DE69010444D1 - Anlage zur Herstellung von Schichten. - Google Patents
Anlage zur Herstellung von Schichten.Info
- Publication number
- DE69010444D1 DE69010444D1 DE69010444T DE69010444T DE69010444D1 DE 69010444 D1 DE69010444 D1 DE 69010444D1 DE 69010444 T DE69010444 T DE 69010444T DE 69010444 T DE69010444 T DE 69010444T DE 69010444 D1 DE69010444 D1 DE 69010444D1
- Authority
- DE
- Germany
- Prior art keywords
- plant
- layers
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/32238—Windows
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/357—Microwaves, e.g. electron cyclotron resonance enhanced sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1260297A JPH03122273A (ja) | 1989-10-06 | 1989-10-06 | マイクロ波を用いた成膜装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69010444D1 true DE69010444D1 (de) | 1994-08-11 |
DE69010444T2 DE69010444T2 (de) | 1994-10-27 |
Family
ID=17346087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69010444T Expired - Fee Related DE69010444T2 (de) | 1989-10-06 | 1990-10-02 | Anlage zur Herstellung von Schichten. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5074985A (de) |
EP (1) | EP0421348B1 (de) |
JP (1) | JPH03122273A (de) |
KR (1) | KR940000874B1 (de) |
DE (1) | DE69010444T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2824808B2 (ja) * | 1990-11-16 | 1998-11-18 | キヤノン株式会社 | マイクロ波プラズマcvd法による大面積の機能性堆積膜を連続的に形成する装置 |
JPH05109655A (ja) * | 1991-10-15 | 1993-04-30 | Applied Materials Japan Kk | Cvd−スパツタ装置 |
DE69306007T2 (de) * | 1992-01-30 | 1997-05-22 | Hitachi Ltd | Verfahren und Vorrichtung zur Plasmaerzeugung und Verfahren zur Halbleiter-Bearbeitung |
US5700326A (en) * | 1992-02-27 | 1997-12-23 | Canon Kabushiki Kaisha | Microwave plasma processing apparatus |
EP0578047B1 (de) * | 1992-06-23 | 1998-05-13 | Nippon Telegraph And Telephone Corporation | Plasmabearbeitungsgerät |
FR2693620B1 (fr) * | 1992-07-09 | 1994-10-07 | Valeo Vision | Appareil pour le dépôt d'un polymère par l'intermédiaire d'un plasma excité par micro-ondes. |
CH686254A5 (de) * | 1992-07-27 | 1996-02-15 | Balzers Hochvakuum | Verfahren zur Einstellung der Bearbeitungsratenverteilung sowie Aetz- oder Plasma-CVD-Anlage zu dessen Ausfuehrung. |
DE9313120U1 (de) * | 1993-09-01 | 1993-11-25 | Leybold Ag | Blende zur Vermeidung der Beschichtung von Vorrichtungsteilen und/oder Substratpartien während des Beschichtungsprozesses in der Vakuumkammer einer Sputteranlage |
JPH07169740A (ja) * | 1993-12-14 | 1995-07-04 | Nec Corp | マイクロ波プラズマ処理装置 |
DE69529775T2 (de) * | 1994-08-05 | 2003-10-16 | Ibm | Verfahren zur Herstellung einer Damaszenstruktur mit einer WGe Polierstoppschicht |
JP3164200B2 (ja) * | 1995-06-15 | 2001-05-08 | 住友金属工業株式会社 | マイクロ波プラズマ処理装置 |
JPH1081973A (ja) * | 1996-03-18 | 1998-03-31 | Hyundai Electron Ind Co Ltd | 誘導結合形プラズマcvd装置 |
US5961851A (en) * | 1996-04-02 | 1999-10-05 | Fusion Systems Corporation | Microwave plasma discharge device |
WO1999010913A1 (en) | 1997-08-26 | 1999-03-04 | Applied Materials, Inc. | An apparatus and method for allowing a stable power transmission into a plasma processing chamber |
US6051100A (en) * | 1997-10-24 | 2000-04-18 | International Business Machines Corporation | High conductance plasma containment structure |
JPH11319545A (ja) * | 1997-12-15 | 1999-11-24 | Canon Inc | プラズマ処理方法及び基体の処理方法 |
US6390019B1 (en) | 1998-06-11 | 2002-05-21 | Applied Materials, Inc. | Chamber having improved process monitoring window |
JP2003523072A (ja) * | 1998-07-29 | 2003-07-29 | アプライド マテリアルズ インコーポレイテッド | プラズマ処理チャンバ内への安定な電力伝達を可能にする方法 |
JP3496560B2 (ja) * | 1999-03-12 | 2004-02-16 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US6221202B1 (en) | 1999-04-01 | 2001-04-24 | International Business Machines Corporation | Efficient plasma containment structure |
US6831742B1 (en) | 2000-10-23 | 2004-12-14 | Applied Materials, Inc | Monitoring substrate processing using reflected radiation |
US6673199B1 (en) | 2001-03-07 | 2004-01-06 | Applied Materials, Inc. | Shaping a plasma with a magnetic field to control etch rate uniformity |
JP3870909B2 (ja) * | 2003-01-31 | 2007-01-24 | 株式会社島津製作所 | プラズマ処理装置 |
DE102004045046B4 (de) * | 2004-09-15 | 2007-01-04 | Schott Ag | Verfahren und Vorrichtung zum Aufbringen einer elektrisch leitfähigen transparenten Beschichtung auf ein Substrat |
CN106987827B (zh) * | 2017-04-14 | 2019-03-29 | 太原理工大学 | 等离子体化学气相沉积微波谐振腔及装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0616384B2 (ja) * | 1984-06-11 | 1994-03-02 | 日本電信電話株式会社 | マイクロ波イオン源 |
DE3566194D1 (en) * | 1984-08-31 | 1988-12-15 | Hitachi Ltd | Microwave assisting sputtering |
JPS62131511A (ja) * | 1985-12-04 | 1987-06-13 | Canon Inc | 微粒子の吹き付け装置 |
US4776918A (en) * | 1986-10-20 | 1988-10-11 | Hitachi, Ltd. | Plasma processing apparatus |
JP2569019B2 (ja) * | 1986-10-20 | 1997-01-08 | 株式会社日立製作所 | エッチング方法及びその装置 |
US4970435A (en) * | 1987-12-09 | 1990-11-13 | Tel Sagami Limited | Plasma processing apparatus |
US4952273A (en) * | 1988-09-21 | 1990-08-28 | Microscience, Inc. | Plasma generation in electron cyclotron resonance |
-
1989
- 1989-10-06 JP JP1260297A patent/JPH03122273A/ja active Pending
-
1990
- 1990-09-26 KR KR1019900015244A patent/KR940000874B1/ko not_active IP Right Cessation
- 1990-10-02 DE DE69010444T patent/DE69010444T2/de not_active Expired - Fee Related
- 1990-10-02 EP EP90118871A patent/EP0421348B1/de not_active Expired - Lifetime
- 1990-10-03 US US07/592,283 patent/US5074985A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5074985A (en) | 1991-12-24 |
JPH03122273A (ja) | 1991-05-24 |
KR910008871A (ko) | 1991-05-31 |
EP0421348B1 (de) | 1994-07-06 |
DE69010444T2 (de) | 1994-10-27 |
KR940000874B1 (ko) | 1994-02-03 |
EP0421348A1 (de) | 1991-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |