DE68913666T2 - Selbstregulierendes Heizelement mit wärmeleitenden Verlängerungen. - Google Patents

Selbstregulierendes Heizelement mit wärmeleitenden Verlängerungen.

Info

Publication number
DE68913666T2
DE68913666T2 DE68913666T DE68913666T DE68913666T2 DE 68913666 T2 DE68913666 T2 DE 68913666T2 DE 68913666 T DE68913666 T DE 68913666T DE 68913666 T DE68913666 T DE 68913666T DE 68913666 T2 DE68913666 T2 DE 68913666T2
Authority
DE
Germany
Prior art keywords
self
heating element
thermally conductive
regulating heating
conductive extensions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68913666T
Other languages
English (en)
Other versions
DE68913666D1 (de
Inventor
Homer Ernst Henschen
Michael John Mckee
Joseph Michael Pawlikowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Application granted granted Critical
Publication of DE68913666D1 publication Critical patent/DE68913666D1/de
Publication of DE68913666T2 publication Critical patent/DE68913666T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0475—Heating appliances electric using induction effects, e.g. Kelvin or skin effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0242—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections comprising means for controlling the temperature, e.g. making use of the curie point
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Dermatology (AREA)
  • General Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Resistance Heating (AREA)
  • Multi-Conductor Connections (AREA)
DE68913666T 1988-11-29 1989-11-10 Selbstregulierendes Heizelement mit wärmeleitenden Verlängerungen. Expired - Fee Related DE68913666T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/277,116 US5059756A (en) 1988-11-29 1988-11-29 Self regulating temperature heater with thermally conductive extensions

Publications (2)

Publication Number Publication Date
DE68913666D1 DE68913666D1 (de) 1994-04-14
DE68913666T2 true DE68913666T2 (de) 1994-09-15

Family

ID=23059464

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68913666T Expired - Fee Related DE68913666T2 (de) 1988-11-29 1989-11-10 Selbstregulierendes Heizelement mit wärmeleitenden Verlängerungen.

Country Status (6)

Country Link
US (1) US5059756A (de)
EP (1) EP0371646B1 (de)
JP (1) JP2719970B2 (de)
KR (1) KR0155358B1 (de)
CA (1) CA1310137C (de)
DE (1) DE68913666T2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421752A (en) * 1989-07-31 1995-06-06 The Whitaker Corporation Method of making a pin grid array and terminal for use therein
US5227596A (en) * 1990-10-22 1993-07-13 Metcal, Inc. Self regulating connecting device containing fusible material
JP2807748B2 (ja) * 1990-12-21 1998-10-08 アンプ インコーポレイテッド 電気コネクタの組立方法及びそれに使用するはんだ付リードフレーム
US5279028A (en) * 1993-04-30 1994-01-18 The Whitaker Corporation Method of making a pin grid array and terminal for use therein
US5288959A (en) * 1993-04-30 1994-02-22 The Whitaker Corporation Device for electrically interconnecting opposed contact arrays
US5357074A (en) * 1993-08-17 1994-10-18 The Whitaker Corporation Electrical interconnection device
US5357084A (en) * 1993-11-15 1994-10-18 The Whitaker Corporation Device for electrically interconnecting contact arrays
US5605477A (en) * 1995-01-13 1997-02-25 The Whitaker Corporation Flexible etched circuit assembly
US6226862B1 (en) 1998-04-30 2001-05-08 Sheldahl, Inc. Method for manufacturing printed circuit board assembly
KR100284738B1 (ko) * 1998-09-04 2001-04-02 윤종용 다층금속배선을갖는반도체소자의패드및그제조방법
US6271507B2 (en) 1999-10-08 2001-08-07 Molex Incorporated Apparatus and method for bonding conductors
DE10050798C1 (de) 2000-10-13 2002-04-04 Daimler Chrysler Ag Verfahrn zum Verbinden von flachen Folienkabeln
JP2003229186A (ja) * 2002-01-31 2003-08-15 Denso Corp 電子装置
US7120353B2 (en) * 2002-02-20 2006-10-10 Schaeffer Bernarr C Infrared sauna
US6843666B2 (en) * 2002-06-14 2005-01-18 Tektronix, Inc. Method and apparatus for installing a surface mount connector on a printed circuit board
US20030234470A1 (en) * 2002-06-20 2003-12-25 Haan Stephen F. Embossing apparatus, method of use thereof and resulting article
US20040112935A1 (en) * 2002-12-16 2004-06-17 Visteon Global Technologies, Inc. Integrated flex substrate metallurgical bonding
US6921880B2 (en) * 2003-04-04 2005-07-26 Constance F. Berger Apparatus for heating bottles and method of manufacturing same
JP2006140052A (ja) * 2004-11-12 2006-06-01 Three M Innovative Properties Co 熱硬化性接着フィルム付きコネクタ及びそれを用いた接続方法
US7256364B2 (en) * 2004-12-21 2007-08-14 Remy International, Inc. Method for simultaneous resistance brazing of adjacent conductor joints
CN100411498C (zh) * 2005-11-25 2008-08-13 惠州Tcl移动通信有限公司 一种fpc与pcb的组件
CN101856758B (zh) * 2010-05-28 2012-02-01 河海大学常州校区 硬质合金钢制件与45钢制件的焊接方法
US10631372B2 (en) * 2015-04-24 2020-04-21 Guanping Feng Low-power electro-thermal film devices and methods for making the same
CN109687186B (zh) * 2019-01-15 2020-08-28 番禺得意精密电子工业有限公司 连接结构及电连接器制造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3396894A (en) * 1965-05-11 1968-08-13 Raychem Corp Solder device
US3719981A (en) * 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
US3750252A (en) * 1972-05-01 1973-08-07 Du Pont Solder terminal strip
DE2620619C2 (de) * 1976-05-10 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Verfahren und Vorrichtung zum automatischen Lötkontaktieren von Anschlußdrähten mit den Anschlußfahnen von elektrischen Bauteilen
US4256945A (en) * 1979-08-31 1981-03-17 Iris Associates Alternating current electrically resistive heating element having intrinsic temperature control
US4701587A (en) * 1979-08-31 1987-10-20 Metcal, Inc. Shielded heating element having intrinsic temperature control
US4354629A (en) * 1980-06-09 1982-10-19 Raychem Corporation Solder delivery system
US4695713A (en) * 1982-09-30 1987-09-22 Metcal, Inc. Autoregulating, electrically shielded heater
EP0127680B1 (de) * 1982-12-01 1988-09-07 Metcal Inc. Verbinder mit schmelzeinsatz und innerer temperatursteuerung
US4717814A (en) * 1983-06-27 1988-01-05 Metcal, Inc. Slotted autoregulating heater
US4623401A (en) * 1984-03-06 1986-11-18 Metcal, Inc. Heat treatment with an autoregulating heater
US4745264A (en) * 1984-03-06 1988-05-17 Metcal, Inc. High efficiency autoregulating heater
US4659912A (en) * 1984-06-21 1987-04-21 Metcal, Inc. Thin, flexible, autoregulating strap heater
US4626767A (en) * 1984-12-21 1986-12-02 Metcal, Inc. Constant current r.f. generator
GB8509718D0 (en) * 1985-04-16 1985-05-22 Plessey Co Plc Adaptor for printed circuit board connector
US4795870A (en) * 1985-06-18 1989-01-03 Metcal, Inc. Conductive member having integrated self-regulating heaters
US4788404A (en) * 1985-06-20 1988-11-29 Metcal, Inc. Self-soldering flexible circuit connector
US4814587A (en) * 1986-06-10 1989-03-21 Metcal, Inc. High power self-regulating heater
US4789767A (en) * 1987-06-08 1988-12-06 Metcal, Inc. Autoregulating multi contact induction heater

Also Published As

Publication number Publication date
JPH02187263A (ja) 1990-07-23
JP2719970B2 (ja) 1998-02-25
CA1310137C (en) 1992-11-10
US5059756A (en) 1991-10-22
EP0371646A1 (de) 1990-06-06
KR0155358B1 (ko) 1998-12-15
EP0371646B1 (de) 1994-03-09
KR900008895A (ko) 1990-06-03
DE68913666D1 (de) 1994-04-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee