DE60313776T2 - Thermische kompensation von wellenleitern mit kern aus zwei verschiedenen materialien - Google Patents
Thermische kompensation von wellenleitern mit kern aus zwei verschiedenen materialien Download PDFInfo
- Publication number
- DE60313776T2 DE60313776T2 DE60313776T DE60313776T DE60313776T2 DE 60313776 T2 DE60313776 T2 DE 60313776T2 DE 60313776 T DE60313776 T DE 60313776T DE 60313776 T DE60313776 T DE 60313776T DE 60313776 T2 DE60313776 T2 DE 60313776T2
- Authority
- DE
- Germany
- Prior art keywords
- core
- lightwave circuit
- region
- planar lightwave
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims description 30
- 230000003287 optical effect Effects 0.000 claims description 36
- 229920000642 polymer Polymers 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 230000000644 propagated effect Effects 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 238000009987 spinning Methods 0.000 claims 1
- 238000005253 cladding Methods 0.000 abstract 1
- 239000011162 core material Substances 0.000 description 53
- 238000010586 diagram Methods 0.000 description 16
- 239000000758 substrate Substances 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000012792 core layer Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 229920001688 coating polymer Polymers 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Non-Reversible Transmitting Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/190,411 US6987895B2 (en) | 2002-07-02 | 2002-07-02 | Thermal compensation of waveguides by dual material core having positive thermo-optic coefficient inner core |
| US190411 | 2002-07-02 | ||
| PCT/US2003/017180 WO2004005988A1 (en) | 2002-07-02 | 2003-05-29 | Thermal compensation of waveguides by dual material core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60313776D1 DE60313776D1 (de) | 2007-06-21 |
| DE60313776T2 true DE60313776T2 (de) | 2008-01-24 |
Family
ID=29999877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60313776T Expired - Lifetime DE60313776T2 (de) | 2002-07-02 | 2003-05-29 | Thermische kompensation von wellenleitern mit kern aus zwei verschiedenen materialien |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6987895B2 (https=) |
| EP (1) | EP1521986B1 (https=) |
| JP (1) | JP4221364B2 (https=) |
| AT (1) | ATE362123T1 (https=) |
| AU (1) | AU2003240968A1 (https=) |
| DE (1) | DE60313776T2 (https=) |
| WO (1) | WO2004005988A1 (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7006719B2 (en) * | 2002-03-08 | 2006-02-28 | Infinera Corporation | In-wafer testing of integrated optical components in photonic integrated circuits (PICs) |
| US7194176B2 (en) * | 2002-05-29 | 2007-03-20 | Hoya Corporation | Functional optical devices and methods for producing them |
| US6987895B2 (en) | 2002-07-02 | 2006-01-17 | Intel Corporation | Thermal compensation of waveguides by dual material core having positive thermo-optic coefficient inner core |
| US20060140569A1 (en) * | 2004-12-28 | 2006-06-29 | Intel Corporation | Planar waveguides with air thin films used as anti-reflective layers, beam splitters and mirrors |
| US8496647B2 (en) | 2007-12-18 | 2013-07-30 | Intuitive Surgical Operations, Inc. | Ribbed force sensor |
| US20070003198A1 (en) * | 2005-06-29 | 2007-01-04 | Lance Gibson | Low loss optical fiber designs and methods for their manufacture |
| JP2007193049A (ja) * | 2006-01-18 | 2007-08-02 | Sony Corp | 光導波路及び光モジュール |
| US7406222B2 (en) * | 2006-02-16 | 2008-07-29 | Pavel Kornilovich | Composite evanescent waveguides and associated methods |
| US8285150B2 (en) | 2006-10-02 | 2012-10-09 | Futurewei Technologies, Inc. | Method and system for integrated DWDM transmitters |
| US8285149B2 (en) * | 2006-10-02 | 2012-10-09 | Futurewei Technologies, Inc. | Method and system for integrated DWDM transmitters |
| US8285151B2 (en) * | 2006-10-20 | 2012-10-09 | Futurewei Technologies, Inc. | Method and system for hybrid integrated 1XN DWDM transmitter |
| US8561473B2 (en) * | 2007-12-18 | 2013-10-22 | Intuitive Surgical Operations, Inc. | Force sensor temperature compensation |
| US8290325B2 (en) * | 2008-06-30 | 2012-10-16 | Intel Corporation | Waveguide photodetector device and manufacturing method thereof |
| KR20140096918A (ko) * | 2013-01-29 | 2014-08-06 | 삼성전자주식회사 | 온도 무의존성 도파로 및 그 제조 방법 |
| US10295739B2 (en) * | 2013-04-22 | 2019-05-21 | Cornell University | Athermal optical devices based on composite structures |
| CN110927992B (zh) * | 2019-12-20 | 2023-02-28 | 武汉邮电科学研究院有限公司 | 一种光开关 |
| CN110989078A (zh) * | 2019-12-25 | 2020-04-10 | 易锐光电科技(安徽)有限公司 | 薄膜光波导及其制备方法 |
| US11372157B2 (en) | 2020-09-30 | 2022-06-28 | Nokia Solutions And Networks Oy | Integrated optical multiplexer / demultiplexer with thermal compensation |
| US11480729B2 (en) | 2020-10-30 | 2022-10-25 | Nokia Solutions And Networks Oy | Thermally compensated slot waveguide |
| US20220276437A1 (en) * | 2022-05-18 | 2022-09-01 | Intel Corporation | Temperature insensitive waveguides and array waveguide grating mux/demux devices |
| US12596288B2 (en) * | 2023-08-31 | 2026-04-07 | Nexus Photonics, Inc | Temperature stabilized dielectric based on-chip interferometers |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5163118A (en) * | 1986-11-10 | 1992-11-10 | The United States Of America As Represented By The Secretary Of The Air Force | Lattice mismatched hetrostructure optical waveguide |
| US5125946A (en) * | 1990-12-10 | 1992-06-30 | Corning Incorporated | Manufacturing method for planar optical waveguides |
| FR2746511B1 (fr) * | 1996-03-20 | 1998-04-24 | Bosc Dominique | Coupleur directif actif mixte silice/polymere, en optique integree |
| US6144779A (en) * | 1997-03-11 | 2000-11-07 | Lightwave Microsystems Corporation | Optical interconnects with hybrid construction |
| US6122416A (en) * | 1997-09-26 | 2000-09-19 | Nippon Telegraph And Telephone Corporation | Stacked thermo-optic switch, switch matrix and add-drop multiplexer having the stacked thermo-optic switch |
| US6137939A (en) * | 1997-10-01 | 2000-10-24 | Lucent Technologies Inc. | Method and apparatus for reducing temperature-related spectrum shifts in optical devices |
| US6083843A (en) * | 1997-12-16 | 2000-07-04 | Northern Telecom Limited | Method of manufacturing planar lightwave circuits |
| US6002823A (en) * | 1998-08-05 | 1999-12-14 | Lucent Techolonogies Inc. | Tunable directional optical waveguide couplers |
| US6240226B1 (en) * | 1998-08-13 | 2001-05-29 | Lucent Technologies Inc. | Polymer material and method for optical switching and modulation |
| US6310999B1 (en) * | 1998-10-05 | 2001-10-30 | Lucent Technologies Inc. | Directional coupler and method using polymer material |
| US6311004B1 (en) * | 1998-11-10 | 2001-10-30 | Lightwave Microsystems | Photonic devices comprising thermo-optic polymer |
| EP1026526A1 (en) | 1999-02-02 | 2000-08-09 | Corning Incorporated | Athermalized polymer overclad integrated planar optical waveguide device and its manufacturing method |
| CA2271159A1 (en) * | 1999-04-30 | 2000-10-30 | Jds Fitel Inc. | Optical hybrid device |
| CA2314420C (en) * | 1999-07-27 | 2008-06-03 | Sumitomo Electric Industries, Ltd. | Optical filter |
| US6389209B1 (en) * | 1999-09-07 | 2002-05-14 | Agere Systems Optoelectronics Guardian Corp. | Strain free planar optical waveguides |
| US6704487B2 (en) * | 2001-08-10 | 2004-03-09 | Lightwave Microsystems Corporation | Method and system for reducing dn/dt birefringence in a thermo-optic PLC device |
| US20040005108A1 (en) | 2002-07-02 | 2004-01-08 | Kjetil Johannessen | Thermal compensation of waveguides by dual material core having negative thermo-optic coefficient inner core |
| US6987895B2 (en) | 2002-07-02 | 2006-01-17 | Intel Corporation | Thermal compensation of waveguides by dual material core having positive thermo-optic coefficient inner core |
-
2002
- 2002-07-02 US US10/190,411 patent/US6987895B2/en not_active Expired - Fee Related
-
2003
- 2003-05-29 DE DE60313776T patent/DE60313776T2/de not_active Expired - Lifetime
- 2003-05-29 AT AT03731473T patent/ATE362123T1/de not_active IP Right Cessation
- 2003-05-29 JP JP2004519571A patent/JP4221364B2/ja not_active Expired - Fee Related
- 2003-05-29 EP EP03731473A patent/EP1521986B1/en not_active Expired - Lifetime
- 2003-05-29 WO PCT/US2003/017180 patent/WO2004005988A1/en not_active Ceased
- 2003-05-29 AU AU2003240968A patent/AU2003240968A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US6987895B2 (en) | 2006-01-17 |
| EP1521986B1 (en) | 2007-05-09 |
| ATE362123T1 (de) | 2007-06-15 |
| WO2004005988A1 (en) | 2004-01-15 |
| JP2005531818A (ja) | 2005-10-20 |
| JP4221364B2 (ja) | 2009-02-12 |
| US20040005133A1 (en) | 2004-01-08 |
| AU2003240968A1 (en) | 2004-01-23 |
| DE60313776D1 (de) | 2007-06-21 |
| EP1521986A1 (en) | 2005-04-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |