DE602005019581D1 - Verfahren zum ablösen einer dünnen halbleiterschaltung von ihrer basis - Google Patents
Verfahren zum ablösen einer dünnen halbleiterschaltung von ihrer basisInfo
- Publication number
- DE602005019581D1 DE602005019581D1 DE602005019581T DE602005019581T DE602005019581D1 DE 602005019581 D1 DE602005019581 D1 DE 602005019581D1 DE 602005019581 T DE602005019581 T DE 602005019581T DE 602005019581 T DE602005019581 T DE 602005019581T DE 602005019581 D1 DE602005019581 D1 DE 602005019581D1
- Authority
- DE
- Germany
- Prior art keywords
- base
- thin semiconductor
- semiconductor switch
- semiconductor circuit
- support substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Bipolar Transistors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04104002 | 2004-08-20 | ||
| PCT/IB2005/052635 WO2006018787A2 (en) | 2004-08-20 | 2005-08-09 | Method of detaching a thin semiconductor circuit from its base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE602005019581D1 true DE602005019581D1 (de) | 2010-04-08 |
Family
ID=35559365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE602005019581T Active DE602005019581D1 (de) | 2004-08-20 | 2005-08-09 | Verfahren zum ablösen einer dünnen halbleiterschaltung von ihrer basis |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8338228B2 (de) |
| EP (1) | EP1782462B1 (de) |
| JP (1) | JP2008511051A (de) |
| CN (1) | CN101044610A (de) |
| AT (1) | ATE459101T1 (de) |
| DE (1) | DE602005019581D1 (de) |
| WO (1) | WO2006018787A2 (de) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3116085B2 (ja) | 1997-09-16 | 2000-12-11 | 東京農工大学長 | 半導体素子形成法 |
| US6036809A (en) * | 1999-02-16 | 2000-03-14 | International Business Machines Corporation | Process for releasing a thin-film structure from a substrate |
| JP2001185519A (ja) * | 1999-12-24 | 2001-07-06 | Hitachi Ltd | 半導体装置及びその製造方法 |
| US6444560B1 (en) * | 2000-09-26 | 2002-09-03 | International Business Machines Corporation | Process for making fine pitch connections between devices and structure made by the process |
| US6946314B2 (en) * | 2001-01-02 | 2005-09-20 | The Charles Stark Draper Laboratory, Inc. | Method for microfabricating structures using silicon-on-insulator material |
| DE10122324A1 (de) * | 2001-05-08 | 2002-11-14 | Philips Corp Intellectual Pty | Flexible integrierte monolithische Schaltung |
| US6797537B2 (en) | 2001-10-30 | 2004-09-28 | Irvine Sensors Corporation | Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers |
| TWI229435B (en) | 2002-06-18 | 2005-03-11 | Sanyo Electric Co | Manufacture of semiconductor device |
| CN100383936C (zh) * | 2002-12-20 | 2008-04-23 | 国际商业机器公司 | 三维器件制造方法 |
-
2005
- 2005-08-09 DE DE602005019581T patent/DE602005019581D1/de active Active
- 2005-08-09 WO PCT/IB2005/052635 patent/WO2006018787A2/en active Application Filing
- 2005-08-09 CN CNA200580035698XA patent/CN101044610A/zh active Pending
- 2005-08-09 AT AT05773837T patent/ATE459101T1/de not_active IP Right Cessation
- 2005-08-09 US US11/574,014 patent/US8338228B2/en active Active
- 2005-08-09 JP JP2007526669A patent/JP2008511051A/ja not_active Withdrawn
- 2005-08-09 EP EP05773837A patent/EP1782462B1/de active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP1782462B1 (de) | 2010-02-24 |
| US8338228B2 (en) | 2012-12-25 |
| EP1782462A2 (de) | 2007-05-09 |
| ATE459101T1 (de) | 2010-03-15 |
| WO2006018787A2 (en) | 2006-02-23 |
| US20090215226A1 (en) | 2009-08-27 |
| JP2008511051A (ja) | 2008-04-10 |
| WO2006018787A3 (en) | 2006-08-17 |
| CN101044610A (zh) | 2007-09-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |