DE68908470D1 - Weiche waermeleistungsfaehige zuammensetzung. - Google Patents

Weiche waermeleistungsfaehige zuammensetzung.

Info

Publication number
DE68908470D1
DE68908470D1 DE8989480042T DE68908470T DE68908470D1 DE 68908470 D1 DE68908470 D1 DE 68908470D1 DE 8989480042 T DE8989480042 T DE 8989480042T DE 68908470 T DE68908470 T DE 68908470T DE 68908470 D1 DE68908470 D1 DE 68908470D1
Authority
DE
Germany
Prior art keywords
soft
heatable composition
heatable
composition
soft heatable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8989480042T
Other languages
English (en)
Other versions
DE68908470T2 (de
Inventor
Herbert Rudolph Anderson
Richard Benton Booth
Lawrence Daniel David
Mark Oliver Neisser
Harbans Singh Sachdev
Mark Anthony Takacs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE68908470D1 publication Critical patent/DE68908470D1/de
Publication of DE68908470T2 publication Critical patent/DE68908470T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
DE89480042T 1988-05-13 1989-03-14 Weiche wärmeleistungsfähige Zuammensetzung. Expired - Fee Related DE68908470T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/193,475 US5094769A (en) 1988-05-13 1988-05-13 Compliant thermally conductive compound

Publications (2)

Publication Number Publication Date
DE68908470D1 true DE68908470D1 (de) 1993-09-23
DE68908470T2 DE68908470T2 (de) 1994-03-17

Family

ID=22713795

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89480042T Expired - Fee Related DE68908470T2 (de) 1988-05-13 1989-03-14 Weiche wärmeleistungsfähige Zuammensetzung.

Country Status (4)

Country Link
US (1) US5094769A (de)
EP (1) EP0342141B1 (de)
JP (1) JPH0695557B2 (de)
DE (1) DE68908470T2 (de)

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US5250209A (en) * 1991-04-22 1993-10-05 Thermoset Plastics, Inc. Thermal coupling with water-washable thermally conductive grease
US5167851A (en) * 1991-04-22 1992-12-01 Thermoset Plastics, Inc. Hydrophilic thermally conductive grease
WO1992022090A1 (en) * 1991-06-03 1992-12-10 Motorola, Inc. Thermally conductive electronic assembly
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
US5430611A (en) * 1993-07-06 1995-07-04 Hewlett-Packard Company Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate
US5454276A (en) * 1993-07-30 1995-10-03 Wernicke; Timothy K. Multi-directional magnetic flux pipe inspection apparatus and method
US5565633A (en) * 1993-07-30 1996-10-15 Wernicke; Timothy K. Spiral tractor apparatus and method
ATE203266T1 (de) * 1995-01-14 2001-08-15 Jochen Daume Wärmeträgerkonzentrat, verfahren zu dessen herstellung sowie dessen verwendung und latentwärmespeicher
US5591789A (en) 1995-06-07 1997-01-07 International Business Machines Corporation Polyester dispersants for high thermal conductivity paste
US5672297A (en) * 1995-10-27 1997-09-30 The Dow Chemical Company Conductive composite articles based on expandable and contractible particulate matrices
US5705085A (en) * 1996-06-13 1998-01-06 Lord Corporation Organomolybdenum-containing magnetorheological fluid
US5683615A (en) * 1996-06-13 1997-11-04 Lord Corporation Magnetorheological fluid
US6020424A (en) * 1997-06-30 2000-02-01 Ferro Corporation Screen printable thermally curing conductive gel
US5968606A (en) 1997-06-30 1999-10-19 Ferro Corporation Screen printable UV curable conductive material composition
JPH1145965A (ja) 1997-07-28 1999-02-16 Kyocera Corp 伝熱性化合物およびこれを用いた半導体装置
JP3948642B2 (ja) * 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
US20040069454A1 (en) * 1998-11-02 2004-04-15 Bonsignore Patrick V. Composition for enhancing thermal conductivity of a heat transfer medium and method of use thereof
US6377453B1 (en) * 1999-01-29 2002-04-23 Hewlett-Packard Company Field replaceable module with enhanced thermal interface
US6238596B1 (en) 1999-03-09 2001-05-29 Johnson Matthey Electronics, Inc. Compliant and crosslinkable thermal interface materials
US5989459A (en) * 1999-03-09 1999-11-23 Johnson Matthey, Inc. Compliant and crosslinkable thermal interface materials
US6417286B1 (en) * 1999-09-08 2002-07-09 The Goodyear Tire & Rubber Company Titanium and zirconium compounds
US6605238B2 (en) * 1999-09-17 2003-08-12 Honeywell International Inc. Compliant and crosslinkable thermal interface materials
US6091603A (en) * 1999-09-30 2000-07-18 International Business Machines Corporation Customizable lid for improved thermal performance of modules using flip chips
US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US6869642B2 (en) * 2000-05-18 2005-03-22 Raymond G. Freuler Phase change thermal interface composition having induced bonding property
US6292369B1 (en) 2000-08-07 2001-09-18 International Business Machines Corporation Methods for customizing lid for improved thermal performance of modules using flip chips
US6752204B2 (en) * 2001-09-18 2004-06-22 Intel Corporation Iodine-containing thermal interface material
WO2003067658A2 (en) * 2002-02-06 2003-08-14 Parker Hannifin Corporation Thermal management materials having a phase change dispersion
US6946190B2 (en) * 2002-02-06 2005-09-20 Parker-Hannifin Corporation Thermal management materials
WO2003101164A1 (en) * 2002-05-23 2003-12-04 3M Innovative Properties Company Nanoparticle filled underfill
US7009291B2 (en) * 2002-12-25 2006-03-07 Denso Corporation Semiconductor module and semiconductor device
US7031162B2 (en) * 2003-09-26 2006-04-18 International Business Machines Corporation Method and structure for cooling a dual chip module with one high power chip
ATE357476T1 (de) * 2003-11-05 2007-04-15 Dow Corning Wärmeleitfähiges schmierfett und verfahren und vorrichtungen, bei denen das schmierfett verwendet wird
TWI253467B (en) * 2003-12-23 2006-04-21 Hon Hai Prec Ind Co Ltd Thermal interface material and method for making same
US20090188701A1 (en) * 2004-01-08 2009-07-30 Hiroshi Tsuzuki Inorganic powder, resin composition filled with the powder and use thereof
US20060025515A1 (en) * 2004-07-27 2006-02-02 Mainstream Engineering Corp. Nanotube composites and methods for producing
US20060185836A1 (en) * 2005-02-24 2006-08-24 Scott Garner Thermally coupled surfaces having controlled minimum clearance
US20070031684A1 (en) * 2005-08-03 2007-02-08 Anderson Jeffrey T Thermally conductive grease
US7964542B2 (en) * 2006-01-12 2011-06-21 International Business Machines Corporation Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly
US7462294B2 (en) * 2007-04-25 2008-12-09 International Business Machines Corporation Enhanced thermal conducting formulations
WO2009131913A2 (en) * 2008-04-21 2009-10-29 Honeywell International Inc. Thermal interconnect and interface materials, methods of production and uses thereof
JP5410126B2 (ja) * 2009-03-23 2014-02-05 株式会社ダイヘン プラズマ溶接用電源及びプラズマ溶接装置
US9751264B2 (en) * 2009-10-09 2017-09-05 Alcatel-Lucent Usa Inc. Thermal interface device
US9490058B1 (en) 2011-01-14 2016-11-08 Universal Lighting Technologies, Inc. Magnetic component with core grooves for improved heat transfer
US8840803B2 (en) 2012-02-02 2014-09-23 Baker Hughes Incorporated Thermally conductive nanocomposition and method of making the same
CN104726076B (zh) * 2015-01-29 2017-09-22 海门市瑞泰纺织科技有限公司 一种燃烧炉内胆用导热材料
DE102015206544A1 (de) 2015-04-13 2016-10-13 Schaeffler Technologies AG & Co. KG Elektrische Spule und Verfahren zu ihrer Herstellung
US11293247B2 (en) 2016-09-12 2022-04-05 Baker Hughes, A Ge Company, Llc Frac plug and method for fracturing a formation
US11492866B2 (en) 2016-09-12 2022-11-08 Baker Hughes Holdings Llc Downhole tools containing ductile cementing materials
CN108192576B (zh) * 2017-12-05 2021-02-02 云南靖创液态金属热控技术研发有限公司 一种液态金属热界面材料及其制备方法和应用
DE102018220998B4 (de) * 2018-12-05 2023-09-28 Vitesco Technologies GmbH Leistungselektronikanordnung mit einer effizienten Kühlung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3405066A (en) * 1965-01-22 1968-10-08 Union Carbide Corp High thermal conductivity fluid dielectric
US3495133A (en) * 1965-06-18 1970-02-10 Ibm Circuit structure including semiconductive chip devices joined to a substrate by solder contacts
US3882033A (en) * 1971-07-06 1975-05-06 Gen Electric Silicone grease for semiconductors
US3885984A (en) * 1973-12-18 1975-05-27 Gen Electric Methyl alkyl silicone thermoconducting compositions
US4265775A (en) * 1979-08-16 1981-05-05 International Business Machines Corporation Non-bleeding thixotropic thermally conductive material
JPS6174357A (ja) * 1984-09-20 1986-04-16 Nec Corp 熱伝導性コンパウンド

Also Published As

Publication number Publication date
DE68908470T2 (de) 1994-03-17
JPH0218953A (ja) 1990-01-23
EP0342141A2 (de) 1989-11-15
JPH0695557B2 (ja) 1994-11-24
US5094769A (en) 1992-03-10
EP0342141A3 (en) 1990-01-31
EP0342141B1 (de) 1993-08-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee