DE602004008653D1 - Flexible konforme antenne - Google Patents

Flexible konforme antenne

Info

Publication number
DE602004008653D1
DE602004008653D1 DE602004008653T DE602004008653T DE602004008653D1 DE 602004008653 D1 DE602004008653 D1 DE 602004008653D1 DE 602004008653 T DE602004008653 T DE 602004008653T DE 602004008653 T DE602004008653 T DE 602004008653T DE 602004008653 D1 DE602004008653 D1 DE 602004008653D1
Authority
DE
Germany
Prior art keywords
electrical communication
flexible
conformant
antenna
transition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004008653T
Other languages
English (en)
Other versions
DE602004008653T2 (de
Inventor
Stephen R Kerner
Clifton Quan
Raquel Z Rokosky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of DE602004008653D1 publication Critical patent/DE602004008653D1/de
Application granted granted Critical
Publication of DE602004008653T2 publication Critical patent/DE602004008653T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H01Q21/0093—Monolithic arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguide Connection Structure (AREA)
  • Waveguides (AREA)
  • Details Of Aerials (AREA)
  • Transceivers (AREA)
  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
DE602004008653T 2003-09-03 2004-07-22 Flexible konforme antenne Active DE602004008653T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US654121 1991-02-14
US10/654,121 US6992629B2 (en) 2003-09-03 2003-09-03 Embedded RF vertical interconnect for flexible conformal antenna
PCT/US2004/023358 WO2005025001A1 (en) 2003-09-03 2004-07-22 Embedded rf vertical interconnect for flexible conformal antenna

Publications (2)

Publication Number Publication Date
DE602004008653D1 true DE602004008653D1 (de) 2007-10-11
DE602004008653T2 DE602004008653T2 (de) 2008-06-05

Family

ID=34218016

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004008653T Active DE602004008653T2 (de) 2003-09-03 2004-07-22 Flexible konforme antenne

Country Status (12)

Country Link
US (1) US6992629B2 (de)
EP (1) EP1661207B1 (de)
JP (1) JP4571638B2 (de)
KR (1) KR100733103B1 (de)
AT (1) ATE371965T1 (de)
AU (1) AU2004303071B2 (de)
CA (2) CA2729740C (de)
DE (1) DE602004008653T2 (de)
DK (1) DK1661207T3 (de)
ES (1) ES2290766T3 (de)
NO (1) NO20061449L (de)
WO (1) WO2005025001A1 (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7098853B2 (en) * 2004-07-21 2006-08-29 Raytheon Company Conformal channel monopole array antenna
US9395718B1 (en) 2005-06-03 2016-07-19 Sciperio, Inc. Optimization of unique antenna and RF systems for specific substrates
EP1784063A1 (de) * 2005-11-08 2007-05-09 Alcatel Lucent Leiterplatte mit darauf montierten mikroelektronischen Komponenten und Verfahren zur Herstellung einer solchen Leiterplatte
US20070210959A1 (en) * 2006-03-07 2007-09-13 Massachusetts Institute Of Technology Multi-beam tile array module for phased array systems
US7671696B1 (en) * 2006-09-21 2010-03-02 Raytheon Company Radio frequency interconnect circuits and techniques
US9019166B2 (en) 2009-06-15 2015-04-28 Raytheon Company Active electronically scanned array (AESA) card
US9172145B2 (en) 2006-09-21 2015-10-27 Raytheon Company Transmit/receive daughter card with integral circulator
US8279131B2 (en) * 2006-09-21 2012-10-02 Raytheon Company Panel array
US7869225B2 (en) * 2007-04-30 2011-01-11 Freescale Semiconductor, Inc. Shielding structures for signal paths in electronic devices
US7631414B2 (en) * 2007-08-13 2009-12-15 Raytheon Company Methods for producing large flat panel and conformal active array antennas
US7733265B2 (en) * 2008-04-04 2010-06-08 Toyota Motor Engineering & Manufacturing North America, Inc. Three dimensional integrated automotive radars and methods of manufacturing the same
US7830301B2 (en) * 2008-04-04 2010-11-09 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for automotive radars
US8022861B2 (en) * 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
FR2930374B1 (fr) * 2008-04-18 2011-08-26 Thales Sa Circulateur radiofrequence a base de mems.
FR2936610B1 (fr) * 2008-09-30 2011-11-25 Thales Sa Module d'emission et de reception de signaux hyperfrequences en bande x sur circuit multicouche et antenne active
US7990237B2 (en) * 2009-01-16 2011-08-02 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for improving performance of coplanar waveguide bends at mm-wave frequencies
US7965235B2 (en) * 2009-02-24 2011-06-21 Raytheon Company Multi-channel thinned TR module architecture
US7876263B2 (en) * 2009-02-24 2011-01-25 Raytheon Company Asymmetrically thinned active array TR module and antenna architecture
US8538071B2 (en) * 2009-03-18 2013-09-17 Raytheon Company System and method for target separation of closely spaced targets in automatic target recognition
IL197906A (en) * 2009-04-05 2014-09-30 Elta Systems Ltd Antenna arrays and method for creating them
US20110024160A1 (en) * 2009-07-31 2011-02-03 Clifton Quan Multi-layer microwave corrugated printed circuit board and method
US20110031246A1 (en) * 2009-08-07 2011-02-10 Massey Jr Raymond C Tamper-Resistant Storage Container
US9072164B2 (en) * 2009-11-17 2015-06-30 Raytheon Company Process for fabricating a three dimensional molded feed structure
US8043464B2 (en) * 2009-11-17 2011-10-25 Raytheon Company Systems and methods for assembling lightweight RF antenna structures
US8362856B2 (en) * 2009-11-17 2013-01-29 Raytheon Company RF transition with 3-dimensional molded RF structure
US8127432B2 (en) * 2009-11-17 2012-03-06 Raytheon Company Process for fabricating an origami formed antenna radiating structure
US8537059B2 (en) * 2009-11-20 2013-09-17 Raytheon Company Cooling system for panel array antenna
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications
RU2488220C1 (ru) * 2011-12-28 2013-07-20 Аслан Юсуфович Хуако Приемопередатчик
JP2016524336A (ja) * 2013-07-03 2016-08-12 ローゼンベルガー ホーフフレクベンツテクニーク ゲーエムベーハー ウント ツェーオー カーゲー 全体的または部分的に溶着された誘電体リード線を有するダイパッケージング
US10109920B2 (en) 2015-09-09 2018-10-23 The Johns Hopkins University Metasurface antenna
KR102384505B1 (ko) * 2016-01-12 2022-04-08 삼성전자주식회사 칩 간 무선 통신을 제공하기 위한 방법 및 장치
DE102016007052A1 (de) * 2016-06-06 2017-12-07 Kathrein-Werke Kg Leiterplattenanordnung zur Signalversorgung eines Strahlers
WO2019079123A1 (en) * 2017-10-17 2019-04-25 Commscope Technologies Llc VERTICAL TRANSITIONS FOR MICROWAVE AND MILLIMETER WAVE COMMUNICATION SYSTEMS HAVING MULTILAYER SUBSTRATES
KR102578395B1 (ko) * 2019-04-25 2023-09-14 엘지전자 주식회사 커넥터를 구비하는 전자 기기
DE102019110840A1 (de) * 2019-04-26 2020-10-29 Infineon Technologies Ag Rf-vorrichtungen mit konformen antennen und verfahren zu deren herstellung
CN111586965B (zh) * 2020-05-25 2022-03-22 上海航天电子通讯设备研究所 基于lcp基材的高功率共形组件制备方法及共形组件
CN111640682B (zh) * 2020-05-31 2022-07-08 西南电子技术研究所（中国电子科技集团公司第十研究所） 分离器件金丝键合过渡结构
TWI749580B (zh) * 2020-06-08 2021-12-11 星河半導體股份有限公司 多通道天線晶片測試系統及方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS636884Y2 (de) * 1981-01-16 1988-02-27
US5416453A (en) * 1989-09-29 1995-05-16 Hughes Aircraft Company Coaxial-to-microstrip orthogonal launchers having troughline convertors
FR2681946A1 (fr) * 1991-09-27 1993-04-02 Thomson Csf Dispositif pour tests hyperfrequences a large bande realises in situ.
JPH06268414A (ja) * 1993-03-12 1994-09-22 Nec Corp マイクロストリップ線路型サーキュレータ
JP2912158B2 (ja) * 1994-05-17 1999-06-28 日本電気アイシーマイコンシステム株式会社 信号線切替回路
JPH08250912A (ja) * 1995-03-14 1996-09-27 Japan Radio Co Ltd ストリップラインの垂直給電部
US5570068A (en) * 1995-05-26 1996-10-29 Hughes Aircraft Company Coaxial-to-coplanar-waveguide transmission line connector using integrated slabline transition
US5668509A (en) * 1996-03-25 1997-09-16 Hughes Electronics Modified coaxial to GCPW vertical solderless interconnects for stack MIC assemblies
US6127978A (en) * 1997-03-28 2000-10-03 Honda Giken Kogyo Kabushiki Kaisha Planar antenna module
JP3635873B2 (ja) * 1997-06-26 2005-04-06 三菱電機株式会社 ストリップライン給電装置
JP3149831B2 (ja) 1997-11-07 2001-03-26 日本電気株式会社 高周波集積回路およびその製造方法
US6154176A (en) * 1998-08-07 2000-11-28 Sarnoff Corporation Antennas formed using multilayer ceramic substrates
US6356245B2 (en) 1999-04-01 2002-03-12 Space Systems/Loral, Inc. Microwave strip transmission lines, beamforming networks and antennas and methods for preparing the same
US6236287B1 (en) * 1999-05-12 2001-05-22 Raytheon Company Wideband shielded coaxial to microstrip orthogonal launcher using distributed discontinuities
JP3710652B2 (ja) * 1999-08-03 2005-10-26 三菱電機株式会社 ストリップライン給電装置
JP2001144511A (ja) * 1999-11-17 2001-05-25 Mitsubishi Electric Corp 平面型導波路の接続用変換器
US6683570B2 (en) * 2001-03-29 2004-01-27 Tyco Electronics Corporation Compact multi-band antenna
US6815739B2 (en) * 2001-05-18 2004-11-09 Corporation For National Research Initiatives Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates

Also Published As

Publication number Publication date
CA2729740A1 (en) 2005-03-17
EP1661207A1 (de) 2006-05-31
KR20060083200A (ko) 2006-07-20
US20050046510A1 (en) 2005-03-03
JP4571638B2 (ja) 2010-10-27
AU2004303071A1 (en) 2005-03-17
EP1661207B1 (de) 2007-08-29
KR100733103B1 (ko) 2007-06-28
JP2007504749A (ja) 2007-03-01
CA2525620C (en) 2011-02-08
NO20061449L (no) 2006-03-30
US6992629B2 (en) 2006-01-31
WO2005025001A1 (en) 2005-03-17
ES2290766T3 (es) 2008-02-16
CA2729740C (en) 2013-04-02
DE602004008653T2 (de) 2008-06-05
AU2004303071B2 (en) 2008-02-28
CA2525620A1 (en) 2005-03-17
DK1661207T3 (da) 2007-09-24
ATE371965T1 (de) 2007-09-15
WO2005025001A8 (en) 2005-10-27

Similar Documents

Publication Publication Date Title
DE602004008653D1 (de) Flexible konforme antenne
US9484633B2 (en) Loop antenna having a parasitically coupled element
EP1524723A4 (de) Antenneneinrichtung und tragbares funkkommunikationsendgerät
US20040080464A1 (en) Dual band single feed dipole antenna and method of making the same
WO2008033459A3 (en) Printed circuit notch antenna
TW343323B (en) Thin radio frequency transponder with leadframe antenna structure
EP2026381A3 (de) Voll integriertes RF-Sendeempfängerschaltung
WO2011022556A3 (en) Precision waveguide interface
ATE381031T1 (de) Abstandsmessvorrichtung mit einer mikrowellen- antennenanordnung
TW200744256A (en) Radio frequency identification tag and antenna for radio frequency identification tag
FR2811479B1 (fr) Antenne a couche conductrice et dispositif de transmission bi-bande incluant cette antenne
ATE543197T1 (de) Antennenanordnung für eine elektronische vorrichtung und elektronische vorrichtung damit
EP1939986A3 (de) Lokale, drahtlose Kommunikationen in einer Vorrichtung
DE60300863D1 (de) Funkgerät mit eingebauter antenne
DE602004013054D1 (de) Planarantenne für mobil-satellitenanwendungen
MX2010002757A (es) Antena bipolar quebrada impresa, simetrica.
DE602008005921D1 (de) Mehrband-zellularantenne
EP4277038A3 (de) Kontaktloser übergang von mikrostreifen zu wellenleiter
US20090315785A1 (en) Antenna and wireless communication device using same
DE60120066D1 (de) Elektronisches Gerät mit dielektrischer Streifenleiterantenne
SE9704052L (sv) Portabel elektronisk kommunikationsanordning med dubbelbandigt antennsystem
ATE279027T1 (de) Anordnung zur wirkungsgradsteigerung einer antenne
US8026856B2 (en) Antenna and wireless communication device using same
DE602007004496D1 (de) Elektronische schieberformfaktoreinrichtung mit verbesserter niederband-leistungsfähigkeit
TW200715654A (en) Hidden multi-band antenna used for portable devices

Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Representative=s name: WITTE, WELLER & PARTNER, 70178 STUTTGART

8364 No opposition during term of opposition