DE68923512D1 - Gitterartige Steckerstift-Anordnung für einen paketförmigen integrierten Schaltkreis. - Google Patents
Gitterartige Steckerstift-Anordnung für einen paketförmigen integrierten Schaltkreis.Info
- Publication number
- DE68923512D1 DE68923512D1 DE68923512T DE68923512T DE68923512D1 DE 68923512 D1 DE68923512 D1 DE 68923512D1 DE 68923512 T DE68923512 T DE 68923512T DE 68923512 T DE68923512 T DE 68923512T DE 68923512 D1 DE68923512 D1 DE 68923512D1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- pin ends
- terminal pin
- integrated circuit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/245,501 US4916523A (en) | 1988-09-19 | 1988-09-19 | Electrical connections via unidirectional conductive elastomer for pin carrier outside lead bond |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68923512D1 true DE68923512D1 (de) | 1995-08-24 |
DE68923512T2 DE68923512T2 (de) | 1996-03-07 |
Family
ID=22926927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68923512T Expired - Fee Related DE68923512T2 (de) | 1988-09-19 | 1989-09-12 | Gitterartige Steckerstift-Anordnung für einen paketförmigen integrierten Schaltkreis. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4916523A (de) |
EP (1) | EP0360485B1 (de) |
JP (1) | JP2711263B2 (de) |
AT (1) | ATE125395T1 (de) |
DE (1) | DE68923512T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3824654A1 (de) * | 1988-07-20 | 1990-02-01 | Ibm Deutschland | Elektronische baueinheit |
US5338975A (en) * | 1990-07-02 | 1994-08-16 | General Electric Company | High density interconnect structure including a spacer structure and a gap |
US5431328A (en) * | 1994-05-06 | 1995-07-11 | Industrial Technology Research Institute | Composite bump flip chip bonding |
US5393697A (en) * | 1994-05-06 | 1995-02-28 | Industrial Technology Research Institute | Composite bump structure and methods of fabrication |
US6365500B1 (en) | 1994-05-06 | 2002-04-02 | Industrial Technology Research Institute | Composite bump bonding |
US5707902A (en) * | 1995-02-13 | 1998-01-13 | Industrial Technology Research Institute | Composite bump structure and methods of fabrication |
TW441227B (en) | 1995-05-26 | 2001-06-16 | E Tec Ag | Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board |
WO1996038030A1 (en) * | 1995-05-26 | 1996-11-28 | E-Tec Ag | Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board |
US6007348A (en) * | 1996-05-07 | 1999-12-28 | Advanced Intercommunications Corporation | Solder ball terminal |
CH693478A5 (fr) | 1996-05-10 | 2003-08-15 | E Tec Ag | Socle de connexion de deux composants électriques. |
JP3420435B2 (ja) * | 1996-07-09 | 2003-06-23 | 松下電器産業株式会社 | 基板の製造方法、半導体装置及び半導体装置の製造方法 |
SG71046A1 (en) | 1996-10-10 | 2000-03-21 | Connector Systems Tech Nv | High density connector and method of manufacture |
US6703640B1 (en) * | 1998-01-20 | 2004-03-09 | Micron Technology, Inc. | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching |
US6456100B1 (en) * | 1998-01-20 | 2002-09-24 | Micron Technology, Inc. | Apparatus for attaching to a semiconductor |
US6166908A (en) * | 1999-10-01 | 2000-12-26 | Intel Corporation | Integrated circuit cartridge |
US6256199B1 (en) | 1999-10-01 | 2001-07-03 | Intel Corporation | Integrated circuit cartridge and method of fabricating the same |
US6256202B1 (en) | 2000-02-18 | 2001-07-03 | Advanced Interconnections Corporation | Integrated circuit intercoupling component with heat sink |
US6367263B1 (en) | 2000-05-31 | 2002-04-09 | Intel Corporation | Integrated circuit refrigeration device |
US7411337B2 (en) * | 2001-11-16 | 2008-08-12 | Intel Corporation | Electrical energy-generating system and devices and methods related thereto |
SG157957A1 (en) * | 2003-01-29 | 2010-01-29 | Interplex Qlp Inc | Package for integrated circuit die |
US7939934B2 (en) * | 2005-03-16 | 2011-05-10 | Tessera, Inc. | Microelectronic packages and methods therefor |
DE102006045928A1 (de) * | 2006-09-28 | 2008-04-03 | Robert Bosch Gmbh | Anschlusssystem mit außenliegender Leitungsführung an Wischermotorgehäusen |
US8254142B2 (en) * | 2009-09-22 | 2012-08-28 | Wintec Industries, Inc. | Method of using conductive elastomer for electrical contacts in an assembly |
US8593825B2 (en) * | 2009-10-14 | 2013-11-26 | Wintec Industries, Inc. | Apparatus and method for vertically-structured passive components |
US10103463B1 (en) | 2017-09-28 | 2018-10-16 | ColdQuanta, Inc. | In-place clamping of pin-grid array |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE756130A (fr) * | 1969-09-15 | 1971-03-15 | Essex International Inc | Combinaison interrupteur-coupe-circuit sensible a la pression |
JPS5915376B2 (ja) * | 1977-10-18 | 1984-04-09 | 信越ポリマ−株式会社 | 電子回路部品 |
US4616406A (en) * | 1984-09-27 | 1986-10-14 | Advanced Micro Devices, Inc. | Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein |
JPH0773117B2 (ja) * | 1986-11-25 | 1995-08-02 | 株式会社東芝 | 半導体パッケ−ジ |
JPH114361A (ja) * | 1997-06-13 | 1999-01-06 | Hitachi Ltd | 画像情報処理方法とそれを利用したディジタル撮像装置 |
-
1988
- 1988-09-19 US US07/245,501 patent/US4916523A/en not_active Expired - Lifetime
-
1989
- 1989-09-12 AT AT89309262T patent/ATE125395T1/de not_active IP Right Cessation
- 1989-09-12 DE DE68923512T patent/DE68923512T2/de not_active Expired - Fee Related
- 1989-09-12 EP EP89309262A patent/EP0360485B1/de not_active Expired - Lifetime
- 1989-09-14 JP JP1239758A patent/JP2711263B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0360485B1 (de) | 1995-07-19 |
JPH02122557A (ja) | 1990-05-10 |
US4916523A (en) | 1990-04-10 |
JP2711263B2 (ja) | 1998-02-10 |
ATE125395T1 (de) | 1995-08-15 |
DE68923512T2 (de) | 1996-03-07 |
EP0360485A3 (de) | 1991-07-17 |
EP0360485A2 (de) | 1990-03-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |