DE60237173D1 - Elektrostatisches futter - Google Patents

Elektrostatisches futter

Info

Publication number
DE60237173D1
DE60237173D1 DE60237173T DE60237173T DE60237173D1 DE 60237173 D1 DE60237173 D1 DE 60237173D1 DE 60237173 T DE60237173 T DE 60237173T DE 60237173 T DE60237173 T DE 60237173T DE 60237173 D1 DE60237173 D1 DE 60237173D1
Authority
DE
Germany
Prior art keywords
electrostatic
feed
electrostatic feed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60237173T
Other languages
English (en)
Inventor
Kazuto Yoshida
Masahiko Inoue
Ryuichi Matsuda
Hitoshi Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Application granted granted Critical
Publication of DE60237173D1 publication Critical patent/DE60237173D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60237173T 2002-12-26 2002-12-26 Elektrostatisches futter Expired - Lifetime DE60237173D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/013645 WO2004061941A1 (ja) 2002-12-26 2002-12-26 静電チャック

Publications (1)

Publication Number Publication Date
DE60237173D1 true DE60237173D1 (de) 2010-09-09

Family

ID=32697306

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60237173T Expired - Lifetime DE60237173D1 (de) 2002-12-26 2002-12-26 Elektrostatisches futter

Country Status (5)

Country Link
US (1) US7283346B2 (de)
EP (1) EP1577937B1 (de)
KR (1) KR100573351B1 (de)
DE (1) DE60237173D1 (de)
WO (1) WO2004061941A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008041993A (ja) * 2006-08-08 2008-02-21 Shinko Electric Ind Co Ltd 静電チャック
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
WO2010132640A2 (en) 2009-05-15 2010-11-18 Entegris, Inc. Electrostatic chuck with polymer protrusions
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
CN105196094B (zh) 2010-05-28 2018-01-26 恩特格林斯公司 高表面电阻率静电吸盘
US8840754B2 (en) * 2010-09-17 2014-09-23 Lam Research Corporation Polar regions for electrostatic de-chucking with lift pins
JP6924618B2 (ja) * 2017-05-30 2021-08-25 東京エレクトロン株式会社 静電チャック及びプラズマ処理装置
JP7145042B2 (ja) * 2018-11-08 2022-09-30 東京エレクトロン株式会社 基板支持器及びプラズマ処理装置
KR102497965B1 (ko) * 2019-03-18 2023-02-08 엔지케이 인슐레이터 엘티디 정전 척
KR20220056877A (ko) * 2019-09-19 2022-05-06 어플라이드 머티어리얼스, 인코포레이티드 페디스털 가열기를 세정하기 위한 인-시츄 dc 플라즈마
KR20210089375A (ko) * 2020-01-08 2021-07-16 주식회사 미코세라믹스 정전척
CN111564635B (zh) * 2020-04-22 2021-10-22 北京科技大学 一种柔性可拉伸锌聚合物电池及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001594A (en) * 1989-09-06 1991-03-19 Mcnc Electrostatic handling device
US5166856A (en) * 1991-01-31 1992-11-24 International Business Machines Corporation Electrostatic chuck with diamond coating
JP3218717B2 (ja) 1992-08-25 2001-10-15 富士電機株式会社 静電チャック
EP0635870A1 (de) * 1993-07-20 1995-01-25 Applied Materials, Inc. Eine elektrostatische Halteplatte mit einer gerillten Fläche
JPH0855900A (ja) 1994-08-11 1996-02-27 Fujitsu Ltd 静電吸着方法とその装置と半導体装置の製造方法
DE69530801T2 (de) * 1994-10-17 2004-03-11 Varian Semiconductor Equipment Associates Inc., Gloucester Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes
US5993678A (en) * 1996-07-31 1999-11-30 Toyo Technologies Inc. Device and method for processing a plasma to alter the surface of a substrate
TW334609B (en) * 1996-09-19 1998-06-21 Hitachi Ltd Electrostatic chuck, method and device for processing sanyle use the same
JP3892609B2 (ja) * 1999-02-16 2007-03-14 株式会社東芝 ホットプレートおよび半導体装置の製造方法
JP4402862B2 (ja) * 1999-07-08 2010-01-20 ラム リサーチ コーポレーション 静電チャックおよびその製造方法
JP2002026113A (ja) * 2000-07-10 2002-01-25 Toshiba Corp ホットプレート及び半導体装置の製造方法
JP3693895B2 (ja) * 2000-07-24 2005-09-14 住友大阪セメント株式会社 可撓性フィルムの静電吸着装置、可撓性フィルムの静電吸着方法、可撓性フィルムの表面処理方法
JP2003317906A (ja) * 2002-04-24 2003-11-07 Sumitomo Electric Ind Ltd セラミックスヒータ

Also Published As

Publication number Publication date
US7283346B2 (en) 2007-10-16
US20040233609A1 (en) 2004-11-25
EP1577937A4 (de) 2007-08-22
KR100573351B1 (ko) 2006-04-25
WO2004061941A1 (ja) 2004-07-22
KR20040074597A (ko) 2004-08-25
EP1577937A1 (de) 2005-09-21
EP1577937B1 (de) 2010-07-28

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