DE602005005223D1 - Beleuchtungsvorrichtung mit Leuchtdioden vom Flip-Chip -Typ und Verfahren zu ihrer Herstellung - Google Patents

Beleuchtungsvorrichtung mit Leuchtdioden vom Flip-Chip -Typ und Verfahren zu ihrer Herstellung

Info

Publication number
DE602005005223D1
DE602005005223D1 DE602005005223T DE602005005223T DE602005005223D1 DE 602005005223 D1 DE602005005223 D1 DE 602005005223D1 DE 602005005223 T DE602005005223 T DE 602005005223T DE 602005005223 T DE602005005223 T DE 602005005223T DE 602005005223 D1 DE602005005223 D1 DE 602005005223D1
Authority
DE
Germany
Prior art keywords
chip type
lighting device
flip
manufacture
type leds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005005223T
Other languages
English (en)
Other versions
DE602005005223T2 (de
Inventor
Jeffrey Chen
Chung-Zen Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NeoBulb Technologies Inc
Original Assignee
NeoBulb Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NeoBulb Technologies Inc filed Critical NeoBulb Technologies Inc
Publication of DE602005005223D1 publication Critical patent/DE602005005223D1/de
Application granted granted Critical
Publication of DE602005005223T2 publication Critical patent/DE602005005223T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
DE602005005223T 2005-01-12 2005-01-12 Beleuchtungsvorrichtung mit Leuchtdioden vom Flip-Chip -Typ und Verfahren zu ihrer Herstellung Active DE602005005223T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05000492A EP1524705B1 (de) 2005-01-12 2005-01-12 Beleuchtungsvorrichtung mit Leuchtdioden vom Flip-Chip -Typ und Verfahren zu ihrer Herstellung

Publications (2)

Publication Number Publication Date
DE602005005223D1 true DE602005005223D1 (de) 2008-04-24
DE602005005223T2 DE602005005223T2 (de) 2009-03-12

Family

ID=34354665

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005005223T Active DE602005005223T2 (de) 2005-01-12 2005-01-12 Beleuchtungsvorrichtung mit Leuchtdioden vom Flip-Chip -Typ und Verfahren zu ihrer Herstellung

Country Status (3)

Country Link
EP (1) EP1524705B1 (de)
AT (1) ATE389240T1 (de)
DE (1) DE602005005223T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202006017583U1 (de) * 2006-11-17 2008-03-27 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Beleuchtungsvorrichtung
CN101711434B (zh) * 2007-06-25 2012-03-21 新灯源科技有限公司 发光二极管照明装置
CN101720407A (zh) * 2007-06-25 2010-06-02 陈振贤 发光二极管照明装置
DE102009015448B4 (de) * 2009-03-28 2011-01-13 BÜRK MOBATIME GmbH Uhr mit LED-Beleuchtungseinheit
US9385285B2 (en) * 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3785820B2 (ja) * 1998-08-03 2006-06-14 豊田合成株式会社 発光装置
TW546806B (en) * 1999-11-08 2003-08-11 Siliconware Precision Industries Co Ltd Semiconductor package with common lead frame and heat sink
DE10041328B4 (de) * 2000-08-23 2018-04-05 Osram Opto Semiconductors Gmbh Verpackungseinheit für Halbleiterchips
JP2002305261A (ja) * 2001-01-10 2002-10-18 Canon Inc 電子部品及びその製造方法
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
JP4504662B2 (ja) * 2003-04-09 2010-07-14 シチズン電子株式会社 Ｌｅｄランプ
US6809261B1 (en) * 2003-06-23 2004-10-26 Agilent Technologies, Inc. Physically compact device package

Also Published As

Publication number Publication date
EP1524705A3 (de) 2005-09-14
EP1524705A2 (de) 2005-04-20
DE602005005223T2 (de) 2009-03-12
ATE389240T1 (de) 2008-03-15
EP1524705B1 (de) 2008-03-12

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Legal Events

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