DE68925922D1 - Elektrischer Schaltungsapparat - Google Patents
Elektrischer SchaltungsapparatInfo
- Publication number
- DE68925922D1 DE68925922D1 DE68925922T DE68925922T DE68925922D1 DE 68925922 D1 DE68925922 D1 DE 68925922D1 DE 68925922 T DE68925922 T DE 68925922T DE 68925922 T DE68925922 T DE 68925922T DE 68925922 D1 DE68925922 D1 DE 68925922D1
- Authority
- DE
- Germany
- Prior art keywords
- electrical circuit
- circuit apparatus
- electrical
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63133137A JPH01302735A (ja) | 1988-05-30 | 1988-05-30 | 電気回路装置 |
JP13313688A JPH01302734A (ja) | 1988-05-30 | 1988-05-30 | 電気回路装置 |
JP63133393A JP2513783B2 (ja) | 1988-05-31 | 1988-05-31 | 電気回路装置 |
JP63133394A JPH01302828A (ja) | 1988-05-31 | 1988-05-31 | 電気回路装置 |
JP63133392A JPH01302826A (ja) | 1988-05-31 | 1988-05-31 | 電気回路装置 |
JP63133391A JPH01302825A (ja) | 1988-05-31 | 1988-05-31 | 電気回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68925922D1 true DE68925922D1 (de) | 1996-04-18 |
DE68925922T2 DE68925922T2 (de) | 1996-09-05 |
Family
ID=27552809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68925922T Expired - Fee Related DE68925922T2 (de) | 1988-05-30 | 1989-05-30 | Elektrischer Schaltungsapparat |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0344702B1 (de) |
DE (1) | DE68925922T2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5140405A (en) * | 1990-08-30 | 1992-08-18 | Micron Technology, Inc. | Semiconductor assembly utilizing elastomeric single axis conductive interconnect |
DE69117891T2 (de) * | 1990-11-20 | 1996-07-25 | Sumitomo Electric Industries | Verfahren zum Montieren von Halbleiterelementen |
EP0547807A3 (en) * | 1991-12-16 | 1993-09-22 | General Electric Company | Packaged electronic system |
EP0560072A3 (de) * | 1992-03-13 | 1993-10-06 | Nitto Denko Corporation | Anisotropisch-elektroleitende Klebe-Schicht und diese verwendende Verbindungsstruktur |
US5587882A (en) * | 1995-08-30 | 1996-12-24 | Hewlett-Packard Company | Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate |
FR2766967A1 (fr) * | 1997-07-31 | 1999-02-05 | Scps | Dispositif de dissipation thermique et/ou protection electromagnetique pour cartes et composants electroniques |
FR2877142B1 (fr) * | 2004-10-21 | 2007-05-11 | Commissariat Energie Atomique | Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere. |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4417777A (en) * | 1981-10-13 | 1983-11-29 | Molex Incorporated | Integrated circuit carrier assembly |
KR900001273B1 (ko) * | 1983-12-23 | 1990-03-05 | 후지쑤 가부시끼가이샤 | 반도체 집적회로 장치 |
US4597617A (en) * | 1984-03-19 | 1986-07-01 | Tektronix, Inc. | Pressure interconnect package for integrated circuits |
JPS6292342A (ja) * | 1985-10-17 | 1987-04-27 | Mitsubishi Electric Corp | 表面実装用半導体パツケ−ジ |
AU598253B2 (en) * | 1986-05-07 | 1990-06-21 | Digital Equipment Corporation | System for detachably mounting semi-conductors on conductor substrates |
EP0854506A3 (de) * | 1987-03-04 | 1999-03-31 | Canon Kabushiki Kaisha | Elektrisches Verbindungsteil und elektrisches Schaltungsteil |
US4926241A (en) * | 1988-02-19 | 1990-05-15 | Microelectronics And Computer Technology Corporation | Flip substrate for chip mount |
-
1989
- 1989-05-30 EP EP89109709A patent/EP0344702B1/de not_active Expired - Lifetime
- 1989-05-30 DE DE68925922T patent/DE68925922T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE68925922T2 (de) | 1996-09-05 |
EP0344702A2 (de) | 1989-12-06 |
EP0344702A3 (en) | 1990-07-25 |
EP0344702B1 (de) | 1996-03-13 |
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Legal Events
Date | Code | Title | Description |
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8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |