DE69010598D1 - Dickschicht-Substrat auf metallischer Grundlage mit hoher thermischer Leitfähigkeit. - Google Patents

Dickschicht-Substrat auf metallischer Grundlage mit hoher thermischer Leitfähigkeit.

Info

Publication number
DE69010598D1
DE69010598D1 DE69010598T DE69010598T DE69010598D1 DE 69010598 D1 DE69010598 D1 DE 69010598D1 DE 69010598 T DE69010598 T DE 69010598T DE 69010598 T DE69010598 T DE 69010598T DE 69010598 D1 DE69010598 D1 DE 69010598D1
Authority
DE
Germany
Prior art keywords
thick
thermal conductivity
high thermal
film substrate
metallic basis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69010598T
Other languages
English (en)
Other versions
DE69010598T2 (de
Inventor
Daniel R Blessington
Gary A Kneezel
Michael R Campanelli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Application granted granted Critical
Publication of DE69010598D1 publication Critical patent/DE69010598D1/de
Publication of DE69010598T2 publication Critical patent/DE69010598T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
DE69010598T 1989-09-05 1990-09-05 Dickschicht-Substrat auf metallischer Grundlage mit hoher thermischer Leitfähigkeit. Expired - Fee Related DE69010598T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/402,374 US5019675A (en) 1989-09-05 1989-09-05 Thick film substrate with highly thermally conductive metal base

Publications (2)

Publication Number Publication Date
DE69010598D1 true DE69010598D1 (de) 1994-08-18
DE69010598T2 DE69010598T2 (de) 1995-01-19

Family

ID=23591619

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69010598T Expired - Fee Related DE69010598T2 (de) 1989-09-05 1990-09-05 Dickschicht-Substrat auf metallischer Grundlage mit hoher thermischer Leitfähigkeit.

Country Status (4)

Country Link
US (1) US5019675A (de)
EP (1) EP0416898B1 (de)
JP (1) JPH03118161A (de)
DE (1) DE69010598T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5194877A (en) * 1991-05-24 1993-03-16 Hewlett-Packard Company Process for manufacturing thermal ink jet printheads having metal substrates and printheads manufactured thereby
US5901425A (en) 1996-08-27 1999-05-11 Topaz Technologies Inc. Inkjet print head apparatus
US6427597B1 (en) 2000-01-27 2002-08-06 Patrice M. Aurenty Method of controlling image resolution on a substrate
US8710523B2 (en) 2006-08-11 2014-04-29 E I Du Pont De Nemours And Company Device chip carriers, modules, and methods of forming thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3613230A (en) * 1969-04-29 1971-10-19 Bunker Ramo Method of fabricating coaxial circuitry
US4221925A (en) * 1978-09-18 1980-09-09 Western Electric Company, Incorporated Printed circuit board
JPS5635494A (en) * 1979-08-30 1981-04-08 Showa Denko Kk High heat transfer electric insulating substrate
GB2140460B (en) * 1983-05-27 1986-06-25 Dowty Electronics Ltd Insulated metal substrates
US4601777A (en) * 1985-04-03 1986-07-22 Xerox Corporation Thermal ink jet printhead and process therefor
DE3520945A1 (de) * 1985-06-12 1986-12-18 Anton Piller GmbH & Co KG, 3360 Osterode Traegerelement zur aufnahme elektrischer und/oder elektronischer bauteile und/oder schaltungen
US4786357A (en) * 1987-11-27 1988-11-22 Xerox Corporation Thermal ink jet printhead and fabrication method therefor
US4809428A (en) * 1987-12-10 1989-03-07 Hewlett-Packard Company Thin film device for an ink jet printhead and process for the manufacturing same

Also Published As

Publication number Publication date
EP0416898A3 (en) 1992-02-12
JPH03118161A (ja) 1991-05-20
DE69010598T2 (de) 1995-01-19
EP0416898A2 (de) 1991-03-13
US5019675A (en) 1991-05-28
EP0416898B1 (de) 1994-07-13

Similar Documents

Publication Publication Date Title
DE3587481T2 (de) Schaltungssubstrat mit hoher Wärmeleitfähigkeit.
DE69108185T2 (de) Adsorbent mit hoher Wärmeleitfähigkeit.
DE3887801D1 (de) Mit einer Wärmeabfuhrvorrichtung versehene gedruckte Schaltung.
BE871962A (fr) Substrat de circuit imprime a elements resistifs
DE69017664D1 (de) Thermodrucker.
DE69017668T2 (de) Thermodrucker.
DE69011778T2 (de) Bekleidung mit Schutzjacke.
DE69008963T2 (de) Elektronisches Schaltungssubstrat.
DE68923469D1 (de) Tintentropfen Überwachungsvorrichtung mit Temperaturausgleich.
DE69202410D1 (de) Anordnung mit positivem Temperaturkoeffizient.
DE69010034T2 (de) Halbleiteranordnung mit einer Schutzschaltung.
DE69000803D1 (de) Stromquelle mit niedrigem temperaturkoeffizient.
DE69015491T2 (de) Wärmeleitpaste mit Flüssigmetallmatrix.
DE3687389D1 (de) Hoch thermisch leitendes keramiksubstrat.
DE69020089D1 (de) Thermo-Drucker.
DE58907795D1 (de) Baugruppe mit einer Leiterplatte.
DE3783076T2 (de) Auf einer oberflaeche montierter hochlast widerstand.
DE3873214D1 (de) Steuerschaltung fuer thermisches drucken.
DE68908362T2 (de) Abbrechbares selbstregulierendes Heizelement für die Oberflächenmontagetechnik.
DE69023584D1 (de) Elektrische Kontaktsysteme mit Torsionsstab.
DE68911676T2 (de) Druckverfahren mit thermoschmelzender tinte.
DE69125437D1 (de) Halbleiteranordnung mit einer Temperaturfühlerschaltung
DE69106978D1 (de) Keramisches Substrat mit Silber enthaltender Verdrahtung.
DE69010598D1 (de) Dickschicht-Substrat auf metallischer Grundlage mit hoher thermischer Leitfähigkeit.
DE68914889T2 (de) Thermodruckverfahren.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee