DE602006012652D1 - Verfahren zum erzeugen und verwenden eines plasmaverarbeitungs-steuerprogramms - Google Patents

Verfahren zum erzeugen und verwenden eines plasmaverarbeitungs-steuerprogramms

Info

Publication number
DE602006012652D1
DE602006012652D1 DE602006012652T DE602006012652T DE602006012652D1 DE 602006012652 D1 DE602006012652 D1 DE 602006012652D1 DE 602006012652 T DE602006012652 T DE 602006012652T DE 602006012652 T DE602006012652 T DE 602006012652T DE 602006012652 D1 DE602006012652 D1 DE 602006012652D1
Authority
DE
Germany
Prior art keywords
producing
control program
plasma processing
processing control
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006012652T
Other languages
English (en)
Inventor
Andrew Leonard Goodyear
Philip Douglas Rossbrook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxford Instruments Plasma Technology Ltd
Original Assignee
Oxford Instruments Plasma Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxford Instruments Plasma Technology Ltd filed Critical Oxford Instruments Plasma Technology Ltd
Publication of DE602006012652D1 publication Critical patent/DE602006012652D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32128—Gui graphical user interface
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
DE602006012652T 2005-04-28 2006-04-25 Verfahren zum erzeugen und verwenden eines plasmaverarbeitungs-steuerprogramms Active DE602006012652D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0508706.9A GB0508706D0 (en) 2005-04-28 2005-04-28 Method of generating and using a plasma processing control program
PCT/GB2006/001490 WO2006114595A1 (en) 2005-04-28 2006-04-25 Method of generating and using a plasma processing control program

Publications (1)

Publication Number Publication Date
DE602006012652D1 true DE602006012652D1 (de) 2010-04-15

Family

ID=34674041

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006012652T Active DE602006012652D1 (de) 2005-04-28 2006-04-25 Verfahren zum erzeugen und verwenden eines plasmaverarbeitungs-steuerprogramms

Country Status (5)

Country Link
US (1) US7822494B2 (de)
EP (1) EP1877878B1 (de)
DE (1) DE602006012652D1 (de)
GB (1) GB0508706D0 (de)
WO (1) WO2006114595A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8555206B2 (en) 2007-12-21 2013-10-08 Fisher-Rosemount Systems, Inc. Methods and apparatus to present recipe progress status information
JP5383265B2 (ja) * 2009-03-17 2014-01-08 株式会社日立ハイテクノロジーズ エッチング装置、分析装置、エッチング処理方法、およびエッチング処理プログラム
WO2012023537A1 (ja) * 2010-08-19 2012-02-23 株式会社 アルバック ドライエッチング方法及び半導体装置の製造方法
US8725303B2 (en) * 2011-07-08 2014-05-13 Sharp Laboratories Of America, Inc. System and method for the multi-dimensional representation of energy control

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE251341T1 (de) * 1996-08-01 2003-10-15 Surface Technology Systems Plc Verfahren zur ätzung von substraten
US6189482B1 (en) * 1997-02-12 2001-02-20 Applied Materials, Inc. High temperature, high flow rate chemical vapor deposition apparatus and related methods
JPH10335193A (ja) * 1997-05-30 1998-12-18 Toshiba Corp 製造工程仕様作成運営システム、プロセスデータ作成システム及び半導体装置の製造方法
US6079426A (en) * 1997-07-02 2000-06-27 Applied Materials, Inc. Method and apparatus for determining the endpoint in a plasma cleaning process
US6098568A (en) * 1997-12-01 2000-08-08 Applied Materials, Inc. Mixed frequency CVD apparatus
US6077386A (en) * 1998-04-23 2000-06-20 Sandia Corporation Method and apparatus for monitoring plasma processing operations
US6417013B1 (en) * 1999-01-29 2002-07-09 Plasma-Therm, Inc. Morphed processing of semiconductor devices
US20040035529A1 (en) * 1999-08-24 2004-02-26 Michael N. Grimbergen Monitoring a process and compensating for radiation source fluctuations
US6650957B1 (en) * 2000-01-03 2003-11-18 Advanced Micro Devices, Inc. Method and apparatus for run-to-run control of deposition process
EP1134636A1 (de) 2000-03-10 2001-09-19 Infineon Technologies AG Editor zur Erstellung von Prozessplänen
JP3670208B2 (ja) * 2000-11-08 2005-07-13 アルプス電気株式会社 プラズマ処理装置，プラズマ処理システムおよびこれらの性能確認システム，検査方法
US6603538B1 (en) * 2000-11-21 2003-08-05 Applied Materials, Inc. Method and apparatus employing optical emission spectroscopy to detect a fault in process conditions of a semiconductor processing system
US6975921B2 (en) 2001-11-09 2005-12-13 Asm International Nv Graphical representation of a wafer processing process
JP4024053B2 (ja) * 2002-02-08 2007-12-19 キヤノンアネルバ株式会社 高周波プラズマ処理方法及び高周波プラズマ処理装置
WO2006016642A1 (ja) * 2004-08-13 2006-02-16 Tokyo Electron Limited 半導体装置の製造方法およびプラズマ酸化処理方法

Also Published As

Publication number Publication date
GB0508706D0 (en) 2005-06-08
EP1877878A1 (de) 2008-01-16
WO2006114595A1 (en) 2006-11-02
US7822494B2 (en) 2010-10-26
EP1877878B1 (de) 2010-03-03
US20090216342A1 (en) 2009-08-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition