DE602005022946D1 - Strukturierungsverfahren - Google Patents

Strukturierungsverfahren

Info

Publication number
DE602005022946D1
DE602005022946D1 DE602005022946T DE602005022946T DE602005022946D1 DE 602005022946 D1 DE602005022946 D1 DE 602005022946D1 DE 602005022946 T DE602005022946 T DE 602005022946T DE 602005022946 T DE602005022946 T DE 602005022946T DE 602005022946 D1 DE602005022946 D1 DE 602005022946D1
Authority
DE
Germany
Prior art keywords
structuring process
structuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005022946T
Other languages
English (en)
Inventor
Yoshio Mita
Tarik Bourouina
Federic Marty
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of DE602005022946D1 publication Critical patent/DE602005022946D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
DE602005022946T 2005-06-03 2005-06-03 Strukturierungsverfahren Active DE602005022946D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/010272 WO2006129374A1 (ja) 2005-06-03 2005-06-03 パターニング方法

Publications (1)

Publication Number Publication Date
DE602005022946D1 true DE602005022946D1 (de) 2010-09-23

Family

ID=37481311

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005022946T Active DE602005022946D1 (de) 2005-06-03 2005-06-03 Strukturierungsverfahren

Country Status (4)

Country Link
EP (1) EP1887614B1 (de)
JP (1) JP4533931B2 (de)
DE (1) DE602005022946D1 (de)
WO (1) WO2006129374A1 (de)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5556629A (en) * 1978-10-21 1980-04-25 Chiyou Lsi Gijutsu Kenkyu Kumiai Pattern forming method
WO1983003485A1 (en) * 1982-03-29 1983-10-13 Motorola Inc Electron beam-optical hybrid lithographic resist process
US4717644A (en) * 1982-12-20 1988-01-05 International Business Machines Corporation Hybrid electron beam and optical lithography method
JPS63197333A (ja) * 1987-02-12 1988-08-16 Hitachi Ltd パタ−ン形成方法及び装置
JPH02262319A (ja) * 1989-04-03 1990-10-25 Toshiba Corp パターン形成方法
JPH03127818A (ja) * 1989-10-13 1991-05-30 Fujitsu Ltd レティクルの製造方法
JPH05152199A (ja) * 1991-11-27 1993-06-18 Nec Kansai Ltd レジストパターン形成方法
JP3379478B2 (ja) * 1999-06-04 2003-02-24 日本電気株式会社 半導体装置の製造方法
JP2002134396A (ja) * 2000-10-25 2002-05-10 Sony Corp 半導体装置の製造方法および半導体パターン自動調節装置

Also Published As

Publication number Publication date
EP1887614B1 (de) 2010-08-11
EP1887614A1 (de) 2008-02-13
JPWO2006129374A1 (ja) 2008-12-25
JP4533931B2 (ja) 2010-09-01
EP1887614A4 (de) 2008-12-24
WO2006129374A1 (ja) 2006-12-07

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