DE602008001998D1 - Verfahren zur Beurteilung eines Halbleitersubstrats - Google Patents
Verfahren zur Beurteilung eines HalbleitersubstratsInfo
- Publication number
- DE602008001998D1 DE602008001998D1 DE602008001998T DE602008001998T DE602008001998D1 DE 602008001998 D1 DE602008001998 D1 DE 602008001998D1 DE 602008001998 T DE602008001998 T DE 602008001998T DE 602008001998 T DE602008001998 T DE 602008001998T DE 602008001998 D1 DE602008001998 D1 DE 602008001998D1
- Authority
- DE
- Germany
- Prior art keywords
- evaluating
- semiconductor substrate
- semiconductor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
- G01N21/6489—Photoluminescence of semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
- G01N21/645—Specially adapted constructive features of fluorimeters
- G01N21/6456—Spatial resolved fluorescence measurements; Imaging
- G01N2021/646—Detecting fluorescent inhomogeneities at a position, e.g. for detecting defects
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Pathology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Led Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007045411A JP5024865B2 (ja) | 2007-02-26 | 2007-02-26 | 半導体基板の評価方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602008001998D1 true DE602008001998D1 (de) | 2010-09-16 |
Family
ID=39315366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602008001998T Active DE602008001998D1 (de) | 2007-02-26 | 2008-02-26 | Verfahren zur Beurteilung eines Halbleitersubstrats |
Country Status (4)
Country | Link |
---|---|
US (1) | US7947967B2 (de) |
EP (1) | EP1962339B1 (de) |
JP (1) | JP5024865B2 (de) |
DE (1) | DE602008001998D1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100178718A1 (en) * | 2009-01-13 | 2010-07-15 | Maxim Kelman | Methods for improving performance variation of a solar cell manufacturing process |
JP5557368B2 (ja) * | 2009-04-24 | 2014-07-23 | 学校法人東京電機大学 | 半導体検査装置及び半導体検査方法 |
WO2011009159A1 (en) * | 2009-07-20 | 2011-01-27 | Bt Imaging Pty Ltd | Separation of doping density and minority carrier lifetime in photoluminescence measurements on semiconductor materials |
US8330946B2 (en) * | 2009-12-15 | 2012-12-11 | Nanometrics Incorporated | Silicon filter for photoluminescence metrology |
TW201315202A (zh) * | 2011-09-30 | 2013-04-01 | Smobio Inc | 掃描裝置 |
JP5904304B2 (ja) * | 2013-04-17 | 2016-04-13 | 新日鐵住金株式会社 | 金属の欠陥検出方法 |
KR102068741B1 (ko) | 2013-06-04 | 2020-01-22 | 삼성디스플레이 주식회사 | 다결정 규소막의 검사 방법 |
US9685906B2 (en) * | 2013-07-03 | 2017-06-20 | Semilab SDI LLC | Photoluminescence mapping of passivation defects for silicon photovoltaics |
DE102013112885A1 (de) * | 2013-11-21 | 2015-05-21 | Osram Opto Semiconductors Gmbh | Verfahren zur optischen Charakterisierung eines optoelektronischen Halbleitermaterials und Vorrichtung zur Durchführung des Verfahrens |
KR101614225B1 (ko) | 2014-12-29 | 2016-04-20 | 주식회사 엘지실트론 | 웨이퍼 오염 검출방법 |
US10018565B2 (en) | 2015-05-04 | 2018-07-10 | Semilab Semiconductor Physics Laboratory Co., Ltd. | Micro photoluminescence imaging with optical filtering |
US10012593B2 (en) | 2015-05-04 | 2018-07-03 | Semilab Semiconductor Physics Laboratory Co., Ltd. | Micro photoluminescence imaging |
US10883941B2 (en) * | 2015-05-04 | 2021-01-05 | Semilab Semiconductor Physics Laboratory Co., Ltd. | Micro photoluminescence imaging |
CN104907952A (zh) * | 2015-05-14 | 2015-09-16 | 苏州市职业大学 | 一种可快速更换钳口的虎钳 |
CN109507559A (zh) * | 2017-09-15 | 2019-03-22 | 上海新昇半导体科技有限公司 | 一种硅片少子寿命的测试方法及测试装置 |
CN110544643B (zh) * | 2019-09-11 | 2022-06-28 | 东方日升(常州)新能源有限公司 | 无损伤快速判断金属浆料烧穿深度的方法 |
JPWO2021117818A1 (de) * | 2019-12-11 | 2021-06-17 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02296136A (ja) * | 1989-05-10 | 1990-12-06 | Hikari Gijutsu Kenkyu Kaihatsu Kk | 化合物半導体のホトルミネッセンス測定方法 |
JPH031553A (ja) * | 1989-05-30 | 1991-01-08 | Hikari Gijutsu Kenkyu Kaihatsu Kk | 半導体の測定方法及び測定装置 |
JP2946879B2 (ja) * | 1991-10-31 | 1999-09-06 | 日本電気株式会社 | 半導体ウェーハのキャリアのライフタイム測定方法 |
JP3646453B2 (ja) * | 1997-02-18 | 2005-05-11 | 株式会社デンソー | エッチングの終点検出方法 |
JP2004340652A (ja) * | 2003-05-14 | 2004-12-02 | Hitachi Ltd | 欠陥検査装置および陽電子線応用装置 |
JP3917154B2 (ja) * | 2004-11-19 | 2007-05-23 | 独立行政法人 宇宙航空研究開発機構 | 半導体試料の欠陥評価方法及び装置 |
US20070000434A1 (en) | 2005-06-30 | 2007-01-04 | Accent Optical Technologies, Inc. | Apparatuses and methods for detecting defects in semiconductor workpieces |
DE102006049683B3 (de) * | 2006-10-13 | 2008-05-29 | Q-Cells Ag | Verfahren und Vorrichtung zum Charakterisieren von Wafern bei der Herstellung von Solarzellen |
-
2007
- 2007-02-26 JP JP2007045411A patent/JP5024865B2/ja not_active Expired - Fee Related
-
2008
- 2008-02-26 DE DE602008001998T patent/DE602008001998D1/de active Active
- 2008-02-26 EP EP08003500A patent/EP1962339B1/de not_active Expired - Fee Related
- 2008-02-26 US US12/037,744 patent/US7947967B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1962339A1 (de) | 2008-08-27 |
JP5024865B2 (ja) | 2012-09-12 |
US20080213926A1 (en) | 2008-09-04 |
EP1962339B1 (de) | 2010-08-04 |
JP2008210947A (ja) | 2008-09-11 |
US7947967B2 (en) | 2011-05-24 |
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