DE68913666D1 - Selbstregulierendes Heizelement mit wärmeleitenden Verlängerungen. - Google Patents
Selbstregulierendes Heizelement mit wärmeleitenden Verlängerungen.Info
- Publication number
- DE68913666D1 DE68913666D1 DE89311663T DE68913666T DE68913666D1 DE 68913666 D1 DE68913666 D1 DE 68913666D1 DE 89311663 T DE89311663 T DE 89311663T DE 68913666 T DE68913666 T DE 68913666T DE 68913666 D1 DE68913666 D1 DE 68913666D1
- Authority
- DE
- Germany
- Prior art keywords
- self
- heating element
- thermally conductive
- regulating heating
- conductive extensions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0475—Heating appliances electric using induction effects, e.g. Kelvin or skin effects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0242—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections comprising means for controlling the temperature, e.g. making use of the curie point
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10924—Leads formed from a punched metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Dermatology (AREA)
- General Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Resistance Heating (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/277,116 US5059756A (en) | 1988-11-29 | 1988-11-29 | Self regulating temperature heater with thermally conductive extensions |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68913666D1 true DE68913666D1 (de) | 1994-04-14 |
DE68913666T2 DE68913666T2 (de) | 1994-09-15 |
Family
ID=23059464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68913666T Expired - Fee Related DE68913666T2 (de) | 1988-11-29 | 1989-11-10 | Selbstregulierendes Heizelement mit wärmeleitenden Verlängerungen. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5059756A (de) |
EP (1) | EP0371646B1 (de) |
JP (1) | JP2719970B2 (de) |
KR (1) | KR0155358B1 (de) |
CA (1) | CA1310137C (de) |
DE (1) | DE68913666T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5421752A (en) * | 1989-07-31 | 1995-06-06 | The Whitaker Corporation | Method of making a pin grid array and terminal for use therein |
US5227596A (en) * | 1990-10-22 | 1993-07-13 | Metcal, Inc. | Self regulating connecting device containing fusible material |
EP0492492B1 (de) * | 1990-12-21 | 1996-05-08 | The Whitaker Corporation | Verfahren für die Befestigung eines Verbinders an einem Stromkreiselement sowie Lötanschlussrahmen dazu |
US5288959A (en) * | 1993-04-30 | 1994-02-22 | The Whitaker Corporation | Device for electrically interconnecting opposed contact arrays |
US5279028A (en) * | 1993-04-30 | 1994-01-18 | The Whitaker Corporation | Method of making a pin grid array and terminal for use therein |
US5357074A (en) * | 1993-08-17 | 1994-10-18 | The Whitaker Corporation | Electrical interconnection device |
US5357084A (en) * | 1993-11-15 | 1994-10-18 | The Whitaker Corporation | Device for electrically interconnecting contact arrays |
US5605477A (en) * | 1995-01-13 | 1997-02-25 | The Whitaker Corporation | Flexible etched circuit assembly |
US6226862B1 (en) | 1998-04-30 | 2001-05-08 | Sheldahl, Inc. | Method for manufacturing printed circuit board assembly |
KR100284738B1 (ko) * | 1998-09-04 | 2001-04-02 | 윤종용 | 다층금속배선을갖는반도체소자의패드및그제조방법 |
US6271507B2 (en) | 1999-10-08 | 2001-08-07 | Molex Incorporated | Apparatus and method for bonding conductors |
DE10050798C1 (de) | 2000-10-13 | 2002-04-04 | Daimler Chrysler Ag | Verfahrn zum Verbinden von flachen Folienkabeln |
JP2003229186A (ja) * | 2002-01-31 | 2003-08-15 | Denso Corp | 電子装置 |
US7120353B2 (en) * | 2002-02-20 | 2006-10-10 | Schaeffer Bernarr C | Infrared sauna |
US6843666B2 (en) * | 2002-06-14 | 2005-01-18 | Tektronix, Inc. | Method and apparatus for installing a surface mount connector on a printed circuit board |
US20030234470A1 (en) * | 2002-06-20 | 2003-12-25 | Haan Stephen F. | Embossing apparatus, method of use thereof and resulting article |
US20040112935A1 (en) * | 2002-12-16 | 2004-06-17 | Visteon Global Technologies, Inc. | Integrated flex substrate metallurgical bonding |
WO2004091471A2 (en) * | 2003-04-04 | 2004-10-28 | Berger, Constance, F. | Apparatus for heating bottles and method of manufacturing same |
JP2006140052A (ja) * | 2004-11-12 | 2006-06-01 | Three M Innovative Properties Co | 熱硬化性接着フィルム付きコネクタ及びそれを用いた接続方法 |
US7256364B2 (en) * | 2004-12-21 | 2007-08-14 | Remy International, Inc. | Method for simultaneous resistance brazing of adjacent conductor joints |
CN100411498C (zh) * | 2005-11-25 | 2008-08-13 | 惠州Tcl移动通信有限公司 | 一种fpc与pcb的组件 |
CN101856758B (zh) * | 2010-05-28 | 2012-02-01 | 河海大学常州校区 | 硬质合金钢制件与45钢制件的焊接方法 |
US10631372B2 (en) | 2015-04-24 | 2020-04-21 | Guanping Feng | Low-power electro-thermal film devices and methods for making the same |
CN109687186B (zh) * | 2019-01-15 | 2020-08-28 | 番禺得意精密电子工业有限公司 | 连接结构及电连接器制造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3396894A (en) * | 1965-05-11 | 1968-08-13 | Raychem Corp | Solder device |
US3719981A (en) * | 1971-11-24 | 1973-03-13 | Rca Corp | Method of joining solder balls to solder bumps |
US3750252A (en) * | 1972-05-01 | 1973-08-07 | Du Pont | Solder terminal strip |
DE2620619C2 (de) * | 1976-05-10 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und Vorrichtung zum automatischen Lötkontaktieren von Anschlußdrähten mit den Anschlußfahnen von elektrischen Bauteilen |
US4701587A (en) * | 1979-08-31 | 1987-10-20 | Metcal, Inc. | Shielded heating element having intrinsic temperature control |
US4256945A (en) * | 1979-08-31 | 1981-03-17 | Iris Associates | Alternating current electrically resistive heating element having intrinsic temperature control |
US4354629A (en) * | 1980-06-09 | 1982-10-19 | Raychem Corporation | Solder delivery system |
US4695713A (en) * | 1982-09-30 | 1987-09-22 | Metcal, Inc. | Autoregulating, electrically shielded heater |
DE3382551D1 (de) * | 1982-12-01 | 1992-05-27 | Metcal Inc | Verbinder mit schmelzeinsatz und innerer temperatursteuerung. |
US4717814A (en) * | 1983-06-27 | 1988-01-05 | Metcal, Inc. | Slotted autoregulating heater |
US4745264A (en) * | 1984-03-06 | 1988-05-17 | Metcal, Inc. | High efficiency autoregulating heater |
US4623401A (en) * | 1984-03-06 | 1986-11-18 | Metcal, Inc. | Heat treatment with an autoregulating heater |
US4659912A (en) * | 1984-06-21 | 1987-04-21 | Metcal, Inc. | Thin, flexible, autoregulating strap heater |
US4626767A (en) * | 1984-12-21 | 1986-12-02 | Metcal, Inc. | Constant current r.f. generator |
GB8509718D0 (en) * | 1985-04-16 | 1985-05-22 | Plessey Co Plc | Adaptor for printed circuit board connector |
US4795870A (en) * | 1985-06-18 | 1989-01-03 | Metcal, Inc. | Conductive member having integrated self-regulating heaters |
US4788404A (en) * | 1985-06-20 | 1988-11-29 | Metcal, Inc. | Self-soldering flexible circuit connector |
US4814587A (en) * | 1986-06-10 | 1989-03-21 | Metcal, Inc. | High power self-regulating heater |
US4789767A (en) * | 1987-06-08 | 1988-12-06 | Metcal, Inc. | Autoregulating multi contact induction heater |
-
1988
- 1988-11-29 US US07/277,116 patent/US5059756A/en not_active Expired - Fee Related
-
1989
- 1989-09-25 CA CA000612942A patent/CA1310137C/en not_active Expired - Fee Related
- 1989-11-10 EP EP89311663A patent/EP0371646B1/de not_active Expired - Lifetime
- 1989-11-10 DE DE68913666T patent/DE68913666T2/de not_active Expired - Fee Related
- 1989-11-28 KR KR1019890017347A patent/KR0155358B1/ko not_active IP Right Cessation
- 1989-11-29 JP JP1307781A patent/JP2719970B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02187263A (ja) | 1990-07-23 |
EP0371646A1 (de) | 1990-06-06 |
CA1310137C (en) | 1992-11-10 |
DE68913666T2 (de) | 1994-09-15 |
JP2719970B2 (ja) | 1998-02-25 |
EP0371646B1 (de) | 1994-03-09 |
KR0155358B1 (ko) | 1998-12-15 |
KR900008895A (ko) | 1990-06-03 |
US5059756A (en) | 1991-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |