DE602007001663D1 - Vorrichtung mit integrierten elektronischen Bauteilen, die mit einer Trennwand der belüfteten Zonen ausgestattet ist - Google Patents
Vorrichtung mit integrierten elektronischen Bauteilen, die mit einer Trennwand der belüfteten Zonen ausgestattet istInfo
- Publication number
- DE602007001663D1 DE602007001663D1 DE602007001663T DE602007001663T DE602007001663D1 DE 602007001663 D1 DE602007001663 D1 DE 602007001663D1 DE 602007001663 T DE602007001663 T DE 602007001663T DE 602007001663 T DE602007001663 T DE 602007001663T DE 602007001663 D1 DE602007001663 D1 DE 602007001663D1
- Authority
- DE
- Germany
- Prior art keywords
- space
- gas
- integrated electronic
- partition wall
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Constitution Of High-Frequency Heating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0611024A FR2910227A1 (fr) | 2006-12-18 | 2006-12-18 | Dispositif a composants electroniques integres muni d'une cloison de separation de zones ventilees |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602007001663D1 true DE602007001663D1 (de) | 2009-09-03 |
Family
ID=38514265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602007001663T Active DE602007001663D1 (de) | 2006-12-18 | 2007-11-22 | Vorrichtung mit integrierten elektronischen Bauteilen, die mit einer Trennwand der belüfteten Zonen ausgestattet ist |
Country Status (7)
Country | Link |
---|---|
US (1) | US7706141B2 (de) |
EP (1) | EP1937048B1 (de) |
AT (1) | ATE437558T1 (de) |
CA (1) | CA2613270A1 (de) |
DE (1) | DE602007001663D1 (de) |
ES (1) | ES2330155T3 (de) |
FR (1) | FR2910227A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2901668B1 (fr) * | 2006-06-06 | 2008-09-26 | Sagem Defense Securite | Vetement modulaire |
JP5164706B2 (ja) * | 2008-07-17 | 2013-03-21 | オリンパスメディカルシステムズ株式会社 | 装置内冷却構造、及び超音波観測装置 |
US20110085296A1 (en) * | 2009-10-14 | 2011-04-14 | Brandon Rubenstein | Cooling System For A Computer Blade |
DE112016007360T5 (de) * | 2016-10-21 | 2019-07-04 | Mitsubishi Electric Corporation | Halbleitermodul und elektrische Leistungsumwandlungsvorrichtung |
DE102016226094A1 (de) * | 2016-12-22 | 2018-06-28 | Robert Bosch Gmbh | Elektronisches Gerät mit Elektronikgehäuse mit mehreren Kammern |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4399485A (en) * | 1980-03-24 | 1983-08-16 | Ampex Corporation | Air baffle assembly for electronic circuit mounting frame |
JPS62117399A (ja) * | 1985-11-18 | 1987-05-28 | 富士通株式会社 | プリント板パツケ−ジ |
US4894749A (en) * | 1987-08-31 | 1990-01-16 | AT&T Information Systems Inc American Telephone and Telegraph Company | Option slot filler board |
US4860163A (en) * | 1988-08-05 | 1989-08-22 | American Telephone And Telegraph Company | Communication equipment cabinet cooling arrangement |
US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
JPH02130894A (ja) * | 1988-11-11 | 1990-05-18 | Hitachi Ltd | 空冷電子機器の冷却構造 |
US5103374A (en) * | 1990-05-23 | 1992-04-07 | At&T Bell Laboratories | Circuit pack cooling using turbulators |
CH680693A5 (de) * | 1990-08-07 | 1992-10-15 | Sulzer Ag | |
FR2693621B1 (fr) * | 1992-07-08 | 1994-09-16 | Sextant Avionique | Structure modulaire porte-carte de circuit imprimé, apte à venir s'engager, à la façon d'un tiroir, dans une baie d'une installation électronique. |
US5563768A (en) * | 1995-08-31 | 1996-10-08 | At&T Global Information Solutions Company | Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid |
JP3889114B2 (ja) * | 1997-05-28 | 2007-03-07 | 富士通株式会社 | 電子機器 |
US5914858A (en) * | 1997-11-13 | 1999-06-22 | Northern Telecom Limited | Baffle arrangement for an airflow balance system |
JP3408424B2 (ja) * | 1998-07-28 | 2003-05-19 | 日本電気株式会社 | 電子機器の冷却構造 |
US6400567B1 (en) * | 2000-10-19 | 2002-06-04 | Fujitsu Network Communications, Inc. | Equipment enclosure having separate compartments cooled by separate cooling airflows |
US6525936B2 (en) * | 2001-04-30 | 2003-02-25 | Hewlett-Packard Company | Air jet cooling arrangement for electronic systems |
US6904968B2 (en) * | 2001-09-14 | 2005-06-14 | Hewlett-Packard Development Company, L.P. | Method and apparatus for individually cooling components of electronic systems |
US6679315B2 (en) * | 2002-01-14 | 2004-01-20 | Marconi Communications, Inc. | Small scale chip cooler assembly |
US6955062B2 (en) * | 2002-03-11 | 2005-10-18 | Isothermal Systems Research, Inc. | Spray cooling system for transverse thin-film evaporative spray cooling |
JP4312424B2 (ja) * | 2002-06-14 | 2009-08-12 | 株式会社日立製作所 | ディスクアレイ装置 |
JP4012091B2 (ja) * | 2003-02-20 | 2007-11-21 | 富士通株式会社 | 電子装置の冷却構造及び情報処理装置 |
US6927975B2 (en) * | 2003-06-27 | 2005-08-09 | International Business Machines Corporation | Server blade modular chassis mechanical and thermal design |
US6961242B2 (en) * | 2003-07-31 | 2005-11-01 | Hewlett-Packard Development Company, L.P. | System fan management based on system loading options for a system having replaceable electronics modules |
US6912131B2 (en) * | 2003-08-27 | 2005-06-28 | Lucent Technologies Inc. | Electronic components card air deflector |
US7012807B2 (en) * | 2003-09-30 | 2006-03-14 | International Business Machines Corporation | Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack |
FR2864423B1 (fr) * | 2003-12-23 | 2006-04-07 | Sagem | Dispositif a composants electroniques integres muni d'une cloison de separation de zones. |
US7361081B2 (en) * | 2004-07-23 | 2008-04-22 | Hewlett-Packard Development Company, L.P. | Small form factor air jet cooling system |
US7218516B2 (en) * | 2004-09-24 | 2007-05-15 | Shuttle, Inc. | Inlet airflow guiding structure for computers |
US7307840B2 (en) * | 2005-10-14 | 2007-12-11 | Smiths Aerospace Llc | Cross-flow redundant air cooling method for high reliability electronics |
US7529087B2 (en) * | 2006-02-24 | 2009-05-05 | Cisco Technology, Inc. | Method and apparatus for ventilating a computerized device |
-
2006
- 2006-12-18 FR FR0611024A patent/FR2910227A1/fr not_active Withdrawn
-
2007
- 2007-11-22 ES ES07121320T patent/ES2330155T3/es active Active
- 2007-11-22 EP EP07121320A patent/EP1937048B1/de active Active
- 2007-11-22 AT AT07121320T patent/ATE437558T1/de not_active IP Right Cessation
- 2007-11-22 DE DE602007001663T patent/DE602007001663D1/de active Active
- 2007-12-13 US US11/955,991 patent/US7706141B2/en active Active
- 2007-12-13 CA CA002613270A patent/CA2613270A1/fr not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US7706141B2 (en) | 2010-04-27 |
EP1937048B1 (de) | 2009-07-22 |
US20080151494A1 (en) | 2008-06-26 |
EP1937048A1 (de) | 2008-06-25 |
FR2910227A1 (fr) | 2008-06-20 |
CA2613270A1 (fr) | 2008-06-18 |
ATE437558T1 (de) | 2009-08-15 |
ES2330155T3 (es) | 2009-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |