DE69007269T2 - Verfahren zur Prüfung der äusseren Form einer Lötzone. - Google Patents

Verfahren zur Prüfung der äusseren Form einer Lötzone.

Info

Publication number
DE69007269T2
DE69007269T2 DE69007269T DE69007269T DE69007269T2 DE 69007269 T2 DE69007269 T2 DE 69007269T2 DE 69007269 T DE69007269 T DE 69007269T DE 69007269 T DE69007269 T DE 69007269T DE 69007269 T2 DE69007269 T2 DE 69007269T2
Authority
DE
Germany
Prior art keywords
checking
procedure
outer shape
soldering zone
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69007269T
Other languages
English (en)
Other versions
DE69007269D1 (de
Inventor
Nobufumi Tokura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69007269D1 publication Critical patent/DE69007269D1/de
Application granted granted Critical
Publication of DE69007269T2 publication Critical patent/DE69007269T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
DE69007269T 1989-12-13 1990-12-12 Verfahren zur Prüfung der äusseren Form einer Lötzone. Expired - Fee Related DE69007269T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1323351A JPH0794972B2 (ja) 1989-12-13 1989-12-13 半田の外観検査方法

Publications (2)

Publication Number Publication Date
DE69007269D1 DE69007269D1 (de) 1994-04-14
DE69007269T2 true DE69007269T2 (de) 1994-07-07

Family

ID=18153820

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69007269T Expired - Fee Related DE69007269T2 (de) 1989-12-13 1990-12-12 Verfahren zur Prüfung der äusseren Form einer Lötzone.

Country Status (4)

Country Link
US (1) US5206705A (de)
EP (1) EP0436322B1 (de)
JP (1) JPH0794972B2 (de)
DE (1) DE69007269T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2711042B2 (ja) * 1992-03-30 1998-02-10 シャープ株式会社 クリーム半田の印刷状態検査装置
US5652658A (en) * 1993-10-19 1997-07-29 View Engineering, Inc. Grid array inspection system and method
WO1995024279A1 (fr) * 1994-03-10 1995-09-14 Ishikawa, Toshiharu Dispositif d'enlevement de pellicule
JP3335826B2 (ja) * 1995-12-05 2002-10-21 株式会社日立製作所 はんだバンプの測定装置
US6360935B1 (en) 1999-01-26 2002-03-26 Board Of Regents Of The University Of Texas System Apparatus and method for assessing solderability
DE29916075U1 (de) * 1999-09-13 2000-12-14 Siemens Ag Einrichtung zur Inspektion einer dreidimensionalen Oberflächenstruktur
JP4493421B2 (ja) * 2004-06-30 2010-06-30 株式会社リコー プリント回路基板検査装置とプリント回路基板組み立て検査ラインシステムおよびプログラム
KR101133976B1 (ko) * 2009-12-07 2012-04-05 주식회사 고영테크놀러지 3차원 검사방법 및 이를 이용한 3차원 검사장치
US9243726B2 (en) 2012-10-03 2016-01-26 Aarne H. Reid Vacuum insulated structure with end fitting and method of making same
KR101501914B1 (ko) 2012-11-12 2015-03-12 주식회사 고영테크놀러지 솔더 조인트 검사방법
US9463918B2 (en) 2014-02-20 2016-10-11 Aarne H. Reid Vacuum insulated articles and methods of making same
US10497908B2 (en) 2015-08-24 2019-12-03 Concept Group, Llc Sealed packages for electronic and energy storage devices
US10065256B2 (en) * 2015-10-30 2018-09-04 Concept Group Llc Brazing systems and methods
WO2017152045A1 (en) 2016-03-04 2017-09-08 Reid Aarne H Vacuum insulated articles with reflective material enhancement
EP3541722A4 (de) 2016-11-15 2020-07-08 Concept Group LLC Mehrlagenisolierte anordnungen
CN110770489B (zh) 2016-11-15 2022-03-01 概念集团有限责任公司 具有微孔绝热的增强的真空绝热制品
CN111465800B (zh) 2017-08-25 2022-03-01 概念集团有限责任公司 多几何形状和多材料隔热部件

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4674869A (en) * 1979-04-30 1987-06-23 Diffracto, Ltd. Method and apparatus for electro-optically determining dimension, location and altitude of objects
US4343553A (en) * 1979-09-03 1982-08-10 Hitachi, Ltd. Shape testing apparatus
US4650333A (en) * 1984-04-12 1987-03-17 International Business Machines Corporation System for measuring and detecting printed circuit wiring defects
JPS6022612A (ja) * 1984-06-28 1985-02-05 Matsushita Electric Ind Co Ltd 高さ検査装置
JPS61205808A (ja) * 1985-03-11 1986-09-12 Hitachi Ltd 形状検出装置
EP0209650A3 (de) * 1985-06-07 1989-07-05 Vanzetti Systems, Inc. Verfahren und Vorrichtung zum Anordnen und elektrischen Verbinden von Bauelementen auf einer Leiterplatte
JPS63177042A (ja) * 1987-01-19 1988-07-21 Nagoya Denki Kogyo Kk 実装済プリント基板自動検査装置における半田フヌレ検出方式
JPS63177045A (ja) * 1987-01-19 1988-07-21 Nagoya Denki Kogyo Kk 実装済プリント基板自動検査装置における半田フヌレ検出方式
US5011960A (en) * 1988-05-20 1991-04-30 Fujitsu Limited Wiring pattern detection method and apparatus
JPH01295109A (ja) * 1988-05-23 1989-11-28 Mitsubishi Electric Corp 光学式変位測定装置
JPH083472B2 (ja) * 1988-08-03 1996-01-17 松下電器産業株式会社 半田部の外観検査方法
JPH0739995B2 (ja) * 1988-08-03 1995-05-01 日本電気株式会社 半田付検査装置
EP0355377B1 (de) * 1988-08-05 1994-01-26 Siemens Aktiengesellschaft Verfahren zur optischen Prüfung von Flachbaugruppen
US4988202A (en) * 1989-06-28 1991-01-29 Westinghouse Electric Corp. Solder joint inspection system and method
US5064291A (en) * 1990-04-03 1991-11-12 Hughes Aircraft Company Method and apparatus for inspection of solder joints utilizing shape determination from shading

Also Published As

Publication number Publication date
EP0436322B1 (de) 1994-03-09
DE69007269D1 (de) 1994-04-14
EP0436322A2 (de) 1991-07-10
EP0436322A3 (en) 1991-11-06
US5206705A (en) 1993-04-27
JPH03183906A (ja) 1991-08-09
JPH0794972B2 (ja) 1995-10-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee