DE602006009448D1 - Quinolinole als Fliessmittel und Beschleuniger für Unterfüll-Zusammensetzungen. - Google Patents

Quinolinole als Fliessmittel und Beschleuniger für Unterfüll-Zusammensetzungen.

Info

Publication number
DE602006009448D1
DE602006009448D1 DE602006009448T DE602006009448T DE602006009448D1 DE 602006009448 D1 DE602006009448 D1 DE 602006009448D1 DE 602006009448 T DE602006009448 T DE 602006009448T DE 602006009448 T DE602006009448 T DE 602006009448T DE 602006009448 D1 DE602006009448 D1 DE 602006009448D1
Authority
DE
Germany
Prior art keywords
compositions
quinolinols
accelerators
quinolinol
flow agents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006009448T
Other languages
English (en)
Inventor
Osama M Musa
Zhen Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of DE602006009448D1 publication Critical patent/DE602006009448D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
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    • H01L2224/812—Applying energy for connecting
    • H01L2224/81201—Compression bonding
    • H01L2224/81203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H01L2224/81204—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding with a graded temperature profile
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    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Epoxy Resins (AREA)
  • Wire Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Plural Heterocyclic Compounds (AREA)
DE602006009448T 2005-08-25 2006-08-23 Quinolinole als Fliessmittel und Beschleuniger für Unterfüll-Zusammensetzungen. Active DE602006009448D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/211,406 US7378523B2 (en) 2005-08-25 2005-08-25 Quinolinols as fluxing and accelerating agents for underfill compositions

Publications (1)

Publication Number Publication Date
DE602006009448D1 true DE602006009448D1 (de) 2009-11-12

Family

ID=37487469

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006009448T Active DE602006009448D1 (de) 2005-08-25 2006-08-23 Quinolinole als Fliessmittel und Beschleuniger für Unterfüll-Zusammensetzungen.

Country Status (9)

Country Link
US (1) US7378523B2 (de)
EP (1) EP1758163B1 (de)
JP (1) JP4648881B2 (de)
KR (1) KR20070024402A (de)
CN (1) CN1919525B (de)
AT (1) ATE444565T1 (de)
DE (1) DE602006009448D1 (de)
SG (1) SG130161A1 (de)
TW (1) TWI398474B (de)

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KR102455429B1 (ko) * 2015-03-19 2022-10-14 나믹스 가부시끼가이샤 플립칩 실장체의 제조 방법, 플립칩 실장체, 및 선공급형 언더필용 수지 조성물
WO2017065957A1 (en) * 2015-10-16 2017-04-20 Basf Se Energy curable high reactivity multi vinylether or acrylate functional resins
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JP6660771B2 (ja) * 2016-03-03 2020-03-11 ナミックス株式会社 フィルム状樹脂組成物

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WO2004073030A2 (en) 2003-02-06 2004-08-26 Georgia Tech Research Corporation Metal 8-hydroxyquinoline -functionalized polymers and related materials and methods of making and using the same
US7108806B2 (en) * 2003-02-28 2006-09-19 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability and good impact resistance for use in electronics devices
JP4582090B2 (ja) * 2004-02-20 2010-11-17 宇部興産株式会社 ポリイミドシロキサン溶液組成物
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TW200728375A (en) 2007-08-01
EP1758163B1 (de) 2009-09-30
TWI398474B (zh) 2013-06-11
US7378523B2 (en) 2008-05-27
CN1919525A (zh) 2007-02-28
JP4648881B2 (ja) 2011-03-09
SG130161A1 (en) 2007-03-20
ATE444565T1 (de) 2009-10-15
EP1758163A1 (de) 2007-02-28
KR20070024402A (ko) 2007-03-02
JP2007056266A (ja) 2007-03-08
US20070049722A1 (en) 2007-03-01

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