076711A (en) * 1976-04-05 1978-02-28 Schering Corporation Triazolo [4,5-d]-pyrimidines
NL7903241A (nl) * 1979-04-25 1980-10-28 Philips Nv Televisie sleutelsignaalschakeling.
US4567110A (en) * 1979-11-13 1986-01-28 Massachusetts Institute Of Technology High-temperature brazed ceramic joints
US4409278A (en) * 1981-04-16 1983-10-11 General Electric Company Blister-free direct bonding of metals to ceramics and metals
EP0097944B1 (de) * 1982-06-29 1988-06-01 Kabushiki Kaisha Toshiba Verfahren zum direkten Verbinden von keramischen- und Metallkörpern und derartiger Verbundkörper
US4563383A (en) * 1984-03-30 1986-01-07 General Electric Company Direct bond copper ceramic substrate for electronic applications
US4727633A (en) * 1985-08-08 1988-03-01 Tektronix, Inc. Method of securing metallic members together
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Also Published As

Publication number Publication date
JP3126977B2 (ja) 2001-01-22
JPH03216909A (ja) 1991-09-24
US4996116A (en) 1991-02-26
EP0434313A3 (en) 1991-08-07
DE69016626T2 (de) 1995-05-24
EP0434313B1 (de) 1995-02-01
EP0434313A2 (de) 1991-06-26

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: GENERAL ELECTRIC CO., SCHENECTADY, N.Y., US HARRIS

8327 Change in the person/name/address of the patent owner

Owner name: HARRIS CORP., MELBOURNE, FLA., US

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee