DE602004013958D1 - Abgeschlossenes leitfähiges strukturiertes blatt mit leitfähigen durchgängen - Google Patents

Abgeschlossenes leitfähiges strukturiertes blatt mit leitfähigen durchgängen

Info

Publication number
DE602004013958D1
DE602004013958D1 DE602004013958T DE602004013958T DE602004013958D1 DE 602004013958 D1 DE602004013958 D1 DE 602004013958D1 DE 602004013958 T DE602004013958 T DE 602004013958T DE 602004013958 T DE602004013958 T DE 602004013958T DE 602004013958 D1 DE602004013958 D1 DE 602004013958D1
Authority
DE
Germany
Prior art keywords
conductive
completed
passages
structured sheet
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004013958T
Other languages
English (en)
Inventor
Robert Paul Bourdelais
Cheryl Jane Brickey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of DE602004013958D1 publication Critical patent/DE602004013958D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24744—Longitudinal or transverse tubular cavity or cell

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE602004013958T 2003-04-28 2004-04-21 Abgeschlossenes leitfähiges strukturiertes blatt mit leitfähigen durchgängen Expired - Lifetime DE602004013958D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/425,012 US7138170B2 (en) 2003-04-28 2003-04-28 Terminated conductive patterned sheet utilizing conductive conduits
PCT/US2004/012298 WO2004097848A1 (en) 2003-04-28 2004-04-21 Terminated conductive patterned sheet utilizing conductive conduits

Publications (1)

Publication Number Publication Date
DE602004013958D1 true DE602004013958D1 (de) 2008-07-03

Family

ID=33299443

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004013958T Expired - Lifetime DE602004013958D1 (de) 2003-04-28 2004-04-21 Abgeschlossenes leitfähiges strukturiertes blatt mit leitfähigen durchgängen

Country Status (6)

Country Link
US (1) US7138170B2 (de)
EP (1) EP1618571B1 (de)
JP (1) JP2007525819A (de)
CN (1) CN1781161A (de)
DE (1) DE602004013958D1 (de)
WO (1) WO2004097848A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050156318A1 (en) * 2004-01-15 2005-07-21 Douglas Joel S. Security marking and security mark
KR100668943B1 (ko) * 2004-04-23 2007-01-12 주식회사 엘지화학 편광판용 아크릴계 점착제 조성물
US7414313B2 (en) * 2004-12-22 2008-08-19 Eastman Kodak Company Polymeric conductor donor and transfer method
US7543974B2 (en) * 2007-03-06 2009-06-09 Skc Haas Display Films Co., Ltd. Light redirecting film having variable thickness
US7530726B2 (en) * 2007-03-06 2009-05-12 Skc Haas Display Films Co., Ltd. Light redirecting film having discontinuous coating
JP5092653B2 (ja) * 2007-09-28 2012-12-05 大日本印刷株式会社 ハードディスクドライブ用サスペンション
DE102007057650A1 (de) * 2007-11-28 2009-06-04 H.C. Starck Gmbh Strukturierung von leitfähigen Polymerschichten mittels des Lift-Off-Prozesses
US20090155963A1 (en) * 2007-12-12 2009-06-18 Hawkins Gilbert A Forming thin film transistors using ablative films
WO2009134697A2 (en) * 2008-04-30 2009-11-05 Applied Materials, Inc. Roll to roll oled production system
US9034277B2 (en) * 2008-10-24 2015-05-19 Honeywell International Inc. Surface preparation for a microfluidic channel
CN102271607B (zh) * 2008-11-11 2014-03-19 施菲姆德控股有限责任公司 小外形的电极组件
US9795442B2 (en) 2008-11-11 2017-10-24 Shifamed Holdings, Llc Ablation catheters
JP5332759B2 (ja) * 2009-03-12 2013-11-06 大日本印刷株式会社 導電性基板の製造方法及び導電性基板
JP5792802B2 (ja) 2010-05-12 2015-10-14 シファメド・ホールディングス・エルエルシー 低い外形の電極組立体
US9655677B2 (en) 2010-05-12 2017-05-23 Shifamed Holdings, Llc Ablation catheters including a balloon and electrodes
GB2505292B (en) * 2011-01-28 2015-06-10 Novalia Ltd Printed article
US10098694B2 (en) 2013-04-08 2018-10-16 Apama Medical, Inc. Tissue ablation and monitoring thereof
AU2014251039B2 (en) 2013-04-08 2018-12-06 Apama Medical, Inc. Cardiac ablation catheters and methods of use thereof
US10349824B2 (en) 2013-04-08 2019-07-16 Apama Medical, Inc. Tissue mapping and visualization systems
IL225976A (en) * 2013-04-25 2015-02-26 Rafi Kalish A diamond surface ending in hydrogen and coated with molybdenum trioxide and its uses
WO2015032915A1 (en) * 2013-09-06 2015-03-12 Solvay Specialty Polymers Italy S.P.A. Electrically conducting assemblies
EP4302713A3 (de) 2015-11-16 2024-03-13 Boston Scientific Scimed, Inc. Energieabgabevorrichtungen
CN106288107A (zh) * 2016-10-28 2017-01-04 佛山市南海科日超声电子有限公司 具有发光功能的雾化器
CN111276515B (zh) * 2020-02-07 2022-10-04 武汉华星光电半导体显示技术有限公司 Oled显示面板及其制备方法
WO2023239371A1 (en) * 2022-06-10 2023-12-14 Hewlett-Packard Development Company, L.P. Anisotropic coatings

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US4008300A (en) * 1974-10-15 1977-02-15 A & P Products Incorporated Multi-conductor element and method of making same
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
JP2700553B2 (ja) * 1988-03-31 1998-01-21 株式会社 潤工社 伝送回路
US5225273A (en) * 1989-12-28 1993-07-06 Teijin Limited Transparent electroconductive laminate
US5063128A (en) * 1989-12-29 1991-11-05 Xerox Corporation Conductive and blocking layers for electrophotographic imaging members
US5087494A (en) * 1991-04-12 1992-02-11 Minnesota Mining And Manufacturing Company Electrically conductive adhesive tape
JPH075450A (ja) * 1993-06-16 1995-01-10 Nippon Sheet Glass Co Ltd 透明配線付き基板およびその製造方法
US5443876A (en) * 1993-12-30 1995-08-22 Minnesota Mining And Manufacturing Company Electrically conductive structured sheets
US5399390A (en) * 1994-01-27 1995-03-21 Motorola, Inc. Liquid crystal display with polymeric substrate
KR19990007929A (ko) * 1995-04-26 1999-01-25 데이빗로스클리블랜드 다면 반복 노광 방법 및 장치
US6124974A (en) * 1996-01-26 2000-09-26 Proxemics Lenslet array systems and methods
KR100268006B1 (ko) * 1997-05-22 2000-10-16 구본준 액정표시소자용반사판의제조방법
EP1051762A1 (de) * 1998-02-02 2000-11-15 Uniax Corporation X-y adressierbare elektrische mikroschalteranordnung und seine verwendung in sensormatrizen
JP2001203081A (ja) * 1999-11-09 2001-07-27 Matsushita Electric Ind Co Ltd 薄膜ｅｌ素子およびその製造方法
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KR20040030553A (ko) * 2001-03-26 2004-04-09 에이코스 인코포레이티드 탄소 나노튜브를 함유하는 코팅막
EP1401909B1 (de) * 2001-06-22 2010-08-18 Agfa-Gevaert N.V. Flexodruckfarbe, enthaltend ein 3,4-dialkoxythiophenpolymer oder -copolymer
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WO2004019345A1 (en) 2002-08-22 2004-03-04 Agfa-Gevaert Process for preparing a substantially transparent conductive layer

Also Published As

Publication number Publication date
CN1781161A (zh) 2006-05-31
EP1618571B1 (de) 2008-05-21
EP1618571A1 (de) 2006-01-25
US7138170B2 (en) 2006-11-21
WO2004097848A1 (en) 2004-11-11
JP2007525819A (ja) 2007-09-06
US20040213963A1 (en) 2004-10-28

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