DE60319040D1 - Verfahren zur Montage einer Hybrid-IC-Karte und Hybrid-IC-Karte - Google Patents

Verfahren zur Montage einer Hybrid-IC-Karte und Hybrid-IC-Karte

Info

Publication number
DE60319040D1
DE60319040D1 DE60319040T DE60319040T DE60319040D1 DE 60319040 D1 DE60319040 D1 DE 60319040D1 DE 60319040 T DE60319040 T DE 60319040T DE 60319040 T DE60319040 T DE 60319040T DE 60319040 D1 DE60319040 D1 DE 60319040D1
Authority
DE
Germany
Prior art keywords
hybrid
card
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60319040T
Other languages
English (en)
Inventor
Masaru Murohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE60319040D1 publication Critical patent/DE60319040D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0726—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement including a circuit for tuning the resonance frequency of an antenna on the record carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE60319040T 2002-09-27 2003-09-16 Verfahren zur Montage einer Hybrid-IC-Karte und Hybrid-IC-Karte Expired - Lifetime DE60319040D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002283521A JP2004118694A (ja) 2002-09-27 2002-09-27 コンビｉｃカードの実装方法

Publications (1)

Publication Number Publication Date
DE60319040D1 true DE60319040D1 (de) 2008-03-27

Family

ID=31973356

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60319040T Expired - Lifetime DE60319040D1 (de) 2002-09-27 2003-09-16 Verfahren zur Montage einer Hybrid-IC-Karte und Hybrid-IC-Karte

Country Status (6)

Country Link
US (1) US6867981B2 (de)
EP (1) EP1403816B1 (de)
JP (1) JP2004118694A (de)
KR (1) KR100558108B1 (de)
CN (1) CN1264118C (de)
DE (1) DE60319040D1 (de)

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US20060000914A1 (en) * 2004-06-30 2006-01-05 Chen Chien-Yuan Memory card capable of wireless transmission
US7306144B2 (en) * 2004-09-16 2007-12-11 Cirque Corporation Contactless card reader integrated into a touchpad
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US8527510B2 (en) 2005-05-23 2013-09-03 Monster Worldwide, Inc. Intelligent job matching system and method
FR2890212B1 (fr) * 2005-08-30 2009-08-21 Smart Packaging Solutions Sps Module electronique a double interface de communication, notamment pour carte a puce
JP2007172592A (ja) * 2005-11-25 2007-07-05 Semiconductor Energy Lab Co Ltd 半導体装置
US8195657B1 (en) 2006-01-09 2012-06-05 Monster Worldwide, Inc. Apparatuses, systems and methods for data entry correlation
US8600931B1 (en) 2006-03-31 2013-12-03 Monster Worldwide, Inc. Apparatuses, methods and systems for automated online data submission
US7965520B2 (en) * 2007-01-22 2011-06-21 Sony Ericsson Mobile Communications Ab Electronic device with flip module having low height
US10387837B1 (en) 2008-04-21 2019-08-20 Monster Worldwide, Inc. Apparatuses, methods and systems for career path advancement structuring
JP5172762B2 (ja) * 2009-03-27 2013-03-27 リンテック株式会社 アンテナ回路、ｉｃインレット、ｉｃタグ、およびアンテナ回路の容量調整方法
JP5423974B2 (ja) * 2010-03-25 2014-02-19 大日本印刷株式会社 表示機能付き非接触式データキャリア
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
JP5724313B2 (ja) * 2010-11-16 2015-05-27 セイコーエプソン株式会社 無線通信装置
CN102024176A (zh) * 2010-12-09 2011-04-20 武汉天喻信息产业股份有限公司 一种双界面智能卡的制作方法
CN102328120B (zh) * 2011-09-08 2013-04-17 张开兰 一种生产ic智能卡的铣槽方法
US9740342B2 (en) 2011-12-23 2017-08-22 Cirque Corporation Method for preventing interference of contactless card reader and touch functions when they are physically and logically bound together for improved authentication security
US9081453B2 (en) 2012-01-12 2015-07-14 Synaptics Incorporated Single layer capacitive imaging sensors
US9262651B2 (en) 2013-01-08 2016-02-16 Cirque Corporation Method for preventing unintended contactless interaction when performing contact interaction
DE102013107003A1 (de) * 2013-07-03 2015-01-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zum Anpassen eines Schwingkreises für ein Spielgerät
US9552089B2 (en) 2013-08-07 2017-01-24 Synaptics Incorporated Capacitive sensing using a matrix electrode pattern
US9298325B2 (en) 2013-09-30 2016-03-29 Synaptics Incorporated Processing system for a capacitive sensing device
US20150091842A1 (en) 2013-09-30 2015-04-02 Synaptics Incorporated Matrix sensor for image touch sensing
US10042489B2 (en) 2013-09-30 2018-08-07 Synaptics Incorporated Matrix sensor for image touch sensing
US9459367B2 (en) 2013-10-02 2016-10-04 Synaptics Incorporated Capacitive sensor driving technique that enables hybrid sensing or equalization
US9274662B2 (en) 2013-10-18 2016-03-01 Synaptics Incorporated Sensor matrix pad for performing multiple capacitive sensing techniques
US9081457B2 (en) 2013-10-30 2015-07-14 Synaptics Incorporated Single-layer muti-touch capacitive imaging sensor
US9798429B2 (en) 2014-02-28 2017-10-24 Synaptics Incorporated Guard electrodes in a sensing stack
KR101762778B1 (ko) 2014-03-04 2017-07-28 엘지이노텍 주식회사 무선 충전 및 통신 기판 그리고 무선 충전 및 통신 장치
US10133421B2 (en) 2014-04-02 2018-11-20 Synaptics Incorporated Display stackups for matrix sensor
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US9720541B2 (en) 2015-06-30 2017-08-01 Synaptics Incorporated Arrangement of sensor pads and display driver pads for input device
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US10037112B2 (en) 2015-09-30 2018-07-31 Synaptics Incorporated Sensing an active device'S transmission using timing interleaved with display updates
US10067587B2 (en) 2015-12-29 2018-09-04 Synaptics Incorporated Routing conductors in an integrated display device and sensing device
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Also Published As

Publication number Publication date
KR100558108B1 (ko) 2006-03-10
CN1492378A (zh) 2004-04-28
US20040062012A1 (en) 2004-04-01
KR20040027357A (ko) 2004-04-01
JP2004118694A (ja) 2004-04-15
US6867981B2 (en) 2005-03-15
CN1264118C (zh) 2006-07-12
EP1403816A2 (de) 2004-03-31
EP1403816A3 (de) 2005-06-15
EP1403816B1 (de) 2008-02-13

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