DE68919290D1 - Nasssätzung von ausgehärteten Polyimiden. - Google Patents
Nasssätzung von ausgehärteten Polyimiden.Info
- Publication number
- DE68919290D1 DE68919290D1 DE68919290T DE68919290T DE68919290D1 DE 68919290 D1 DE68919290 D1 DE 68919290D1 DE 68919290 T DE68919290 T DE 68919290T DE 68919290 T DE68919290 T DE 68919290T DE 68919290 D1 DE68919290 D1 DE 68919290D1
- Authority
- DE
- Germany
- Prior art keywords
- polyimides
- hardened
- wet etching
- etching
- wet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004642 Polyimide Substances 0.000 title 1
- 229920001721 polyimide Polymers 0.000 title 1
- 238000001039 wet etching Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Medicinal Chemistry (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/218,384 US4846929A (en) | 1988-07-13 | 1988-07-13 | Wet etching of thermally or chemically cured polyimide |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68919290D1 true DE68919290D1 (de) | 1994-12-15 |
DE68919290T2 DE68919290T2 (de) | 1995-05-24 |
Family
ID=22814887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68919290T Expired - Fee Related DE68919290T2 (de) | 1988-07-13 | 1989-07-03 | Nasssätzung von ausgehärteten Polyimiden. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4846929A (de) |
EP (1) | EP0351622B1 (de) |
JP (1) | JPH0719062B2 (de) |
DE (1) | DE68919290T2 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5167992A (en) * | 1991-03-11 | 1992-12-01 | Microelectronics And Computer Technology Corporation | Selective electroless plating process for metal conductors |
US5268260A (en) * | 1991-10-22 | 1993-12-07 | International Business Machines Corporation | Photoresist develop and strip solvent compositions and method for their use |
US5227008A (en) * | 1992-01-23 | 1993-07-13 | Minnesota Mining And Manufacturing Company | Method for making flexible circuits |
US5242864A (en) * | 1992-06-05 | 1993-09-07 | Intel Corporation | Polyimide process for protecting integrated circuits |
US5264248A (en) * | 1992-08-03 | 1993-11-23 | General Electric Company | Adhesion of metal coatings of polypyromellitimides |
US5350487A (en) * | 1993-05-03 | 1994-09-27 | Ameen Thomas J | Method of etching polyimide |
US5691876A (en) * | 1995-01-31 | 1997-11-25 | Applied Materials, Inc. | High temperature polyimide electrostatic chuck |
US6106907A (en) * | 1996-06-25 | 2000-08-22 | Canon Kabushiki Kaisha | Electrode plate, liquid crystal device and production thereof |
US6221567B1 (en) | 1998-01-14 | 2001-04-24 | Fujitsu Limited | Method of patterning polyamic acid layers |
US6159666A (en) * | 1998-01-14 | 2000-12-12 | Fijitsu Limited | Environmentally friendly removal of photoresists used in wet etchable polyimide processes |
US6211468B1 (en) | 1998-08-12 | 2001-04-03 | 3M Innovative Properties Company | Flexible circuit with conductive vias having off-set axes |
US6923919B2 (en) * | 2000-07-18 | 2005-08-02 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
TW463283B (en) * | 2000-11-03 | 2001-11-11 | Mosel Vitelic Inc | Inspection method of photolithography process for power transistor processing |
US7226806B2 (en) * | 2001-02-16 | 2007-06-05 | Dai Nippon Printing Co., Ltd. | Wet etched insulator and electronic circuit component |
US6780783B2 (en) * | 2001-08-29 | 2004-08-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of wet etching low dielectric constant materials |
FR2967296B1 (fr) | 2010-11-05 | 2018-05-25 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Elements de connexion pour l'hybridation de circuits electroniques |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3758388A (en) * | 1971-05-13 | 1973-09-11 | J Shotton | Electroplating plastics |
DE2541624C2 (de) * | 1975-09-18 | 1982-09-16 | Ibm Deutschland Gmbh, 7000 Stuttgart | Wässrige Ätzlösung und Verfahren zum Ätzen von Polymerfilmen oder Folien auf Polyimidbasis |
JPS5353401A (en) * | 1976-10-22 | 1978-05-15 | Hitachi Ltd | Photoetching of polyimide synthetic resin film |
JPS55129350A (en) * | 1979-03-28 | 1980-10-07 | Mitsui Mining & Smelting Co Ltd | Letterpress plate and manufacture thereof |
US4369090A (en) * | 1980-11-06 | 1983-01-18 | Texas Instruments Incorporated | Process for etching sloped vias in polyimide insulators |
US4353778A (en) * | 1981-09-04 | 1982-10-12 | International Business Machines Corporation | Method of etching polyimide |
JPS5896632A (ja) * | 1981-12-02 | 1983-06-08 | Sumitomo Bakelite Co Ltd | ポリイミド系樹脂のエツチング方法 |
US4426253A (en) * | 1981-12-03 | 1984-01-17 | E. I. Du Pont De Nemours & Co. | High speed etching of polyimide film |
US4624740A (en) * | 1985-01-22 | 1986-11-25 | International Business Machines Corporation | Tailoring of via-hole sidewall slope |
US4606998A (en) * | 1985-04-30 | 1986-08-19 | International Business Machines Corporation | Barrierless high-temperature lift-off process |
EP0227746A4 (de) * | 1985-06-24 | 1987-10-06 | Enthone | Verfahren zur bearbeitung der oberfläche von kunststoffoberflächen vor der metallplattierung. |
US4639290A (en) * | 1985-12-09 | 1987-01-27 | Hughes Aircraft Company | Methods for selectively removing adhesives from polyimide substrates |
US4775449A (en) * | 1986-12-29 | 1988-10-04 | General Electric Company | Treatment of a polyimide surface to improve the adhesion of metal deposited thereon |
-
1988
- 1988-07-13 US US07/218,384 patent/US4846929A/en not_active Expired - Fee Related
-
1989
- 1989-06-13 JP JP1148561A patent/JPH0719062B2/ja not_active Expired - Lifetime
- 1989-07-03 EP EP89112091A patent/EP0351622B1/de not_active Expired - Lifetime
- 1989-07-03 DE DE68919290T patent/DE68919290T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4846929A (en) | 1989-07-11 |
EP0351622A2 (de) | 1990-01-24 |
EP0351622A3 (en) | 1990-06-27 |
JPH0248666A (ja) | 1990-02-19 |
JPH0719062B2 (ja) | 1995-03-06 |
DE68919290T2 (de) | 1995-05-24 |
EP0351622B1 (de) | 1994-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |