DE602005007315D1 - Elektrostatische Klemme mit einer eingebauten Heizung - Google Patents

Elektrostatische Klemme mit einer eingebauten Heizung

Info

Publication number
DE602005007315D1
DE602005007315D1 DE602005007315T DE602005007315T DE602005007315D1 DE 602005007315 D1 DE602005007315 D1 DE 602005007315D1 DE 602005007315 T DE602005007315 T DE 602005007315T DE 602005007315 T DE602005007315 T DE 602005007315T DE 602005007315 D1 DE602005007315 D1 DE 602005007315D1
Authority
DE
Germany
Prior art keywords
heater
built
electrostatic clamp
electrostatic
clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005007315T
Other languages
English (en)
Inventor
Waichi Yamamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE602005007315D1 publication Critical patent/DE602005007315D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE602005007315T 2004-12-22 2005-12-15 Elektrostatische Klemme mit einer eingebauten Heizung Active DE602005007315D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004371593A JP2006179693A (ja) 2004-12-22 2004-12-22 ヒータ付き静電チャック

Publications (1)

Publication Number Publication Date
DE602005007315D1 true DE602005007315D1 (de) 2008-07-17

Family

ID=35623704

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005007315T Active DE602005007315D1 (de) 2004-12-22 2005-12-15 Elektrostatische Klemme mit einer eingebauten Heizung

Country Status (5)

Country Link
US (1) US20060133004A1 (de)
EP (1) EP1675160B1 (de)
JP (1) JP2006179693A (de)
KR (1) KR20060071852A (de)
DE (1) DE602005007315D1 (de)

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CN102044466B (zh) * 2009-10-12 2013-03-27 北京北方微电子基地设备工艺研究中心有限责任公司 一种静电卡盘及其残余电荷的消除方法
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US10062579B2 (en) 2016-10-07 2018-08-28 Applied Materials, Inc. Selective SiN lateral recess
US9947549B1 (en) 2016-10-10 2018-04-17 Applied Materials, Inc. Cobalt-containing material removal
US10163696B2 (en) 2016-11-11 2018-12-25 Applied Materials, Inc. Selective cobalt removal for bottom up gapfill
US9768034B1 (en) 2016-11-11 2017-09-19 Applied Materials, Inc. Removal methods for high aspect ratio structures
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US10566206B2 (en) 2016-12-27 2020-02-18 Applied Materials, Inc. Systems and methods for anisotropic material breakthrough
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US10431429B2 (en) 2017-02-03 2019-10-01 Applied Materials, Inc. Systems and methods for radial and azimuthal control of plasma uniformity
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US10319739B2 (en) 2017-02-08 2019-06-11 Applied Materials, Inc. Accommodating imperfectly aligned memory holes
US10943834B2 (en) 2017-03-13 2021-03-09 Applied Materials, Inc. Replacement contact process
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JP2018182290A (ja) * 2017-04-18 2018-11-15 日新イオン機器株式会社 静電チャック
CN108735648B (zh) * 2017-04-18 2022-11-08 日新离子机器株式会社 静电吸盘
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US10920320B2 (en) 2017-06-16 2021-02-16 Applied Materials, Inc. Plasma health determination in semiconductor substrate processing reactors
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TW517265B (en) * 2000-06-23 2003-01-11 Applied Materials Inc Apparatus for supporting a substrate and method of fabricating same
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Also Published As

Publication number Publication date
EP1675160A1 (de) 2006-06-28
US20060133004A1 (en) 2006-06-22
EP1675160B1 (de) 2008-06-04
KR20060071852A (ko) 2006-06-27
JP2006179693A (ja) 2006-07-06

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