DE68925598D1 - Elektrische Schaltungsanordnung - Google Patents

Elektrische Schaltungsanordnung

Info

Publication number
DE68925598D1
DE68925598D1 DE68925598T DE68925598T DE68925598D1 DE 68925598 D1 DE68925598 D1 DE 68925598D1 DE 68925598 T DE68925598 T DE 68925598T DE 68925598 T DE68925598 T DE 68925598T DE 68925598 D1 DE68925598 D1 DE 68925598D1
Authority
DE
Germany
Prior art keywords
electrical circuit
circuit arrangement
arrangement
electrical
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68925598T
Other languages
English (en)
Other versions
DE68925598T2 (de
Inventor
Tetsuo Yoshizawa
Yoshimi Terayama
Hiroshi Kondo
Takashi Sakaki
Shunichi Haga
Yasuteru Ichida
Masaki Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63133396A external-priority patent/JPH01302830A/ja
Priority claimed from JP63133397A external-priority patent/JPH01302831A/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE68925598D1 publication Critical patent/DE68925598D1/de
Publication of DE68925598T2 publication Critical patent/DE68925598T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Wire Bonding (AREA)
DE68925598T 1988-05-31 1989-05-30 Elektrische Schaltungsanordnung Expired - Fee Related DE68925598T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63133396A JPH01302830A (ja) 1988-05-31 1988-05-31 電気回路装置
JP63133397A JPH01302831A (ja) 1988-05-31 1988-05-31 電気回路装置

Publications (2)

Publication Number Publication Date
DE68925598D1 true DE68925598D1 (de) 1996-03-21
DE68925598T2 DE68925598T2 (de) 1996-10-17

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DE68925598T Expired - Fee Related DE68925598T2 (de) 1988-05-31 1989-05-30 Elektrische Schaltungsanordnung

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5086558A (en) * 1990-09-13 1992-02-11 International Business Machines Corporation Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer
KR101025620B1 (ko) * 2009-07-13 2011-03-30 한국과학기술원 초음파 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4667219A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip interface
EP0284820A3 (de) * 1987-03-04 1989-03-08 Canon Kabushiki Kaisha Elektrisches Verbindungsteil und elektrisches Schaltungsteil und elektrische Schaltungsanordnung mit dem Verbindungsteil

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Publication number Publication date
EP0344719A2 (de) 1989-12-06
DE68925598T2 (de) 1996-10-17
EP0344719A3 (en) 1990-08-16
EP0344719B1 (de) 1996-02-07

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