DE60228572D1 - Material mit leitfähigem muster und material sowie methode zur herstellung eines leitfähigen musters - Google Patents

Material mit leitfähigem muster und material sowie methode zur herstellung eines leitfähigen musters

Info

Publication number
DE60228572D1
DE60228572D1 DE60228572T DE60228572T DE60228572D1 DE 60228572 D1 DE60228572 D1 DE 60228572D1 DE 60228572 T DE60228572 T DE 60228572T DE 60228572 T DE60228572 T DE 60228572T DE 60228572 D1 DE60228572 D1 DE 60228572D1
Authority
DE
Germany
Prior art keywords
conductive pattern
producing
conductive
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60228572T
Other languages
German (de)
English (en)
Inventor
Johan Lamotte
David Terrell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agfa Gevaert NV
Agfa Gevaert AG
Original Assignee
Agfa Gevaert NV
Agfa Gevaert AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/EP2001/007083 external-priority patent/WO2002006898A2/en
Priority claimed from US09/891,649 external-priority patent/US6638680B2/en
Application filed by Agfa Gevaert NV, Agfa Gevaert AG filed Critical Agfa Gevaert NV
Application granted granted Critical
Publication of DE60228572D1 publication Critical patent/DE60228572D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/093—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antistatic means, e.g. for charge depletion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • G03F7/0163—Non ionic diazonium compounds, e.g. diazosulphonates; Precursors thereof, e.g. triazenes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Laminated Bodies (AREA)
DE60228572T 2001-06-22 2002-06-18 Material mit leitfähigem muster und material sowie methode zur herstellung eines leitfähigen musters Expired - Fee Related DE60228572D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
PCT/EP2001/007083 WO2002006898A2 (en) 2000-06-26 2001-06-22 Material and method for making an electroconductive pattern
US09/891,649 US6638680B2 (en) 2000-06-26 2001-06-26 Material and method for making an electroconductive pattern
EP01000731 2001-12-10
PCT/EP2002/006740 WO2003001299A1 (en) 2001-06-22 2002-06-18 Material having a conductive pattern; and a material and method for making a conductive pattern

Publications (1)

Publication Number Publication Date
DE60228572D1 true DE60228572D1 (de) 2008-10-09

Family

ID=39736484

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60228572T Expired - Fee Related DE60228572D1 (de) 2001-06-22 2002-06-18 Material mit leitfähigem muster und material sowie methode zur herstellung eines leitfähigen musters

Country Status (5)

Country Link
EP (1) EP1402319B1 (https=)
JP (1) JP4287741B2 (https=)
KR (1) KR100883215B1 (https=)
DE (1) DE60228572D1 (https=)
WO (1) WO2003001299A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7223571B2 (en) 1998-04-02 2007-05-29 The Board Of Regents Of The Universtiy Of Oklahoma Targeted glycosaminoglycan polymers by polymer grafting and methods of making and using same
US20040260016A1 (en) 2003-06-20 2004-12-23 Agfa-Gevaert Process for preparing electroconductive coatings
WO2005038911A1 (en) 2003-10-15 2005-04-28 Koninklijke Philips Electronics N.V. Device, system and electric element
JP4786206B2 (ja) * 2004-11-22 2011-10-05 信越ポリマー株式会社 帯電防止塗料、帯電防止膜及び帯電防止フィルム、光学フィルタ、光情報記録媒体
TWI325007B (en) 2004-10-08 2010-05-21 Shinetsu Polymer Co Conductive composition and production method thereof, antistatic coating material, antistatic coating, antistatic film, optical filter, and optical information recording medium, and capacitors and production method thereof
CN101681131A (zh) * 2007-06-12 2010-03-24 东亚合成株式会社 导电性高分子上的抗蚀剂膜的剥离剂、抗蚀剂膜的剥离方法及具有已图案化的导电性高分子的基板
US8987720B2 (en) 2010-12-13 2015-03-24 Konica Minolta, Inc. Transparent surface electrode, organic electronic element, and method for manufacturing transparent surface electrode
JP5774686B2 (ja) * 2011-04-26 2015-09-09 日本メクトロン株式会社 透明プリント配線板の製造方法、および透明タッチパネルの製造方法
KR101440859B1 (ko) * 2013-06-04 2014-09-17 에스케이씨 주식회사 전도성 고분자 필름용 전도성 저감제 및 이를 이용한 패턴 형성 방법
FR3108756B1 (fr) * 2020-03-30 2022-04-01 Commissariat Energie Atomique Capteur de motif thermique
CN120686540B (zh) * 2025-08-25 2025-10-28 合肥工业大学 水基显影可精密图案化的聚乙烯醇基透明复合导电材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR9307150A (pt) * 1992-09-30 1999-03-30 Dow Chemical Co Polímeros eletrostaticamente pintados e um processo para fazer os mesmos
US5370825A (en) * 1993-03-03 1994-12-06 International Business Machines Corporation Water-soluble electrically conducting polymers, their synthesis and use
DE19524132A1 (de) 1995-07-03 1997-01-09 Bayer Ag Kratzfeste leitfähige Beschichtungen
JP4823401B2 (ja) * 1996-12-30 2011-11-24 イドロ―ケベック 過フッ化アミド塩及びイオン伝導物質としてのその使用方法
WO1999005126A1 (fr) * 1997-07-25 1999-02-04 Acep Inc. Composes ioniques perfluorovinyliques et leur utilisation dans des materiaux conducteurs
DE19824186A1 (de) * 1998-05-29 1999-12-02 Bayer Ag Elektrochrome Anordnung auf Basis von Poly-(3,4-ethylendioxy-thiophen)-Derivaten und Gel-Elektrolyt mit UV-Schutz

Also Published As

Publication number Publication date
EP1402319B1 (en) 2008-08-27
JP4287741B2 (ja) 2009-07-01
KR100883215B1 (ko) 2009-02-13
EP1402319A1 (en) 2004-03-31
JP2004533519A (ja) 2004-11-04
WO2003001299A1 (en) 2003-01-03
KR20040030695A (ko) 2004-04-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee