DE68920853D1 - Verfahren für das Wachstum von epitaxialen Schichten. - Google Patents
Verfahren für das Wachstum von epitaxialen Schichten.Info
- Publication number
- DE68920853D1 DE68920853D1 DE68920853T DE68920853T DE68920853D1 DE 68920853 D1 DE68920853 D1 DE 68920853D1 DE 68920853 T DE68920853 T DE 68920853T DE 68920853 T DE68920853 T DE 68920853T DE 68920853 D1 DE68920853 D1 DE 68920853D1
- Authority
- DE
- Germany
- Prior art keywords
- growth
- epitaxial layers
- epitaxial
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02463—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02505—Layer structure consisting of more than two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2238—Buried stripe structure with a terraced structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
- H01S5/3203—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth on non-planar substrates to create thickness or compositional variations
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63301256A JP2641540B2 (ja) | 1988-11-28 | 1988-11-28 | エピタキシャル結晶層形成方法及びストライプ型半導体レーザの製造方法 |
JP30125788A JP2806951B2 (ja) | 1988-11-28 | 1988-11-28 | ストライプ型半導体レーザの製造方法 |
JP30125588A JP2641539B2 (ja) | 1988-11-28 | 1988-11-28 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68920853D1 true DE68920853D1 (de) | 1995-03-09 |
DE68920853T2 DE68920853T2 (de) | 1995-05-24 |
Family
ID=27338446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68920853T Expired - Fee Related DE68920853T2 (de) | 1988-11-28 | 1989-11-24 | Verfahren für das Wachstum von epitaxialen Schichten. |
Country Status (3)
Country | Link |
---|---|
US (1) | US5476811A (de) |
EP (1) | EP0377281B1 (de) |
DE (1) | DE68920853T2 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9013859D0 (en) * | 1990-06-21 | 1990-08-15 | Ici Plc | Zeolites |
JPH0897147A (ja) * | 1994-09-29 | 1996-04-12 | Mitsubishi Electric Corp | エピタキシャル結晶成長装置 |
JPH08116135A (ja) * | 1994-10-17 | 1996-05-07 | Mitsubishi Electric Corp | 導波路集積素子の製造方法,及び導波路集積素子 |
JP3755090B2 (ja) * | 1995-06-14 | 2006-03-15 | 三菱電機株式会社 | 半導体装置の製造方法,及び半導体装置 |
JP3171307B2 (ja) * | 1995-06-26 | 2001-05-28 | 富士通株式会社 | 半導体レーザ装置及びその製造方法 |
JP3062065B2 (ja) * | 1995-10-20 | 2000-07-10 | 日本電気株式会社 | 半導体装置の製造方法 |
US6695913B1 (en) | 1997-07-10 | 2004-02-24 | Sharp Kabushiki Kaisha | III-Nitride optoelectronic semiconductor device containing lattice mismatched III-Nitride semiconductor materials |
GB2327145A (en) * | 1997-07-10 | 1999-01-13 | Sharp Kk | Graded layers in an optoelectronic semiconductor device |
JP3420028B2 (ja) * | 1997-07-29 | 2003-06-23 | 株式会社東芝 | GaN系化合物半導体素子の製造方法 |
DE69937042T2 (de) * | 1998-09-11 | 2008-05-29 | Japan Science And Technology Agency, Kawaguchi | Kombinatorische vorrichtung für epitaktische molekularschicht |
US6707074B2 (en) * | 2000-07-04 | 2004-03-16 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-emitting device and apparatus for driving the same |
US6391748B1 (en) | 2000-10-03 | 2002-05-21 | Texas Tech University | Method of epitaxial growth of high quality nitride layers on silicon substrates |
US7541067B2 (en) * | 2006-04-13 | 2009-06-02 | Solopower, Inc. | Method and apparatus for continuous processing of buffer layers for group IBIIIAVIA solar cells |
WO2007121383A2 (en) * | 2006-04-13 | 2007-10-25 | Solopower, Inc. | Method and apparatus to form thin layers of materials on a base |
US7923281B2 (en) * | 2006-04-13 | 2011-04-12 | Solopower, Inc. | Roll-to-roll processing method and tools for electroless deposition of thin layers |
US7943959B2 (en) * | 2007-08-28 | 2011-05-17 | Littelfuse, Inc. | Low capacitance semiconductor device |
US7638816B2 (en) * | 2007-08-28 | 2009-12-29 | Littelfuse, Inc. | Epitaxial surge protection device |
WO2009029954A2 (en) * | 2007-09-01 | 2009-03-05 | Yann Roussillon | Improved solution deposition assembly |
EP2206141A4 (de) * | 2007-10-17 | 2012-10-10 | Yann Roussillon | Anordnung zur verbesserten ablagerung einer lösung |
US7720342B2 (en) * | 2008-04-15 | 2010-05-18 | Hewlett-Packard Development Company, L.P. | Optical device with a graded bandgap structure and methods of making and using the same |
US8497152B2 (en) * | 2009-05-12 | 2013-07-30 | Solopower, Inc. | Roll-to-roll processing method and tools for electroless deposition of thin layers |
JP6485382B2 (ja) * | 2016-02-23 | 2019-03-20 | 株式会社デンソー | 化合物半導体装置の製造方法および化合物半導体装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4613387A (en) * | 1983-02-28 | 1986-09-23 | Itt Industries Inc. | Injection laser manufacture |
US4636268A (en) * | 1984-11-30 | 1987-01-13 | At&T Bell Laboratories | Chemical beam deposition method utilizing alkyl compounds in a carrier gas |
GB8518353D0 (en) * | 1985-07-20 | 1985-08-29 | Plessey Co Plc | Heterostructure device |
US4839307A (en) * | 1986-05-14 | 1989-06-13 | Omron Tateisi Electronics Co. | Method of manufacturing a stripe-shaped heterojunction laser with unique current confinement |
EP0261262B1 (de) * | 1986-09-23 | 1992-06-17 | International Business Machines Corporation | Streifenlaser mit transversalem Übergang |
US4785457A (en) * | 1987-05-11 | 1988-11-15 | Rockwell International Corporation | Heterostructure semiconductor laser |
-
1989
- 1989-11-24 EP EP89312248A patent/EP0377281B1/de not_active Expired - Lifetime
- 1989-11-24 DE DE68920853T patent/DE68920853T2/de not_active Expired - Fee Related
-
1995
- 1995-03-23 US US08/409,944 patent/US5476811A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5476811A (en) | 1995-12-19 |
EP0377281B1 (de) | 1995-01-25 |
DE68920853T2 (de) | 1995-05-24 |
EP0377281A1 (de) | 1990-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |