DE602005017183D1 - CONDUCTOR PLATE AND PCB PLATE MANUFACTURING METHOD - Google Patents

CONDUCTOR PLATE AND PCB PLATE MANUFACTURING METHOD

Info

Publication number
DE602005017183D1
DE602005017183D1 DE602005017183T DE602005017183T DE602005017183D1 DE 602005017183 D1 DE602005017183 D1 DE 602005017183D1 DE 602005017183 T DE602005017183 T DE 602005017183T DE 602005017183 T DE602005017183 T DE 602005017183T DE 602005017183 D1 DE602005017183 D1 DE 602005017183D1
Authority
DE
Germany
Prior art keywords
plate
pcb
manufacturing
conductor
conductor plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005017183T
Other languages
German (de)
Inventor
Masanori Takezaki
Masayuki Komaru
Haruki Nitta
Takafumi Yagi
Yoshiyuki Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
U AI Electronics Corp
Original Assignee
U AI Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by U AI Electronics Corp filed Critical U AI Electronics Corp
Publication of DE602005017183D1 publication Critical patent/DE602005017183D1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
DE602005017183T 2004-12-08 2005-02-28 CONDUCTOR PLATE AND PCB PLATE MANUFACTURING METHOD Expired - Fee Related DE602005017183D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004355203A JP4316483B2 (en) 2004-12-08 2004-12-08 Printed circuit board manufacturing method and printed circuit board
PCT/JP2005/003304 WO2006061916A1 (en) 2004-12-08 2005-02-28 Printed board and printed board manufacturing method

Publications (1)

Publication Number Publication Date
DE602005017183D1 true DE602005017183D1 (en) 2009-11-26

Family

ID=36577746

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005017183T Expired - Fee Related DE602005017183D1 (en) 2004-12-08 2005-02-28 CONDUCTOR PLATE AND PCB PLATE MANUFACTURING METHOD

Country Status (7)

Country Link
US (2) US7479013B2 (en)
EP (1) EP1821586B1 (en)
JP (1) JP4316483B2 (en)
KR (1) KR100912051B1 (en)
CN (1) CN101103654A (en)
DE (1) DE602005017183D1 (en)
WO (1) WO2006061916A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004515610A (en) 2000-12-12 2004-05-27 シュリ ディクシャ コーポレイション Lightweight circuit board including conductive constrained core
USRE45637E1 (en) 2005-08-29 2015-07-28 Stablcor Technology, Inc. Processes for manufacturing printed wiring boards
WO2008008552A2 (en) 2006-07-14 2008-01-17 Stablcor, Inc. Build-up printed wiring board substrate having a core layer that is part of a circuit
US7738249B2 (en) * 2007-10-25 2010-06-15 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal cooling structure and electrical assembly utilizing same
JP5076196B2 (en) * 2007-10-29 2012-11-21 三菱電機株式会社 Printed wiring board and manufacturing method thereof
JP5262188B2 (en) * 2008-02-29 2013-08-14 富士通株式会社 substrate
DE112009003811B4 (en) * 2008-12-25 2017-04-06 Mitsubishi Electric Corporation Method for producing a printed circuit board
US7787249B2 (en) * 2009-02-03 2010-08-31 Honeywell International Inc. Systems and methods for printed board assembly isolated heat exchange
JP2011166029A (en) * 2010-02-12 2011-08-25 Panasonic Corp Wiring board, electronic device using the wiring board, and method of manufacturing the wiring board
CN102036472A (en) * 2011-01-05 2011-04-27 倪新军 Microwave high-frequency metal base circuit board
US8569631B2 (en) * 2011-05-05 2013-10-29 Tangitek, Llc Noise dampening energy efficient circuit board and method for constructing and using same
US8491315B1 (en) * 2011-11-29 2013-07-23 Plastronics Socket Partners, Ltd. Micro via adapter socket
JP5440650B2 (en) * 2012-05-07 2014-03-12 富士通株式会社 Substrate manufacturing method
KR101399980B1 (en) * 2012-12-28 2014-05-29 하이쎌(주) Heat-dissipating flexible module for led using carbon fiber substrate and method for manufacturing the same
KR101391187B1 (en) * 2013-01-24 2014-05-07 하이쎌(주) Flexible module with enhanced radiating ability and method for manufacturing the same
US9332632B2 (en) 2014-08-20 2016-05-03 Stablcor Technology, Inc. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards
KR102253473B1 (en) * 2014-09-30 2021-05-18 삼성전기주식회사 Circuit board
KR102374256B1 (en) 2015-02-23 2022-03-15 삼성전기주식회사 Circuit board and manufacturing method thereof
JP6039867B1 (en) * 2015-03-06 2016-12-07 京セラ株式会社 Winding body and substrate sheet
KR102411999B1 (en) * 2015-04-08 2022-06-22 삼성전기주식회사 Circuit board
KR102538908B1 (en) * 2015-09-25 2023-06-01 삼성전기주식회사 Printed circuit board and method for manufacturing the same
US10736222B2 (en) 2016-06-29 2020-08-04 AT&S Austria Technologies & Systemtechnik Aktiengesellschaft Cooling component carrier material by carbon structure within dielectric shell
KR102149794B1 (en) * 2018-11-26 2020-08-31 삼성전기주식회사 Printed Circuit Board and manufacturing method for the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812792A (en) * 1983-12-22 1989-03-14 Trw Inc. High-frequency multilayer printed circuit board
US4859189A (en) * 1987-09-25 1989-08-22 Minnesota Mining And Manufacturing Company Multipurpose socket
US5261155A (en) * 1991-08-12 1993-11-16 International Business Machines Corporation Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
GB9225260D0 (en) * 1992-12-03 1993-01-27 Int Computers Ltd Cooling electronic circuit assemblies
JPH07235781A (en) 1994-02-23 1995-09-05 Matsushita Electric Ind Co Ltd Printed substrate mount device
JPH0823183A (en) * 1994-07-06 1996-01-23 Matsushita Electric Ind Co Ltd Structure of cooling member
US5929375A (en) * 1996-05-10 1999-07-27 Ford Motor Company EMI protection and CTE control of three-dimensional circuitized substrates
JPH1140902A (en) 1997-07-18 1999-02-12 Cmk Corp Printed wiring board and manufacture thereof
US6257329B1 (en) * 1998-08-17 2001-07-10 Alfiero Balzano Thermal management system
JP4365061B2 (en) * 1999-06-21 2009-11-18 三菱電機株式会社 Circuit forming substrate manufacturing method and circuit forming substrate
JP2003008186A (en) 2001-06-21 2003-01-10 Sony Corp Semiconductor device
JP2004179257A (en) 2002-11-25 2004-06-24 Alps Electric Co Ltd Semiconductor device equipped with heat radiation structure
JP2004228410A (en) 2003-01-24 2004-08-12 Kyocera Corp Wiring board
JP2004289006A (en) 2003-03-24 2004-10-14 Mitsubishi Electric Corp Carbon aluminum core substrate

Also Published As

Publication number Publication date
US7479013B2 (en) 2009-01-20
US20080282538A1 (en) 2008-11-20
KR100912051B1 (en) 2009-08-12
JP4316483B2 (en) 2009-08-19
EP1821586A1 (en) 2007-08-22
JP2006165299A (en) 2006-06-22
EP1821586B1 (en) 2009-10-14
US20080076276A1 (en) 2008-03-27
CN101103654A (en) 2008-01-09
WO2006061916A1 (en) 2006-06-15
EP1821586A4 (en) 2008-01-02
KR20070085917A (en) 2007-08-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee