DE602006009448D1 - Quinolinole als Fliessmittel und Beschleuniger für Unterfüll-Zusammensetzungen. - Google Patents
Quinolinole als Fliessmittel und Beschleuniger für Unterfüll-Zusammensetzungen.Info
- Publication number
- DE602006009448D1 DE602006009448D1 DE602006009448T DE602006009448T DE602006009448D1 DE 602006009448 D1 DE602006009448 D1 DE 602006009448D1 DE 602006009448 T DE602006009448 T DE 602006009448T DE 602006009448 T DE602006009448 T DE 602006009448T DE 602006009448 D1 DE602006009448 D1 DE 602006009448D1
- Authority
- DE
- Germany
- Prior art keywords
- compositions
- quinolinols
- accelerators
- quinolinol
- flow agents
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000203 mixture Substances 0.000 title abstract 5
- 150000004322 quinolinols Chemical class 0.000 title abstract 3
- 230000002378 acidificating effect Effects 0.000 abstract 2
- LISFMEBWQUVKPJ-UHFFFAOYSA-N quinolin-2-ol Chemical compound C1=CC=C2NC(=O)C=CC2=C1 LISFMEBWQUVKPJ-UHFFFAOYSA-N 0.000 abstract 2
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 238000001879 gelation Methods 0.000 abstract 1
- 230000002028 premature Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
- H01L2224/8101—Cleaning the bump connector, e.g. oxide removal step, desmearing
- H01L2224/81011—Chemical cleaning, e.g. etching, flux
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/81201—Compression bonding
- H01L2224/81203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
- H01L2224/81204—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding with a graded temperature profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0104—Zirconium [Zr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01056—Barium [Ba]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0495—5th Group
- H01L2924/04953—TaN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Epoxy Resins (AREA)
- Wire Bonding (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Plural Heterocyclic Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/211,406 US7378523B2 (en) | 2005-08-25 | 2005-08-25 | Quinolinols as fluxing and accelerating agents for underfill compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006009448D1 true DE602006009448D1 (de) | 2009-11-12 |
Family
ID=37487469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602006009448T Active DE602006009448D1 (de) | 2005-08-25 | 2006-08-23 | Quinolinole als Fliessmittel und Beschleuniger für Unterfüll-Zusammensetzungen. |
Country Status (9)
Country | Link |
---|---|
US (1) | US7378523B2 (de) |
EP (1) | EP1758163B1 (de) |
JP (1) | JP4648881B2 (de) |
KR (1) | KR20070024402A (de) |
CN (1) | CN1919525B (de) |
AT (1) | ATE444565T1 (de) |
DE (1) | DE602006009448D1 (de) |
SG (1) | SG130161A1 (de) |
TW (1) | TWI398474B (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100457375C (zh) * | 2007-08-11 | 2009-02-04 | 厦门大学 | 一种可抑制焊点界面化合物生长的免清洗水基型助焊剂 |
KR102455429B1 (ko) * | 2015-03-19 | 2022-10-14 | 나믹스 가부시끼가이샤 | 플립칩 실장체의 제조 방법, 플립칩 실장체, 및 선공급형 언더필용 수지 조성물 |
WO2017065957A1 (en) * | 2015-10-16 | 2017-04-20 | Basf Se | Energy curable high reactivity multi vinylether or acrylate functional resins |
EP3377578A4 (de) | 2015-11-17 | 2019-05-08 | Henkel IP & Holding GmbH | Harzzusammensetzungen für unterfüllungsschicht für dreidimensionale through silica via (tsv)-verpackungen und zur herstellung davon nützliche zusammensetzungen |
JP6660771B2 (ja) * | 2016-03-03 | 2020-03-11 | ナミックス株式会社 | フィルム状樹脂組成物 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5430440B2 (de) * | 1974-03-19 | 1979-10-01 | ||
US5344592A (en) * | 1993-02-16 | 1994-09-06 | E. I. Du Pont De Nemours And Company | Organic vehicle for electronic composition |
JPH07316399A (ja) * | 1994-05-26 | 1995-12-05 | Sumitomo Chem Co Ltd | 熱硬化性樹脂組成物および電子部品 |
US5482809A (en) * | 1994-06-16 | 1996-01-09 | Minnesota Mining And Manufacturing Company | Liquid toners from soluble polymeric dispersants with reactive groups |
US5521271A (en) * | 1994-09-29 | 1996-05-28 | Minnesota Mining And Manufacturing Company | Liquid toners with hydrocarbon solvents |
US5744533A (en) * | 1997-06-04 | 1998-04-28 | Johnson Matthey, Inc. | Adhesive composition for bonding a semiconductor device |
JPH11140276A (ja) * | 1997-11-11 | 1999-05-25 | Sumitomo Chem Co Ltd | 多官能シアン酸エステル樹脂組成物および樹脂封止型半導体装置 |
JP2000273317A (ja) | 1999-02-12 | 2000-10-03 | Natl Starch & Chem Investment Holding Corp | エレクトロニクスデバイス用の電気的安定性をもつ導電性および抵抗性材料 |
WO2001046290A1 (en) | 1999-12-20 | 2001-06-28 | 3M Innovative Properties Company | Ambient-temperature-stable, one-part curable epoxy adhesive |
US6498260B2 (en) * | 2000-03-29 | 2002-12-24 | Georgia Tech Research Corp. | Thermally degradable epoxy underfills for flip-chip applications |
US6849940B1 (en) * | 2000-11-20 | 2005-02-01 | Ati Technologies, Inc. | Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating same |
NL1016779C2 (nl) * | 2000-12-02 | 2002-06-04 | Cornelis Johannes Maria V Rijn | Matrijs, werkwijze voor het vervaardigen van precisieproducten met behulp van een matrijs, alsmede precisieproducten, in het bijzonder microzeven en membraanfilters, vervaardigd met een dergelijke matrijs. |
US20020111420A1 (en) * | 2001-02-12 | 2002-08-15 | International Business Machines Corporation | Underfill compositions |
US6583201B2 (en) * | 2001-04-25 | 2003-06-24 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability for use in electronics devices |
US20030111519A1 (en) * | 2001-09-04 | 2003-06-19 | 3M Innovative Properties Company | Fluxing compositions |
US20040113127A1 (en) * | 2002-12-17 | 2004-06-17 | Min Gary Yonggang | Resistor compositions having a substantially neutral temperature coefficient of resistance and methods and compositions relating thereto |
US7001938B2 (en) * | 2003-01-27 | 2006-02-21 | Resolution Performance Products Llc | Epoxy resin curing compositions and resin compositions including same |
WO2004073030A2 (en) | 2003-02-06 | 2004-08-26 | Georgia Tech Research Corporation | Metal 8-hydroxyquinoline -functionalized polymers and related materials and methods of making and using the same |
US7108806B2 (en) * | 2003-02-28 | 2006-09-19 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability and good impact resistance for use in electronics devices |
JP4582090B2 (ja) * | 2004-02-20 | 2010-11-17 | 宇部興産株式会社 | ポリイミドシロキサン溶液組成物 |
US20050247916A1 (en) * | 2004-05-06 | 2005-11-10 | Mccormick Demetrius | Compositions for use in electronics devices |
-
2005
- 2005-08-25 US US11/211,406 patent/US7378523B2/en not_active Expired - Fee Related
-
2006
- 2006-08-22 SG SG200605715-2A patent/SG130161A1/en unknown
- 2006-08-22 CN CN2006101265024A patent/CN1919525B/zh not_active Expired - Fee Related
- 2006-08-23 JP JP2006226255A patent/JP4648881B2/ja not_active Expired - Fee Related
- 2006-08-23 EP EP06017528A patent/EP1758163B1/de not_active Not-in-force
- 2006-08-23 DE DE602006009448T patent/DE602006009448D1/de active Active
- 2006-08-23 AT AT06017528T patent/ATE444565T1/de not_active IP Right Cessation
- 2006-08-24 TW TW095131063A patent/TWI398474B/zh not_active IP Right Cessation
- 2006-08-24 KR KR1020060080518A patent/KR20070024402A/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN1919525B (zh) | 2010-06-09 |
TW200728375A (en) | 2007-08-01 |
EP1758163B1 (de) | 2009-09-30 |
TWI398474B (zh) | 2013-06-11 |
US7378523B2 (en) | 2008-05-27 |
CN1919525A (zh) | 2007-02-28 |
JP4648881B2 (ja) | 2011-03-09 |
SG130161A1 (en) | 2007-03-20 |
ATE444565T1 (de) | 2009-10-15 |
EP1758163A1 (de) | 2007-02-28 |
KR20070024402A (ko) | 2007-03-02 |
JP2007056266A (ja) | 2007-03-08 |
US20070049722A1 (en) | 2007-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MX2009004132A (es) | Composiciones para contrarrestar el mal olor. | |
MY149889A (en) | Salts of 4-methyl-n-[3-(4-methyl-imidazol-1-yl)-5-trifluoromethyl-phenyl]-3-(4-pyridin-3-yl-pyrimidin-2-ylamino)-benzamide | |
TW200744456A (en) | Microbicidal composition | |
BRPI0716094A2 (pt) | composiÇço de resina. | |
TW200621411A (en) | Tin/indium lead-free solders for low stress chip attachment | |
WO2011076770A3 (en) | A solder paste composition, a solder paste and a soldering flux | |
DE602006009448D1 (de) | Quinolinole als Fliessmittel und Beschleuniger für Unterfüll-Zusammensetzungen. | |
DE602007000908D1 (de) | Härtbare wässrige Zusammensetzungen | |
DE502005003908D1 (de) | Härtbare zusammensetzungen auf basis von epoxidharzen und 3(4)-(aminomethyl)-cyclohexan-propanamin und 1,4(5)-cyclooctandimethanamin | |
CY1109916T1 (el) | Βενζιμιδαζολο-θειοφαινικες ενωσεις ως plk αναστολεις | |
DE602006018856D1 (de) | Neue nutrazeutika-zusammensetzungen | |
SV2009003221A (es) | Composiciones de fenilalquilamino carbamato ref. prd2743svpct | |
ATE523544T1 (de) | Alkylierte aminopropylierte ethyendiamine und verwendungen davon | |
EA201070689A1 (ru) | Композиция для личного ухода | |
ATE409712T1 (de) | Epoxidharz zusammensetzung | |
ATE543887T1 (de) | Beschichtungszusammensetzungen | |
BRPI0914940A8 (pt) | Composições nutritivas contendo punicalaginas | |
TW200621843A (en) | Solvent composition | |
ATE523543T1 (de) | Alkylierte aminoproyliertes methylen-di- (cyclohexylamin) und verwendungen davon | |
DK2064185T3 (da) | 1H-quinolin-4-on-forbindelser med affinitet til GABA-receptoren, fremgangsmåder, anvendelser og sammensætninger | |
ATE491764T1 (de) | Auto-adhäsiver klebstoff | |
RU2006107361A (ru) | Средство, обладающее гематопротекторным действием | |
DE112005000119A5 (de) | Fügeverband, sowie Montagegruppe und Trägerlelement für den Fügeverband | |
PL2064185T3 (pl) | Związki 1H-chinolin-4-onowe z powinowactwem do receptora GABA, sposoby wytwarzania, zastosowanie i kompozycje | |
DE602006005660D1 (de) | Polyester-organoeisen-zusammensetzungen |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |