DE68915543D1 - Lötmittelauflegevorrichtung. - Google Patents

Lötmittelauflegevorrichtung.

Info

Publication number
DE68915543D1
DE68915543D1 DE68915543T DE68915543T DE68915543D1 DE 68915543 D1 DE68915543 D1 DE 68915543D1 DE 68915543 T DE68915543 T DE 68915543T DE 68915543 T DE68915543 T DE 68915543T DE 68915543 D1 DE68915543 D1 DE 68915543D1
Authority
DE
Germany
Prior art keywords
solder
arms
application device
line
solder application
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68915543T
Other languages
English (en)
Other versions
DE68915543T2 (de
Inventor
Inho Myong
Richard Freimanis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Corp
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Corp filed Critical Raychem Corp
Publication of DE68915543D1 publication Critical patent/DE68915543D1/de
Application granted granted Critical
Publication of DE68915543T2 publication Critical patent/DE68915543T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
DE68915543T 1988-06-01 1989-06-01 Lötmittelauflegevorrichtung. Expired - Fee Related DE68915543T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/200,998 US4807799A (en) 1988-06-01 1988-06-01 Device for applying solder
PCT/US1989/002392 WO1989011940A1 (en) 1988-06-01 1989-06-01 Device for applying solder

Publications (2)

Publication Number Publication Date
DE68915543D1 true DE68915543D1 (de) 1994-06-30
DE68915543T2 DE68915543T2 (de) 1995-01-05

Family

ID=22744058

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68915543T Expired - Fee Related DE68915543T2 (de) 1988-06-01 1989-06-01 Lötmittelauflegevorrichtung.

Country Status (8)

Country Link
US (1) US4807799A (de)
EP (1) EP0409906B1 (de)
JP (1) JPH03504574A (de)
KR (1) KR900701458A (de)
AT (1) ATE106031T1 (de)
CA (1) CA1317758C (de)
DE (1) DE68915543T2 (de)
WO (1) WO1989011940A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106102987A (zh) * 2014-03-19 2016-11-09 Few汽车电器厂有限责任两合公司 用于对金属的或金属化的织物软管均匀覆层的方法和设备

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040717A (en) * 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
US5360158A (en) * 1993-07-15 1994-11-01 The S.A. Day Mfg. Co., Inc. Method for joining aluminum alloy tubes
WO2001022785A1 (en) * 1999-09-20 2001-03-29 Nas Interplex Industries Inc. Solder-bearing wafer for use in soldering operations
US6900393B1 (en) 1999-09-20 2005-05-31 Teka Interconnections Systems, Inc. Solder-bearing wafer for use in soldering operations
US7754979B2 (en) * 1999-09-20 2010-07-13 Teka Interconnections Systems, Inc. Solder-bearing wafer for use in soldering operations

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2018810A1 (de) * 1970-04-20 1971-11-04 Rau Fa G Lötschablone und Herstellungsverfahren hierzu
SU625890A1 (ru) * 1977-04-15 1978-09-30 Киевский Ордена Ленина Политехнический Институт Им.50-Летия Великой Октябрьской Социалистической Революции Прижим дл сварки
SU698741A1 (ru) * 1978-01-16 1979-11-25 Киевский Ордена Ленина Политехнический Институт Им.50-Летия Великой Октябрьской Социалистической Революции Прижим дл сварки тонколистовых изделий
EP0081389B1 (de) * 1981-12-08 1986-09-03 RAYCHEM CORPORATION (a California corporation) Anordnung zur Verbinden elektrischer Leitungen
SU1021544A1 (ru) * 1982-01-21 1983-06-07 Научно-Производственное Объединение По Технологии Машиностроения "Цниитмаш" Способ изготовлени образца дл исследовани свойств сварного соединени
JPS61985A (ja) * 1984-06-12 1986-01-06 Nec Corp マイクロフロツピ−デイスク装置
US4728022A (en) * 1986-09-19 1988-03-01 Hughes Aircraft Company Mask and solder form

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106102987A (zh) * 2014-03-19 2016-11-09 Few汽车电器厂有限责任两合公司 用于对金属的或金属化的织物软管均匀覆层的方法和设备

Also Published As

Publication number Publication date
KR900701458A (ko) 1990-12-03
EP0409906A1 (de) 1991-01-30
DE68915543T2 (de) 1995-01-05
JPH03504574A (ja) 1991-10-09
CA1317758C (en) 1993-05-18
US4807799A (en) 1989-02-28
ATE106031T1 (de) 1994-06-15
EP0409906B1 (de) 1994-05-25
WO1989011940A1 (en) 1989-12-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee