DE69013945D1 - Photographische Bildaufzeichnungszusammensetzung. - Google Patents

Photographische Bildaufzeichnungszusammensetzung.

Info

Publication number
DE69013945D1
DE69013945D1 DE69013945T DE69013945T DE69013945D1 DE 69013945 D1 DE69013945 D1 DE 69013945D1 DE 69013945 T DE69013945 T DE 69013945T DE 69013945 T DE69013945 T DE 69013945T DE 69013945 D1 DE69013945 D1 DE 69013945D1
Authority
DE
Germany
Prior art keywords
imaging composition
photographic imaging
photographic
composition
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69013945T
Other languages
English (en)
Other versions
DE69013945T2 (de
Inventor
Richard Allen Day
Jeffrey Donald Gelorme
David John Russell
Steven Jo Witt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69013945D1 publication Critical patent/DE69013945D1/de
Publication of DE69013945T2 publication Critical patent/DE69013945T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/122—Sulfur compound containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/122—Sulfur compound containing
    • Y10S430/123—Sulfur in heterocyclic ring

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69013945T 1989-03-03 1990-02-01 Photographische Bildaufzeichnungszusammensetzung. Expired - Lifetime DE69013945T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/318,536 US5026624A (en) 1989-03-03 1989-03-03 Composition for photo imaging

Publications (2)

Publication Number Publication Date
DE69013945D1 true DE69013945D1 (de) 1994-12-15
DE69013945T2 DE69013945T2 (de) 1995-05-24

Family

ID=23238594

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69013945T Expired - Lifetime DE69013945T2 (de) 1989-03-03 1990-02-01 Photographische Bildaufzeichnungszusammensetzung.

Country Status (6)

Country Link
US (1) US5026624A (de)
EP (1) EP0385122B1 (de)
JP (1) JPH0737511B2 (de)
BR (1) BR9000981A (de)
CA (1) CA1334566C (de)
DE (1) DE69013945T2 (de)

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US5278010A (en) * 1989-03-03 1994-01-11 International Business Machines Corporation Composition for photo imaging
US5667934A (en) * 1990-10-09 1997-09-16 International Business Machines Corporation Thermally stable photoimaging composition
US5229251A (en) * 1991-04-29 1993-07-20 International Business Machines Corp. Dry developable photoresist containing an epoxide, organosilicon and onium salt
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US6268016B1 (en) 1996-06-28 2001-07-31 International Business Machines Corporation Manufacturing computer systems with fine line circuitized substrates
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US6022670A (en) * 1997-05-08 2000-02-08 International Business Machines Corporation Process for high resolution photoimageable dielectric
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US6388204B1 (en) 2000-08-29 2002-05-14 International Business Machines Corporation Composite laminate circuit structure and methods of interconnecting the same
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US6522014B1 (en) 2000-09-27 2003-02-18 International Business Machines Corporation Fabrication of a metalized blind via
US6558868B2 (en) 2001-02-16 2003-05-06 Brookhaven Science Associates, Llc Method of fabricating a high aspect ratio microstructure
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US20030138731A1 (en) * 2001-12-21 2003-07-24 Treliant Fang Photoresist formulation for high aspect ratio plating
EP1470449A1 (de) * 2002-01-31 2004-10-27 Scandinavian Micro Biodevices A/S Verfahren zur verbindung von einem bauteil an einer mikrostruktur durch lichtbestrahlung
US6608757B1 (en) * 2002-03-18 2003-08-19 International Business Machines Corporation Method for making a printed wiring board
US8053159B2 (en) 2003-11-18 2011-11-08 Honeywell International Inc. Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
GB0328683D0 (en) 2003-12-11 2004-01-14 Univ Birmingham Improved lithographic process
KR101065394B1 (ko) * 2004-01-09 2011-09-16 삼성에스디아이 주식회사 평판 표시소자의 전자방출원 형성용 조성물 및 그로부터제조되는 전자방출원
US20050260522A1 (en) * 2004-02-13 2005-11-24 William Weber Permanent resist composition, cured product thereof, and use thereof
CN1849560B (zh) * 2004-03-26 2011-12-07 东京応化工业株式会社 感光性树脂组合物及使用该组合物的图案形成方法
US7449280B2 (en) * 2004-05-26 2008-11-11 Microchem Corp. Photoimageable coating composition and composite article thereof
US7541265B2 (en) * 2005-01-10 2009-06-02 Endicott Interconnect Technologies, Inc. Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
US7025607B1 (en) * 2005-01-10 2006-04-11 Endicott Interconnect Technologies, Inc. Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
US7384856B2 (en) * 2005-01-10 2008-06-10 Endicott Interconnect Technologies, Inc. Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate
US7235745B2 (en) * 2005-01-10 2007-06-26 Endicott Interconnect Technologies, Inc. Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate
WO2006113805A2 (en) * 2005-04-19 2006-10-26 R.T. Vanderbilt Company, Inc. Topical polyurethane foam oxidative photooxidative stabilizer
US7827682B2 (en) * 2005-04-21 2010-11-09 Endicott Interconnect Technologies, Inc. Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner
US7332818B2 (en) * 2005-05-12 2008-02-19 Endicott Interconnect Technologies, Inc. Multi-chip electronic package with reduced line skew and circuitized substrate for use therein
US7253518B2 (en) * 2005-06-15 2007-08-07 Endicott Interconnect Technologies, Inc. Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same
US7342183B2 (en) * 2005-07-11 2008-03-11 Endicott Interconnect Technologies, Inc. Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same
US7334323B2 (en) * 2005-07-11 2008-02-26 Endicott Interconnect Technologies, Inc. Method of making mutilayered circuitized substrate assembly having sintered paste connections
US7897877B2 (en) * 2006-05-23 2011-03-01 Endicott Interconnect Technologies, Inc. Capacitive substrate
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US8557877B2 (en) 2009-06-10 2013-10-15 Honeywell International Inc. Anti-reflective coatings for optically transparent substrates
EP2539316B1 (de) 2010-02-24 2019-10-23 Basf Se Latente säuren und ihre verwendung
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JP2013183137A (ja) * 2012-03-05 2013-09-12 Denso Corp 回路基板及び回路部品を基板に搭載する方法
CN107207456B (zh) 2015-02-02 2021-05-04 巴斯夫欧洲公司 潜酸及其用途
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Also Published As

Publication number Publication date
EP0385122B1 (de) 1994-11-09
JPH0737511B2 (ja) 1995-04-26
JPH02279718A (ja) 1990-11-15
CA1334566C (en) 1995-02-28
EP0385122A1 (de) 1990-09-05
DE69013945T2 (de) 1995-05-24
BR9000981A (pt) 1991-02-19
US5026624A (en) 1991-06-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8330 Complete renunciation
8330 Complete renunciation