DE60329478D1 - Stifte und buchse zum zwischenverbinden von zwei leiterplatten, sowie verfahren zum einbau in eine leiterplatte - Google Patents

Stifte und buchse zum zwischenverbinden von zwei leiterplatten, sowie verfahren zum einbau in eine leiterplatte

Info

Publication number
DE60329478D1
DE60329478D1 DE60329478T DE60329478T DE60329478D1 DE 60329478 D1 DE60329478 D1 DE 60329478D1 DE 60329478 T DE60329478 T DE 60329478T DE 60329478 T DE60329478 T DE 60329478T DE 60329478 D1 DE60329478 D1 DE 60329478D1
Authority
DE
Germany
Prior art keywords
intermediating
pcbs
sockets
pcb
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60329478T
Other languages
English (en)
Inventor
Charles J Buondelmonte
Joseph Patrick Mendelsohn
Richard William Brown
Min Li
Richard Franklin Schwartz
Sanjay Sudhakar Upasani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commscope Technologies LLC
Original Assignee
Andrew LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Andrew LLC filed Critical Andrew LLC
Application granted granted Critical
Publication of DE60329478D1 publication Critical patent/DE60329478D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10333—Individual female type metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
DE60329478T 2002-03-20 2003-03-20 Stifte und buchse zum zwischenverbinden von zwei leiterplatten, sowie verfahren zum einbau in eine leiterplatte Expired - Lifetime DE60329478D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36582402P 2002-03-20 2002-03-20
PCT/US2003/008570 WO2003081969A1 (en) 2002-03-20 2003-03-20 Interconnection pin/socket components for electrically connecting two circuit boards and method for mounting said components in a circuit board

Publications (1)

Publication Number Publication Date
DE60329478D1 true DE60329478D1 (de) 2009-11-12

Family

ID=28454719

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60329478T Expired - Lifetime DE60329478D1 (de) 2002-03-20 2003-03-20 Stifte und buchse zum zwischenverbinden von zwei leiterplatten, sowie verfahren zum einbau in eine leiterplatte

Country Status (7)

Country Link
US (1) US6790056B2 (de)
EP (1) EP1486105B1 (de)
KR (2) KR101024451B1 (de)
CN (1) CN100482044C (de)
AU (1) AU2003230696A1 (de)
DE (1) DE60329478D1 (de)
WO (1) WO2003081969A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7462783B2 (en) * 2004-08-02 2008-12-09 Texas Instruments Incorporated Semiconductor package having a grid array of pin-attached balls
JP2006237507A (ja) * 2005-02-28 2006-09-07 Mitsubishi Heavy Ind Ltd 半田付けを用いた構造物
KR100663265B1 (ko) * 2005-05-10 2007-01-02 삼성전기주식회사 다층 기판 및 그 제조 방법
KR100741697B1 (ko) * 2005-10-28 2007-07-23 주식회사 파이컴 프로브 카드 및 그 제조 방법
KR100730801B1 (ko) * 2005-12-28 2007-06-21 엠알 보드 인크 학습용 디지탈 마그네틱 브레드보드 및 전자부품
US7977579B2 (en) * 2006-03-30 2011-07-12 Stats Chippac Ltd. Multiple flip-chip integrated circuit package system
KR100822898B1 (ko) * 2006-08-22 2008-04-17 이종섭 기판고정구
US7611357B2 (en) * 2006-09-15 2009-11-03 Mr Board, Inc. Magnetic component connector, circuit boards for use therewith, and kits for building and designing circuits
US20080112191A1 (en) * 2006-11-15 2008-05-15 Chia-Huang Wu Supporting frame and supporting frame assembly for a backlight module
WO2009046428A2 (en) * 2007-10-05 2009-04-09 Battery-Biz® Inc. Termination apparatus and method for planar components on printed circuit boards
JP4993754B2 (ja) * 2008-02-22 2012-08-08 新光電気工業株式会社 Ｐｇａ型配線基板及びその製造方法
US7658621B2 (en) * 2008-04-17 2010-02-09 Hon Hai Precision Ind. Co., Ltd. Connector assembly having connecting device
JP5294355B2 (ja) * 2010-11-09 2013-09-18 北川工業株式会社 コンタクト、及びコンタクトの接合構造
KR20130072544A (ko) * 2011-12-22 2013-07-02 삼성전기주식회사 프로브 카드 및 그 제조방법
CN103199370B (zh) * 2012-01-10 2016-09-28 欧司朗股份有限公司 连接件、具有该连接件的电子装置和照明装置
US9564697B2 (en) 2014-11-13 2017-02-07 Lear Corporation Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same
CN105161928B (zh) * 2015-08-28 2018-01-09 中航光电科技股份有限公司 一种防雷滤波模块
US10403601B2 (en) * 2016-06-17 2019-09-03 Fairchild Semiconductor Corporation Semiconductor package and related methods
CN106624240A (zh) * 2016-12-20 2017-05-10 江门市森德制冷器材有限公司 一种实现铁件表面覆盖铜的工艺
US10923830B2 (en) * 2019-01-18 2021-02-16 Pc-Tel, Inc. Quick solder chip connector for massive multiple-input multiple-output antenna systems
US11424562B2 (en) * 2020-02-28 2022-08-23 International Business Machines Corporation Press-fit insertion method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US617963A (en) * 1899-01-17 Gesellschaft fur anilin fabrikation
US4420877A (en) * 1981-03-19 1983-12-20 Mckenzie Jr Joseph A Self-masking socket pin carrier for printed circuit boards
US5059130A (en) * 1988-06-23 1991-10-22 Ltv Aerospace And Defense Company Minimal space printed cicuit board and electrical connector system
US5046971A (en) * 1988-12-14 1991-09-10 Olin Corporation Terminal pins for flexible circuits
US5176254A (en) * 1991-04-22 1993-01-05 On-Shore Technology, Inc. Terminal support system
US6179631B1 (en) * 1997-11-21 2001-01-30 Emc Corporation Electrical contact for a printed circuit board
US20020052146A1 (en) * 1999-11-05 2002-05-02 James Keith Custer Circuit board apparatus with pin connectors

Also Published As

Publication number Publication date
KR20110003591A (ko) 2011-01-12
EP1486105A1 (de) 2004-12-15
CN100482044C (zh) 2009-04-22
KR20040086485A (ko) 2004-10-08
US6790056B2 (en) 2004-09-14
KR101024451B1 (ko) 2011-03-23
AU2003230696A1 (en) 2003-10-08
CN1644000A (zh) 2005-07-20
WO2003081969A1 (en) 2003-10-02
EP1486105B1 (de) 2009-09-30
KR101011055B1 (ko) 2011-01-25
US20030232522A1 (en) 2003-12-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition