DE602005003954D1 - Bausatz für einen widerstand mit hermetisch abgedichtetem ptc-thermistor in einer wärmesenke und montageverfahren für solch einen bausatz - Google Patents

Bausatz für einen widerstand mit hermetisch abgedichtetem ptc-thermistor in einer wärmesenke und montageverfahren für solch einen bausatz

Info

Publication number
DE602005003954D1
DE602005003954D1 DE602005003954T DE602005003954T DE602005003954D1 DE 602005003954 D1 DE602005003954 D1 DE 602005003954D1 DE 602005003954 T DE602005003954 T DE 602005003954T DE 602005003954 T DE602005003954 T DE 602005003954T DE 602005003954 D1 DE602005003954 D1 DE 602005003954D1
Authority
DE
Germany
Prior art keywords
ptc thermistor
kit
heat sink
dissipating
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005003954T
Other languages
English (en)
Other versions
DE602005003954T2 (de
Inventor
Roberto Brioschi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gianus SpA
Original Assignee
Gianus SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gianus SpA filed Critical Gianus SpA
Publication of DE602005003954D1 publication Critical patent/DE602005003954D1/de
Application granted granted Critical
Publication of DE602005003954T2 publication Critical patent/DE602005003954T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/02Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/024Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/08Cooling, heating or ventilating arrangements
    • H01C1/084Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Resistance Heating (AREA)
  • Details Of Resistors (AREA)
DE602005003954T 2004-07-27 2005-07-22 Bausatz für einen widerstand mit hermetisch abgedichtetem ptc-thermistor in einer wärmesenke und montageverfahren für solch einen bausatz Active DE602005003954T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITTO20040523 2004-07-27
IT000523A ITTO20040523A1 (it) 2004-07-27 2004-07-27 Resistenza anticondensa con termistore ptc e procedimento di assemblaggio di tale resistenza
PCT/IT2005/000430 WO2006011177A1 (en) 2004-07-27 2005-07-22 Resistor with ptc thermistor hermetically sealed in a heat-sink and process for assembling such a resistor

Publications (2)

Publication Number Publication Date
DE602005003954D1 true DE602005003954D1 (de) 2008-01-31
DE602005003954T2 DE602005003954T2 (de) 2008-12-04

Family

ID=34973168

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005003954T Active DE602005003954T2 (de) 2004-07-27 2005-07-22 Bausatz für einen widerstand mit hermetisch abgedichtetem ptc-thermistor in einer wärmesenke und montageverfahren für solch einen bausatz

Country Status (8)

Country Link
US (1) US7535335B2 (de)
EP (1) EP1771867B1 (de)
AT (1) ATE381765T1 (de)
DE (1) DE602005003954T2 (de)
DK (1) DK1771867T3 (de)
ES (1) ES2299063T3 (de)
IT (1) ITTO20040523A1 (de)
WO (1) WO2006011177A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471085B (zh) 2012-03-15 2015-01-21 Futaba Electric Co Ltd 散熱型電阻及其散熱模組
CN109729736B (zh) * 2017-08-31 2022-07-22 上海利韬电子有限公司 用于座椅电动机保护的聚合物正温度系数装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920000868Y1 (ko) * 1988-07-08 1992-01-31 지이제루 기기 가부시기가이샤 송풍기 제어용의 조절장치
US5049852A (en) * 1990-01-16 1991-09-17 Mosebach Manufacturing Company Resistor grid heat dissipating assembly
US5239163A (en) * 1991-06-19 1993-08-24 Texas Instruments Incorporated Automobile air heater utilizing PTC tablets adhesively fixed to tubular heat sinks
US5481241A (en) * 1993-11-12 1996-01-02 Caddock Electronics, Inc. Film-type heat sink-mounted power resistor combination having only a thin encapsulant, and having an enlarged internal heat sink
US5563570A (en) * 1994-07-01 1996-10-08 Dong A Electric Parts Co., Ltd. Resistor device for controlling a rotational speed of a motor
JPH1032101A (ja) 1996-07-16 1998-02-03 Micro Genics Kk 電力用抵抗器
KR100359245B1 (ko) 1997-12-10 2002-12-18 만도공조 주식회사 블로워 모터의 피티씨 저항 조립체
US6563213B1 (en) * 1999-10-18 2003-05-13 Intel Corporation Integrated circuit heat sink support and retention mechanism
JP2002198207A (ja) 2000-12-26 2002-07-12 Murata Mfg Co Ltd チップ型ptc素子
DE20311068U1 (de) 2003-07-18 2003-09-25 Tuerk & Hillinger Gmbh Bremswiderstand für Elektromotoren

Also Published As

Publication number Publication date
DE602005003954T2 (de) 2008-12-04
DK1771867T3 (da) 2008-03-10
ITTO20040523A1 (it) 2004-10-27
EP1771867B1 (de) 2007-12-19
US20080191835A1 (en) 2008-08-14
US7535335B2 (en) 2009-05-19
ATE381765T1 (de) 2008-01-15
ES2299063T3 (es) 2008-05-16
WO2006011177A1 (en) 2006-02-02
EP1771867A1 (de) 2007-04-11

Similar Documents

Publication Publication Date Title
DK1005417T3 (da) Elastiske laminater og fremgangsmåder til at fremstille samme
ATE386492T1 (de) Heizkissen und ein solches kissen enthaltende vorrichtung
TW200627526A (en) Microswitching element
TW200729561A (en) Luminescence device and manufacturing method of the same
TW200714527A (en) Package and method of closing and opening a package
ATE313931T1 (de) Isolierverglasungselement, insbesondere für gekühltes gehäuse
CN104696627B (zh) 用于车辆的密封装置
ATE288042T1 (de) Dichtungsanordnung
DE602005003954D1 (de) Bausatz für einen widerstand mit hermetisch abgedichtetem ptc-thermistor in einer wärmesenke und montageverfahren für solch einen bausatz
DE602005010988D1 (de) Gehäuse durch ein Glas verschlossen mit nicht sichtbarer Verbindung oder mit Dekorierungsmöglichkeit, und Herstellungsverfahren dafür
WO2009017001A1 (ja) 回路部材の接続構造
TW200500051A (en) Elastic fastening tab, fastening system and method for manufacturing the same
MX2021011360A (es) Panel compuesto que comprende un elemento de incrustacion funcional.
ATE363050T1 (de) Methode zum halten einer abdeckung an einem gehäuse
CN106231836A (zh) 封闭式显示装置及其组装方法
WO2004111502A3 (en) Laminated carrier gasket with off-set elastomeric sealing
ATE527208T1 (de) Mikrosystem mit verformbarer brücke
FI20011080A0 (fi) Lämmön talteenottokennon tiivistysjärjestely
ATE495925T1 (de) Heizgerät mit thermoelektrischem modul
MX2021008415A (es) Montaje de sello de multiples componentes.
DE602004009203D1 (de) Biegen von verbundenen glasstafeln
JPS5441742A (en) Heat recording elements
FR3034253B1 (fr) Dispositif de puce electronique a resistance thermique amelioree, et procede de fabrication associe
JP2013008775A (ja) 熱交換ユニットおよび熱電変換モジュールの組み付け方法
KR20210017353A (ko) 튜브리스 피티씨 히터 및 이를 포함하는 히터 장치

Legal Events

Date Code Title Description
8364 No opposition during term of opposition