DE602004012675D1 - Verfahren zur Herstellung eines metallischen feinteiligen Musters und Verfahren zur Herstellung eines elektroleitfähigen Musters - Google Patents

Verfahren zur Herstellung eines metallischen feinteiligen Musters und Verfahren zur Herstellung eines elektroleitfähigen Musters

Info

Publication number
DE602004012675D1
DE602004012675D1 DE602004012675T DE602004012675T DE602004012675D1 DE 602004012675 D1 DE602004012675 D1 DE 602004012675D1 DE 602004012675 T DE602004012675 T DE 602004012675T DE 602004012675 T DE602004012675 T DE 602004012675T DE 602004012675 D1 DE602004012675 D1 DE 602004012675D1
Authority
DE
Germany
Prior art keywords
pattern
producing
making
metallic fine
electroconductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004012675T
Other languages
English (en)
Other versions
DE602004012675T2 (de
Inventor
Takeyoshi Kanou
Koichi Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of DE602004012675D1 publication Critical patent/DE602004012675D1/de
Application granted granted Critical
Publication of DE602004012675T2 publication Critical patent/DE602004012675T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/36—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used using a polymeric layer, which may be particulate and which is deformed or structurally changed with modification of its' properties, e.g. of its' optical hydrophobic-hydrophilic, solubility or permeability properties
    • B41M5/368—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used using a polymeric layer, which may be particulate and which is deformed or structurally changed with modification of its' properties, e.g. of its' optical hydrophobic-hydrophilic, solubility or permeability properties involving the creation of a soluble/insoluble or hydrophilic/hydrophobic permeability pattern; Peel development
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G03F7/0955—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Optics & Photonics (AREA)
  • Pest Control & Pesticides (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Electric Cables (AREA)
DE602004012675T 2003-08-20 2004-08-20 Verfahren zur Herstellung eines metallischen feinteiligen Musters und Verfahren zur Herstellung eines elektroleitfähigen Musters Active DE602004012675T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003208053 2003-08-20
JP2003208053 2003-08-20
JP2004237004 2004-08-17
JP2004237004A JP4348253B2 (ja) 2003-08-20 2004-08-17 導電性パターン材料及び導電性パターンの形成方法

Publications (2)

Publication Number Publication Date
DE602004012675D1 true DE602004012675D1 (de) 2008-05-08
DE602004012675T2 DE602004012675T2 (de) 2009-04-09

Family

ID=34067368

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004012675T Active DE602004012675T2 (de) 2003-08-20 2004-08-20 Verfahren zur Herstellung eines metallischen feinteiligen Musters und Verfahren zur Herstellung eines elektroleitfähigen Musters

Country Status (4)

Country Link
US (1) US7279195B2 (de)
EP (1) EP1508453B1 (de)
JP (1) JP4348253B2 (de)
DE (1) DE602004012675T2 (de)

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IL149950A0 (en) * 1999-12-17 2002-11-10 Cartificial As A prosthetic device
JP3866579B2 (ja) * 2002-01-25 2007-01-10 富士フイルムホールディングス株式会社 薄層金属膜
MY148655A (en) * 2003-11-27 2013-05-15 Fuji Photo Film Co Ltd Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same
US20080038468A1 (en) * 2004-08-26 2008-02-14 Fujifilm Corporation Method for manufacturing an electro-conductive pattern material
KR101037030B1 (ko) * 2004-11-23 2011-05-25 삼성전자주식회사 금속 나노 결정을 이용한 금속패턴 형성 방법
US20090092766A1 (en) * 2005-05-20 2009-04-09 Fujifilm Corporation Graft pattern forming method and conductive pattern forming method
JP2006350307A (ja) * 2005-05-20 2006-12-28 Fujifilm Holdings Corp グラフトパターン形成方法及び導電性パターン形成方法
JP4850487B2 (ja) * 2005-11-07 2012-01-11 富士フイルム株式会社 プリント配線板用積層体、それを用いたプリント配線板、プリント配線基板の作製方法、電気部品、電子部品、および、電気機器
JP5013723B2 (ja) * 2006-03-09 2012-08-29 キヤノン株式会社 微粒子パターン形成方法及びデバイスの製造方法
JP2008047793A (ja) * 2006-08-21 2008-02-28 Konica Minolta Holdings Inc 金属パターンの形成方法
JP2008260272A (ja) * 2007-03-16 2008-10-30 Fujifilm Corp 積層体、グラフト膜形成方法、グラフトパターン形成方法、金属パターン形成方法、プリント配線基板、薄層トランジスタ、装置、及びフォトマスク
US7947328B2 (en) * 2007-09-28 2011-05-24 Fujifilm Corporation Metal pattern forming method
EP2391924B1 (de) 2009-01-29 2013-07-24 Digiflex Ltd. Verfahren zur herstellung einer fotomaske auf einer fotopolymeroberfläche
US20100206959A1 (en) * 2009-02-19 2010-08-19 Panasonic Corporation Chemical substance concentration method
US20140267107A1 (en) 2013-03-15 2014-09-18 Sinovia Technologies Photoactive Transparent Conductive Films
JP2013122443A (ja) * 2011-11-11 2013-06-20 Hideo Ando 生体活動測定方法、生体活動測定装置、生体活動検出信号の転送方法および生体活動情報を利用したサービスの提供方法
KR101468690B1 (ko) * 2012-11-19 2014-12-04 엔젯 주식회사 고점도 전도성 나노 잉크 조성물로 이루어진 전극선을 포함하는 투명전극 및 이를 이용한 터치센서, 투명히터 및 전자파 차폐제
US10106699B2 (en) * 2013-02-20 2018-10-23 Wisconsin Alumni Research Foundation Inimer-containing random copolymers and crosslinked copolymer films for dense polymer brush growth
JP2014239871A (ja) 2013-05-07 2014-12-25 安東　秀夫 生体活動検出方法、生体活動測定装置、生体活動検出信号の転送方法および生体活動情報を利用したサービスの提供方法
US9005854B1 (en) * 2013-11-05 2015-04-14 Eastman Kodak Company Electroless plating method using halide
US8936890B1 (en) * 2013-11-05 2015-01-20 Eastman Kodak Company Electroless plating method
WO2023162968A1 (ja) * 2022-02-22 2023-08-31 日産化学株式会社 自己架橋性ポリマーを含む光硬化性樹脂組成物

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Also Published As

Publication number Publication date
EP1508453A3 (de) 2006-04-19
US20050064108A1 (en) 2005-03-24
DE602004012675T2 (de) 2009-04-09
EP1508453A2 (de) 2005-02-23
JP4348253B2 (ja) 2009-10-21
US7279195B2 (en) 2007-10-09
JP2005101554A (ja) 2005-04-14
EP1508453B1 (de) 2008-03-26

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: KAWAMURA, KOICHI, HAIBARA-GUN SHIZUOKA-KEN, JP

Inventor name: KANOU, TAKEYOSHI, HAIBARA-GUN SHIZUOKA-KEN, JP

8364 No opposition during term of opposition