DE602006021413D1 - Gehäuse für MEMS Bauteile - Google Patents

Gehäuse für MEMS Bauteile

Info

Publication number
DE602006021413D1
DE602006021413D1 DE602006021413T DE602006021413T DE602006021413D1 DE 602006021413 D1 DE602006021413 D1 DE 602006021413D1 DE 602006021413 T DE602006021413 T DE 602006021413T DE 602006021413 T DE602006021413 T DE 602006021413T DE 602006021413 D1 DE602006021413 D1 DE 602006021413D1
Authority
DE
Germany
Prior art keywords
housing
mems components
mems
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006021413T
Other languages
English (en)
Inventor
Federico Giovanni Ziglioli
Giovanni Graziosi
Mark Andrew Shaw
Mario Francesco Cortese
Conrad Max Cachia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
STMicroelectronics Malta Ltd
Original Assignee
STMicroelectronics SRL
STMicroelectronics Malta Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL, STMicroelectronics Malta Ltd filed Critical STMicroelectronics SRL
Publication of DE602006021413D1 publication Critical patent/DE602006021413D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/096—Feed-through, via through the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Micromachines (AREA)
DE602006021413T 2006-07-14 2006-07-14 Gehäuse für MEMS Bauteile Active DE602006021413D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06014651A EP1878692B1 (de) 2006-07-14 2006-07-14 Gehäuse für MEMS Bauteile

Publications (1)

Publication Number Publication Date
DE602006021413D1 true DE602006021413D1 (de) 2011-06-01

Family

ID=37495876

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006021413T Active DE602006021413D1 (de) 2006-07-14 2006-07-14 Gehäuse für MEMS Bauteile

Country Status (3)

Country Link
US (1) US8633583B2 (de)
EP (2) EP1878692B1 (de)
DE (1) DE602006021413D1 (de)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19719983C2 (de) * 1996-05-17 2003-05-15 Nat Semiconductor Corp Montageplatte für Halbleiterbausteine und Verfahren zur Herstellung hiervon
JP3633252B2 (ja) * 1997-01-10 2005-03-30 イビデン株式会社 プリント配線板及びその製造方法
JPH11307689A (ja) * 1998-02-17 1999-11-05 Seiko Epson Corp 半導体装置、半導体装置用基板及びこれらの製造方法並びに電子機器
US6084297A (en) * 1998-09-03 2000-07-04 Micron Technology, Inc. Cavity ball grid array apparatus
JP3844936B2 (ja) * 1999-03-26 2006-11-15 富士通株式会社 半導体装置
US20020096760A1 (en) * 2001-01-24 2002-07-25 Gregory Simelgor Side access layer for semiconductor chip or stack thereof
US6803650B2 (en) * 2001-02-23 2004-10-12 Silicon Bandwidth Inc. Semiconductor die package having mesh power and ground planes
JP2003234433A (ja) * 2001-10-01 2003-08-22 Matsushita Electric Ind Co Ltd 半導体装置、半導体装置の実装方法、ならびに実装体およびその製造方法
EP1365450A1 (de) * 2002-05-24 2003-11-26 Ultratera Corporation Verbessertes drahtgebundenes Chip-on-board-Gehäuse
US20040021213A1 (en) * 2002-08-05 2004-02-05 Low Shin Shern Thermally-enhanced integrated circuit package
US6855573B2 (en) * 2002-09-19 2005-02-15 St Assembly Test Services Ltd. Integrated circuit package and manufacturing method therefor with unique interconnector
KR100541655B1 (ko) * 2004-01-07 2006-01-11 삼성전자주식회사 패키지 회로기판 및 이를 이용한 패키지
JP4343044B2 (ja) * 2004-06-30 2009-10-14 新光電気工業株式会社 インターポーザ及びその製造方法並びに半導体装置
JP4651359B2 (ja) * 2004-10-29 2011-03-16 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
EP1878692B1 (de) 2011-04-20
US20080128891A1 (en) 2008-06-05
US8633583B2 (en) 2014-01-21
EP1878692A1 (de) 2008-01-16
EP2272794A1 (de) 2011-01-12

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