DE60226773D1 - Verfahren zur verbesserung von klarfeld-phasenverschiebungsmasken durch hinzufügen einer parallelen linie zu der phase-0-region - Google Patents

Verfahren zur verbesserung von klarfeld-phasenverschiebungsmasken durch hinzufügen einer parallelen linie zu der phase-0-region

Info

Publication number
DE60226773D1
DE60226773D1 DE60226773T DE60226773T DE60226773D1 DE 60226773 D1 DE60226773 D1 DE 60226773D1 DE 60226773 T DE60226773 T DE 60226773T DE 60226773 T DE60226773 T DE 60226773T DE 60226773 D1 DE60226773 D1 DE 60226773D1
Authority
DE
Germany
Prior art keywords
phase
region
parallel line
shift masks
phase shift
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60226773T
Other languages
English (en)
Inventor
Todd P Lukanc
Christopher A Spence
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of DE60226773D1 publication Critical patent/DE60226773D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE60226773T 2001-12-11 2002-12-09 Verfahren zur verbesserung von klarfeld-phasenverschiebungsmasken durch hinzufügen einer parallelen linie zu der phase-0-region Expired - Lifetime DE60226773D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/016,702 US6675369B1 (en) 2001-12-11 2001-12-11 Method of enhancing clear field phase shift masks by adding parallel line to phase 0 region
PCT/US2002/039483 WO2003050617A2 (en) 2001-12-11 2002-12-09 Method of enhancing clear field phase shift masks by adding parallel line to phase 0 region

Publications (1)

Publication Number Publication Date
DE60226773D1 true DE60226773D1 (de) 2008-07-03

Family

ID=21778489

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60226773T Expired - Lifetime DE60226773D1 (de) 2001-12-11 2002-12-09 Verfahren zur verbesserung von klarfeld-phasenverschiebungsmasken durch hinzufügen einer parallelen linie zu der phase-0-region

Country Status (9)

Country Link
US (1) US6675369B1 (de)
EP (1) EP1454192B1 (de)
JP (1) JP2005513519A (de)
KR (1) KR100931707B1 (de)
CN (1) CN100520575C (de)
AU (1) AU2002357141A1 (de)
DE (1) DE60226773D1 (de)
TW (1) TWI265371B (de)
WO (1) WO2003050617A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6534224B2 (en) * 2001-01-30 2003-03-18 Advanced Micro Devices, Inc. Phase shift mask and system and method for making the same
US6711732B1 (en) * 2002-07-26 2004-03-23 Taiwan Semiconductor Manufacturing Company Full sized scattering bar alt-PSM technique for IC manufacturing in sub-resolution era
US7149998B2 (en) * 2002-12-30 2006-12-12 Synopsys Inc. Lithography process modeling of asymmetric patterns
US7615318B2 (en) * 2004-10-22 2009-11-10 Freescale Semiconductor Inc. Printing of design features using alternating PSM technology with double mask exposure strategy
US8056026B2 (en) * 2008-12-14 2011-11-08 International Business Machines Corporation Determining manufacturability of lithographic mask by selecting target edge pairs used in determining a manufacturing penalty of the lithographic mask
US8056023B2 (en) * 2008-12-14 2011-11-08 International Business Machines Corporation Determining manufacturability of lithographic mask by reducing target edge pairs used in determining a manufacturing penalty of the lithographic mask

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3153230B2 (ja) 1990-09-10 2001-04-03 株式会社日立製作所 パタン形成方法
JP3334911B2 (ja) 1992-07-31 2002-10-15 キヤノン株式会社 パターン形成方法
JP3078163B2 (ja) 1993-10-15 2000-08-21 キヤノン株式会社 リソグラフィ用反射型マスクおよび縮小投影露光装置
US5573890A (en) 1994-07-18 1996-11-12 Advanced Micro Devices, Inc. Method of optical lithography using phase shift masking
US5619059A (en) 1994-09-28 1997-04-08 National Research Council Of Canada Color deformable mirror device having optical thin film interference color coatings
US5521031A (en) * 1994-10-20 1996-05-28 At&T Corp. Pattern delineating apparatus for use in the EUV spectrum
US5858580A (en) 1997-09-17 1999-01-12 Numerical Technologies, Inc. Phase shifting circuit manufacture method and apparatus
US6228539B1 (en) 1996-09-18 2001-05-08 Numerical Technologies, Inc. Phase shifting circuit manufacture method and apparatus
US5807649A (en) 1996-10-31 1998-09-15 International Business Machines Corporation Lithographic patterning method and mask set therefor with light field trim mask
US5780187A (en) 1997-02-26 1998-07-14 Micron Technology, Inc. Repair of reflective photomask used in semiconductor process
US6013399A (en) 1998-12-04 2000-01-11 Advanced Micro Devices, Inc. Reworkable EUV mask materials
JP3257593B2 (ja) * 1999-02-05 2002-02-18 日本電気株式会社 半導体装置の製造方法
JP3335138B2 (ja) * 1999-06-04 2002-10-15 キヤノン株式会社 露光方法、露光装置、およびデバイス製造方法
US6410193B1 (en) 1999-12-30 2002-06-25 Intel Corporation Method and apparatus for a reflective mask that is inspected at a first wavelength and exposed during semiconductor manufacturing at a second wavelength
JP2001228599A (ja) * 2000-02-21 2001-08-24 Matsushita Electric Ind Co Ltd 補助パターン生成方法および半導体マスクレイアウトパターンの自動生成方法
US6338922B1 (en) * 2000-05-08 2002-01-15 International Business Machines Corporation Optimized alternating phase shifted mask design

Also Published As

Publication number Publication date
JP2005513519A (ja) 2005-05-12
TW200301844A (en) 2003-07-16
TWI265371B (en) 2006-11-01
EP1454192A2 (de) 2004-09-08
US6675369B1 (en) 2004-01-06
KR20040065265A (ko) 2004-07-21
KR100931707B1 (ko) 2009-12-14
AU2002357141A1 (en) 2003-06-23
CN100520575C (zh) 2009-07-29
WO2003050617A3 (en) 2003-12-04
CN1701279A (zh) 2005-11-23
WO2003050617A2 (en) 2003-06-19
EP1454192B1 (de) 2008-05-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: GLOBALFOUNDRIES INC., GRAND CAYMAN, KY

8328 Change in the person/name/address of the agent

Representative=s name: GRUENECKER, KINKELDEY, STOCKMAIR & SCHWANHAEUSSER,