DE60305590D1 - Vorrichtung und Verfahren zur Herstellung eines Bauteils aus einem Metall-Keramik-Komposit - Google Patents

Vorrichtung und Verfahren zur Herstellung eines Bauteils aus einem Metall-Keramik-Komposit

Info

Publication number
DE60305590D1
DE60305590D1 DE60305590T DE60305590T DE60305590D1 DE 60305590 D1 DE60305590 D1 DE 60305590D1 DE 60305590 T DE60305590 T DE 60305590T DE 60305590 T DE60305590 T DE 60305590T DE 60305590 D1 DE60305590 D1 DE 60305590D1
Authority
DE
Germany
Prior art keywords
producing
metal
component
ceramic composite
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60305590T
Other languages
English (en)
Other versions
DE60305590T2 (de
Inventor
Hideyo Osanai
Susumu Ibaragi
Makoto Namioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Application granted granted Critical
Publication of DE60305590D1 publication Critical patent/DE60305590D1/de
Publication of DE60305590T2 publication Critical patent/DE60305590T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/122—Metallic interlayers based on refractory metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Products (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casting Support Devices, Ladles, And Melt Control Thereby (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
DE60305590T 2002-09-13 2003-09-12 Vorrichtung und Verfahren zur Herstellung eines Bauteils aus einem Metall-Keramik-Komposit Expired - Lifetime DE60305590T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002268100 2002-09-13
JP2002268100A JP4324704B2 (ja) 2002-09-13 2002-09-13 金属−セラミックス複合部材の製造装置、製造用鋳型、並びに製造方法

Publications (2)

Publication Number Publication Date
DE60305590D1 true DE60305590D1 (de) 2006-07-06
DE60305590T2 DE60305590T2 (de) 2006-10-05

Family

ID=31944501

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60305590T Expired - Lifetime DE60305590T2 (de) 2002-09-13 2003-09-12 Vorrichtung und Verfahren zur Herstellung eines Bauteils aus einem Metall-Keramik-Komposit

Country Status (4)

Country Link
US (2) US7131483B2 (de)
EP (1) EP1400500B1 (de)
JP (1) JP4324704B2 (de)
DE (1) DE60305590T2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4324704B2 (ja) * 2002-09-13 2009-09-02 Ｄｏｗａメタルテック株式会社 金属−セラミックス複合部材の製造装置、製造用鋳型、並びに製造方法
JP4543279B2 (ja) * 2004-03-31 2010-09-15 Ｄｏｗａメタルテック株式会社 アルミニウム接合部材の製造方法
US7532481B2 (en) * 2004-04-05 2009-05-12 Mitsubishi Materials Corporation Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
JP4565249B2 (ja) * 2004-08-26 2010-10-20 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板およびその製造方法
JP4692716B2 (ja) * 2004-10-04 2011-06-01 Ｄｏｗａメタルテック株式会社 溶湯供給装置
JP5176042B2 (ja) * 2004-11-05 2013-04-03 Ｄｏｗａメタルテック株式会社 電子部品搭載基板の製造装置および製造方法
US7584778B2 (en) 2005-09-21 2009-09-08 United Technologies Corporation Method of producing a castable high temperature aluminum alloy by controlled solidification
JP4965305B2 (ja) * 2006-03-31 2012-07-04 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板の製造方法
US9179579B2 (en) * 2006-06-08 2015-11-03 International Business Machines Corporation Sheet having high thermal conductivity and flexibility
JP4965314B2 (ja) * 2007-03-30 2012-07-04 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板の製造装置
US8056606B2 (en) * 2009-10-26 2011-11-15 General Electric Company Methods of making and using ceramic metallic interlocked components
CN102401358B (zh) * 2010-09-10 2016-08-03 欧司朗股份有限公司 冷却体的制造方法、冷却体以及具有该冷却体的照明装置
JP5837754B2 (ja) * 2011-03-23 2015-12-24 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板およびその製造方法
JP6138026B2 (ja) * 2013-11-12 2017-05-31 日本メクトロン株式会社 導電ペーストの充填方法、および多層プリント配線板の製造方法
US10088456B2 (en) 2014-03-31 2018-10-02 Texas Instruments Incorporated Scanning acoustic microscopy system and method
JP2017212316A (ja) * 2016-05-25 2017-11-30 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合基板およびその製造方法
US10782316B2 (en) * 2017-01-09 2020-09-22 Delta Design, Inc. Socket side thermal system
JP2022048812A (ja) * 2020-09-15 2022-03-28 Ｄｏｗａメタルテック株式会社 放熱部材およびその製造方法
KR20240027784A (ko) 2021-06-30 2024-03-04 델타 디자인, 인코포레이티드 접촉기 어셈블리를 포함하는 온도 제어 시스템

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH416428A (fr) 1962-07-10 1966-06-30 British Aluminium Co Ltd Procédé pour assembler un métal conducteur de l'électricité avec un élément fait d'une substance dure réfractaire et assemblage obtenu par ce procédé
GB1211945A (en) 1968-02-22 1970-11-11 Lev Avromovich Volokhonsky Electric furnaces
US3842896A (en) * 1973-06-04 1974-10-22 Monsanto Co Method for producing composite metal wire
JP2918191B2 (ja) 1994-04-11 1999-07-12 同和鉱業株式会社 金属−セラミックス複合部材の製造方法
JP3286102B2 (ja) 1995-02-10 2002-05-27 日本碍子株式会社 複合鋳造体及びその製造方法
US5615727A (en) * 1995-02-24 1997-04-01 Ollman; Melvin L. Composite metal strip and methods of making same
JPH09315875A (ja) 1996-05-29 1997-12-09 Dowa Mining Co Ltd アルミニウム−セラミックス複合基板及びその製造方法
JP3837680B2 (ja) 1996-10-24 2006-10-25 同和鉱業株式会社 金属−セラミックス複合基板製造用鋳型
US5736199A (en) * 1996-12-05 1998-04-07 Northeastern University Gating system for continuous pressure infiltration processes
DE19731124C1 (de) * 1997-07-19 1999-01-21 Schloemann Siemag Ag Verfahren und Vorrichtung zur Erzeugung von beschichtetem Warm- und Kaltband
JP4237284B2 (ja) 1998-02-16 2009-03-11 Ｄｏｗａホールディングス株式会社 金属ーセラミックス複合部材の製造方法、製造装置、及び製造用鋳型
JP3452822B2 (ja) * 1999-01-12 2003-10-06 同和鉱業株式会社 アルミニウム−セラミックス複合部材の製造方法
JP3710048B2 (ja) * 2000-08-29 2005-10-26 矢崎総業株式会社 繊維束内へ金属を含浸させる圧力含浸装置
DE10142093B4 (de) * 2000-08-31 2004-02-12 Yazaki Corp. Verfahren zum Infiltrieren eines strangförmigen Materials mit einem geschmolzenen Metall und Vorrichtung hierfür
JP4756200B2 (ja) 2000-09-04 2011-08-24 Ｄｏｗａメタルテック株式会社 金属セラミックス回路基板
JP3613759B2 (ja) 2000-09-11 2005-01-26 同和鉱業株式会社 金属−セラミックス複合基板
US6705384B2 (en) * 2001-10-23 2004-03-16 Alcoa Inc. Simultaneous multi-alloy casting
JP4324704B2 (ja) 2002-09-13 2009-09-02 Ｄｏｗａメタルテック株式会社 金属−セラミックス複合部材の製造装置、製造用鋳型、並びに製造方法

Also Published As

Publication number Publication date
US20040123968A1 (en) 2004-07-01
US7131483B2 (en) 2006-11-07
EP1400500B1 (de) 2006-05-31
DE60305590T2 (de) 2006-10-05
JP4324704B2 (ja) 2009-09-02
JP2004105978A (ja) 2004-04-08
US8011416B2 (en) 2011-09-06
US20070017652A1 (en) 2007-01-25
EP1400500A1 (de) 2004-03-24

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