DE602005008734D1 - Doppelrippen-Gruppenkühleinrichtungen - Google Patents

Doppelrippen-Gruppenkühleinrichtungen

Info

Publication number
DE602005008734D1
DE602005008734D1 DE602005008734T DE602005008734T DE602005008734D1 DE 602005008734 D1 DE602005008734 D1 DE 602005008734D1 DE 602005008734 T DE602005008734 T DE 602005008734T DE 602005008734 T DE602005008734 T DE 602005008734T DE 602005008734 D1 DE602005008734 D1 DE 602005008734D1
Authority
DE
Germany
Prior art keywords
core
twin
root
grooves
twin fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005008734T
Other languages
English (en)
Inventor
Shankar Hegde
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of DE602005008734D1 publication Critical patent/DE602005008734D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
DE602005008734T 2004-04-30 2005-04-29 Doppelrippen-Gruppenkühleinrichtungen Expired - Fee Related DE602005008734D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/837,144 US7497248B2 (en) 2004-04-30 2004-04-30 Twin fin arrayed cooling device
PCT/US2005/015318 WO2005109497A1 (en) 2004-04-30 2005-04-29 Twin fin arrayed cooling devices

Publications (1)

Publication Number Publication Date
DE602005008734D1 true DE602005008734D1 (de) 2008-09-18

Family

ID=34968695

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005008734T Expired - Fee Related DE602005008734D1 (de) 2004-04-30 2005-04-29 Doppelrippen-Gruppenkühleinrichtungen

Country Status (7)

Country Link
US (1) US7497248B2 (de)
EP (1) EP1745507B1 (de)
CN (1) CN1977377A (de)
AT (1) ATE403938T1 (de)
DE (1) DE602005008734D1 (de)
TW (1) TW200603718A (de)
WO (1) WO2005109497A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
US20060054311A1 (en) * 2004-09-15 2006-03-16 Andrew Douglas Delano Heat sink device with independent parts
US7164582B2 (en) * 2004-10-29 2007-01-16 Hewlett-Packard Development Company, L.P. Cooling system with submerged fan
US20080060793A1 (en) * 2006-09-08 2008-03-13 Tsung-Hsien Huang Cooler device
TW200934362A (en) * 2008-01-16 2009-08-01 Neng Tyi Prec Ind Co Ltd Method of manufacturing heat dissipaters having heat sinks and structure thereof
JP2009206404A (ja) * 2008-02-29 2009-09-10 Sanyo Denki Co Ltd 発熱体冷却装置
TWM348981U (en) * 2008-06-12 2009-01-11 Acpa Energy Conversion Devices Co Ltd Heat dissipation module
US20100044009A1 (en) * 2008-08-20 2010-02-25 Shyh-Ming Chen Annular heat dissipating device
TWI357479B (en) * 2008-11-28 2012-02-01 Univ Nat Taiwan Science Tech A thermal module for light source
JP2011154929A (ja) * 2010-02-15 2011-08-11 Sun-Lite Sockets Industry Inc 排熱装置
US8498116B2 (en) * 2010-07-16 2013-07-30 Rockwell Automation Technologies, Inc. Heat sink for power circuits
TWM422766U (en) * 2011-08-16 2012-02-11 Shi-Ming Chen Air heat sink and cooling fin with protection and improved performance
CN102527758B (zh) * 2012-01-20 2014-12-03 东莞汉旭五金塑胶科技有限公司 散热器铝底座的挤压成型模具及其制法
TWI512440B (zh) * 2012-08-01 2015-12-11 Asia Vital Components Co Ltd 散熱裝置及其製造方法
TWI507860B (zh) * 2012-08-01 2015-11-11 Asia Vital Components Co Ltd 散熱器之結構及其製造方法
TWI473962B (zh) * 2012-08-01 2015-02-21 Asia Vital Components Co Ltd 散熱器之製造方法
TWI475183B (zh) * 2012-08-01 2015-03-01 Asia Vital Components Co Ltd 散熱器結構及其製造方法
US9326424B2 (en) * 2014-09-10 2016-04-26 Opentv, Inc. Heat sink assembly and method of utilizing a heat sink assembly
WO2016076330A1 (ja) * 2014-11-12 2016-05-19 武延 本郷 放熱構造および照明装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2289984A (en) * 1940-07-12 1942-07-14 Westinghouse Electric & Mfg Co Air cooler for power tubes
US2535721A (en) * 1946-06-14 1950-12-26 Chausson Usines Sa Cylindrical heat exchanger
US3457988A (en) * 1967-05-15 1969-07-29 Westinghouse Electric Corp Integral heat sink for semiconductor devices
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
JP2000083343A (ja) * 1998-09-03 2000-03-21 Mitsubishi Electric Corp モーターフレーム及びモーターフレームの製造方法
US5964285A (en) * 1999-02-12 1999-10-12 Yung-Tsai Chu Heat sink
US6851467B1 (en) 1999-08-30 2005-02-08 Molex Incorporated Heat sink assembly
US6360816B1 (en) * 1999-12-23 2002-03-26 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6680015B2 (en) * 2000-02-01 2004-01-20 Cool Options, Inc. Method of manufacturing a heat sink assembly with overmolded carbon matrix
US6748656B2 (en) * 2000-07-21 2004-06-15 Ats Automation Tooling Systems Inc. Folded-fin heatsink manufacturing method and apparatus
US6633484B1 (en) * 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
US6392888B1 (en) * 2000-12-07 2002-05-21 Foxconn Precision Components Co., Ltd. Heat dissipation assembly and method of assembling the same
US20020121365A1 (en) * 2001-03-05 2002-09-05 Kozyra Kazimierz L. Radial folded fin heat sink
TW532738U (en) * 2001-03-27 2003-05-11 Foxconn Prec Components Co Ltd Heat sink assembly
CA2448488A1 (en) * 2001-06-05 2002-12-12 Heat Technology, Inc. Heatsink assembly and method of manufacturing the same
US6505680B1 (en) * 2001-07-27 2003-01-14 Hewlett-Packard Company High performance cooling device
USD464938S1 (en) * 2001-07-27 2002-10-29 Hewlett Packard Company High performance cooling device
US6508300B1 (en) * 2001-07-27 2003-01-21 Hewlett Packard Company Spring clip for a cooling device
US6657862B2 (en) * 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6543522B1 (en) * 2001-10-31 2003-04-08 Hewlett-Packard Development Company, L.P. Arrayed fin cooler
US6631756B1 (en) * 2002-09-10 2003-10-14 Hewlett-Packard Development Company, L.P. High performance passive cooling device with ducting
US6714415B1 (en) * 2003-03-13 2004-03-30 Intel Corporation Split fin heat sink
US6886627B2 (en) * 2003-06-27 2005-05-03 Intel Corporation Radial heat sink with helical shaped fins

Also Published As

Publication number Publication date
EP1745507A1 (de) 2007-01-24
US20050241800A1 (en) 2005-11-03
TW200603718A (en) 2006-01-16
CN1977377A (zh) 2007-06-06
EP1745507B1 (de) 2008-08-06
WO2005109497A1 (en) 2005-11-17
ATE403938T1 (de) 2008-08-15
US7497248B2 (en) 2009-03-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee