DE602005007933D1 - Leitermusters - Google Patents

Leitermusters

Info

Publication number
DE602005007933D1
DE602005007933D1 DE602005007933T DE602005007933T DE602005007933D1 DE 602005007933 D1 DE602005007933 D1 DE 602005007933D1 DE 602005007933 T DE602005007933 T DE 602005007933T DE 602005007933 T DE602005007933 T DE 602005007933T DE 602005007933 D1 DE602005007933 D1 DE 602005007933D1
Authority
DE
Germany
Prior art keywords
ladder pattern
ladder
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005007933T
Other languages
English (en)
Inventor
Koichi Misumi
Koji Saito
Kaoru Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of DE602005007933D1 publication Critical patent/DE602005007933D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE602005007933T 2004-11-30 2005-11-29 Leitermusters Expired - Fee Related DE602005007933D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004347772A JP2006154570A (ja) 2004-11-30 2004-11-30 レジストパターンおよび導体パターンの製造方法
PCT/JP2005/022255 WO2006059757A2 (en) 2004-11-30 2005-11-29 Process for producing resist pattern and conductor pattern

Publications (1)

Publication Number Publication Date
DE602005007933D1 true DE602005007933D1 (de) 2008-08-14

Family

ID=36565445

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005007933T Expired - Fee Related DE602005007933D1 (de) 2004-11-30 2005-11-29 Leitermusters

Country Status (8)

Country Link
US (1) US7871758B2 (de)
EP (1) EP1825331B1 (de)
JP (1) JP2006154570A (de)
KR (1) KR100888568B1 (de)
CN (1) CN101065707B (de)
DE (1) DE602005007933D1 (de)
TW (1) TWI312444B (de)
WO (1) WO2006059757A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008077057A (ja) * 2006-08-21 2008-04-03 Jsr Corp 感光性絶縁樹脂組成物及びその硬化物並びにそれを備える電子部品
US8507180B2 (en) * 2006-11-28 2013-08-13 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive-type photoresist composition for thick film, chemically amplified dry film for thick film, and method for production of thick film resist pattern
TWI382277B (zh) * 2008-01-24 2013-01-11 Asahi Kasei Emd Corp Photosensitive resin laminate
JP2010040849A (ja) * 2008-08-06 2010-02-18 Tokyo Ohka Kogyo Co Ltd レジストパターン形成方法
JP5630181B2 (ja) * 2010-03-05 2014-11-26 大日本印刷株式会社 ネガ型レジスト組成物、当該レジスト組成物を用いたレリーフパターンの製造方法及びフォトマスクの製造方法
JP2015218364A (ja) * 2014-05-19 2015-12-07 東京応化工業株式会社 レジスト組成物及びこれを用いた導電パターンの製造方法
JP6667204B2 (ja) * 2015-03-18 2020-03-18 東京応化工業株式会社 感光性樹脂層の形成方法、ホトレジストパターンの製造方法、及びメッキ造形物の形成方法
JPWO2022230790A1 (de) 2021-04-26 2022-11-03

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100360554B1 (ko) 1993-12-08 2003-01-29 가부시키가이샤 니콘 스캐닝노출방법및이러한스캐닝노출방법을사용하여반도체장치를제조하는방법
JP3436843B2 (ja) * 1996-04-25 2003-08-18 東京応化工業株式会社 リソグラフィー用下地材及びそれを用いたリソグラフィー用レジスト材料
JP3633179B2 (ja) * 1997-01-27 2005-03-30 Ｊｓｒ株式会社 ポジ型フォトレジスト組成物
JP4185171B2 (ja) * 1997-04-10 2008-11-26 富士通マイクロエレクトロニクス株式会社 荷電粒子ビーム露光方法及びその露光装置
TWI278496B (en) * 2000-11-14 2007-04-11 Jsr Corp Anti-reflection coating forming composition
JP2005506578A (ja) 2001-10-19 2005-03-03 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ サブミクロン幅のパターンを形成する方法
JP2003140347A (ja) * 2001-11-02 2003-05-14 Tokyo Ohka Kogyo Co Ltd 厚膜ホトレジスト層積層体、厚膜レジストパターンの製造方法、および接続端子の製造方法
KR20030073875A (ko) * 2002-03-13 2003-09-19 주식회사 하이닉스반도체 반도체소자의 소자분리패턴 형성방법

Also Published As

Publication number Publication date
KR100888568B1 (ko) 2009-03-12
JP2006154570A (ja) 2006-06-15
US20080131819A1 (en) 2008-06-05
TW200632561A (en) 2006-09-16
WO2006059757A2 (en) 2006-06-08
CN101065707A (zh) 2007-10-31
TWI312444B (en) 2009-07-21
KR20070086723A (ko) 2007-08-27
EP1825331B1 (de) 2008-07-02
CN101065707B (zh) 2011-06-01
US7871758B2 (en) 2011-01-18
WO2006059757A3 (en) 2007-07-05
EP1825331A2 (de) 2007-08-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee