DE60336471D1 - Verfahren und einrichtung zur messung von waferpotential oder -temperatur - Google Patents

Verfahren und einrichtung zur messung von waferpotential oder -temperatur

Info

Publication number
DE60336471D1
DE60336471D1 DE60336471T DE60336471T DE60336471D1 DE 60336471 D1 DE60336471 D1 DE 60336471D1 DE 60336471 T DE60336471 T DE 60336471T DE 60336471 T DE60336471 T DE 60336471T DE 60336471 D1 DE60336471 D1 DE 60336471D1
Authority
DE
Germany
Prior art keywords
temperature
measuring wafer
wafer potential
potential
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60336471T
Other languages
English (en)
Inventor
Ryuichi Matsuda
Yuichi Kawano
Masahiko Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002175247A external-priority patent/JP3861030B2/ja
Priority claimed from JP2002184160A external-priority patent/JP2004031554A/ja
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Application granted granted Critical
Publication of DE60336471D1 publication Critical patent/DE60336471D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
DE60336471T 2002-06-17 2003-06-17 Verfahren und einrichtung zur messung von waferpotential oder -temperatur Expired - Lifetime DE60336471D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002175247A JP3861030B2 (ja) 2002-06-17 2002-06-17 ウェーハ電位の測定方法及び装置
JP2002184160A JP2004031554A (ja) 2002-06-25 2002-06-25 ウェーハ温度の検出方法及び装置
PCT/JP2003/007649 WO2003107415A1 (ja) 2002-06-17 2003-06-17 ウェーハ電位又は温度の測定方法及び装置

Publications (1)

Publication Number Publication Date
DE60336471D1 true DE60336471D1 (de) 2011-05-05

Family

ID=29738413

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60336471T Expired - Lifetime DE60336471D1 (de) 2002-06-17 2003-06-17 Verfahren und einrichtung zur messung von waferpotential oder -temperatur

Country Status (6)

Country Link
US (1) US7335315B2 (de)
EP (1) EP1515363B1 (de)
KR (1) KR100603169B1 (de)
DE (1) DE60336471D1 (de)
TW (1) TW200404334A (de)
WO (1) WO2003107415A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4928817B2 (ja) * 2006-04-07 2012-05-09 株式会社日立ハイテクノロジーズ プラズマ処理装置
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
CN102449754B (zh) 2009-05-15 2015-10-21 恩特格林斯公司 具有聚合物突出物的静电吸盘
KR101731136B1 (ko) 2010-05-28 2017-04-27 엔테그리스, 아이엔씨. 표면저항이 높은 정전 척
JP5875775B2 (ja) * 2011-03-30 2016-03-02 東京エレクトロン株式会社 基板除去方法及び記憶媒体
JP6407694B2 (ja) * 2014-12-16 2018-10-17 株式会社日立ハイテクノロジーズ プラズマ処理装置
US10969370B2 (en) * 2015-06-05 2021-04-06 Semilab Semiconductor Physics Laboratory Co., Ltd. Measuring semiconductor doping using constant surface potential corona charging
JP6522180B1 (ja) 2018-02-08 2019-05-29 Ｓｐｐテクノロジーズ株式会社 基板載置台及びこれを備えたプラズマ処理装置及びプラズマ処理方法
CN112735965B (zh) * 2020-12-25 2024-02-27 北京北方华创微电子装备有限公司 半导体设备及其承载装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06151568A (ja) * 1992-11-02 1994-05-31 Nippon Steel Corp 静電チャック装置
JPH1014266A (ja) * 1996-06-21 1998-01-16 Sony Corp 静電チャック装置及び静電チャックを用いたウエハの保持方法及び静電チャックからのウエハの脱着方法
US6198616B1 (en) 1998-04-03 2001-03-06 Applied Materials, Inc. Method and apparatus for supplying a chucking voltage to an electrostatic chuck within a semiconductor wafer processing system
JP2000021964A (ja) * 1998-07-06 2000-01-21 Ngk Insulators Ltd 静電チャックのパーティクル発生低減方法および半導体製造装置
JP2000332075A (ja) 1999-05-24 2000-11-30 Hitachi Ltd 温度測定用ウエハ
JP2002009140A (ja) * 2000-06-22 2002-01-11 Mitsubishi Electric Corp 静電チャック装置
US7208067B2 (en) * 2003-03-27 2007-04-24 Tokyo Electron Limited Method and system for monitoring RF impedance to determine conditions of a wafer on an electrostatic chuck

Also Published As

Publication number Publication date
WO2003107415A1 (ja) 2003-12-24
KR20050010517A (ko) 2005-01-27
US20050174135A1 (en) 2005-08-11
EP1515363B1 (de) 2011-03-23
US7335315B2 (en) 2008-02-26
KR100603169B1 (ko) 2006-07-24
TW200404334A (en) 2004-03-16
EP1515363A4 (de) 2007-05-09
EP1515363A1 (de) 2005-03-16
TWI300242B (de) 2008-08-21

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