DE60317286T2 - Elektrische Verbindung für Tintenstrahlvorrichtung, Anordnung und Verfahren - Google Patents
Elektrische Verbindung für Tintenstrahlvorrichtung, Anordnung und Verfahren Download PDFInfo
- Publication number
- DE60317286T2 DE60317286T2 DE60317286T DE60317286T DE60317286T2 DE 60317286 T2 DE60317286 T2 DE 60317286T2 DE 60317286 T DE60317286 T DE 60317286T DE 60317286 T DE60317286 T DE 60317286T DE 60317286 T2 DE60317286 T2 DE 60317286T2
- Authority
- DE
- Germany
- Prior art keywords
- contact surfaces
- layer
- chamber
- electrical contact
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 16
- 239000000806 elastomer Substances 0.000 claims description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 239000013536 elastomeric material Substances 0.000 claims description 3
- 239000000976 ink Substances 0.000 claims 4
- 229920002595 Dielectric elastomer Polymers 0.000 claims 2
- 238000011109 contamination Methods 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 42
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/1752—Mounting within the printer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17526—Electrical contacts to the cartridge
Landscapes
- Ink Jet (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US280249 | 2002-10-25 | ||
| US10/280,249 US6776475B2 (en) | 2002-10-25 | 2002-10-25 | Interconnect system and method for inkjet devices using conductive elastomer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60317286D1 DE60317286D1 (de) | 2007-12-20 |
| DE60317286T2 true DE60317286T2 (de) | 2008-08-28 |
Family
ID=32069369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60317286T Expired - Fee Related DE60317286T2 (de) | 2002-10-25 | 2003-05-08 | Elektrische Verbindung für Tintenstrahlvorrichtung, Anordnung und Verfahren |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6776475B2 (enExample) |
| EP (1) | EP1413436B1 (enExample) |
| JP (1) | JP2004142464A (enExample) |
| DE (1) | DE60317286T2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100584611B1 (ko) * | 2004-11-27 | 2006-06-01 | 삼성전자주식회사 | 잉크젯 프린터 |
| DE102006017045A1 (de) * | 2006-04-11 | 2007-04-19 | 3T Supplies Ag | Tintenkassette |
| US8251494B2 (en) * | 2009-11-30 | 2012-08-28 | Eastman Kodak Company | Bondable printed wiring with improved wear resistance |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5045249A (en) * | 1986-12-04 | 1991-09-03 | At&T Bell Laboratories | Electrical interconnection by a composite medium |
| US5140405A (en) * | 1990-08-30 | 1992-08-18 | Micron Technology, Inc. | Semiconductor assembly utilizing elastomeric single axis conductive interconnect |
| US5598194A (en) | 1993-04-30 | 1997-01-28 | Hewlett-Packard Company | Wiping structure for cleaning electrical contacts for a printer and ink cartridge |
| US6003974A (en) | 1993-04-30 | 1999-12-21 | Hewlett-Packard Company | Unitary interconnect system for an inkjet printer |
| US5461482A (en) | 1993-04-30 | 1995-10-24 | Hewlett-Packard Company | Electrical interconnect system for a printer |
| US6231168B1 (en) | 1999-04-30 | 2001-05-15 | Hewlett-Packard Company | Ink jet print head with flow control manifold shape |
-
2002
- 2002-10-25 US US10/280,249 patent/US6776475B2/en not_active Expired - Fee Related
-
2003
- 2003-05-08 EP EP03010415A patent/EP1413436B1/en not_active Expired - Lifetime
- 2003-05-08 DE DE60317286T patent/DE60317286T2/de not_active Expired - Fee Related
- 2003-10-24 JP JP2003364108A patent/JP2004142464A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP1413436B1 (en) | 2007-11-07 |
| US6776475B2 (en) | 2004-08-17 |
| EP1413436A2 (en) | 2004-04-28 |
| EP1413436A3 (en) | 2005-11-16 |
| JP2004142464A (ja) | 2004-05-20 |
| DE60317286D1 (de) | 2007-12-20 |
| US20040080577A1 (en) | 2004-04-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |