DE602004008075D1 - Bistabiler mikroschalter mit geringer stromaufnahme - Google Patents

Bistabiler mikroschalter mit geringer stromaufnahme

Info

Publication number
DE602004008075D1
DE602004008075D1 DE602004008075T DE602004008075T DE602004008075D1 DE 602004008075 D1 DE602004008075 D1 DE 602004008075D1 DE 602004008075 T DE602004008075 T DE 602004008075T DE 602004008075 T DE602004008075 T DE 602004008075T DE 602004008075 D1 DE602004008075 D1 DE 602004008075D1
Authority
DE
Germany
Prior art keywords
substrate
power consumption
low power
conductive tracks
deformed position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004008075T
Other languages
English (en)
Other versions
DE602004008075T2 (de
Inventor
Philippe Robert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE602004008075D1 publication Critical patent/DE602004008075D1/de
Application granted granted Critical
Publication of DE602004008075T2 publication Critical patent/DE602004008075T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0042—Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H2061/006—Micromechanical thermal relay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Micromachines (AREA)
  • Liquid Crystal (AREA)
  • Thermally Actuated Switches (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Polyesters Or Polycarbonates (AREA)
DE602004008075T 2003-07-01 2004-06-30 Bistabiler mikroschalter mit geringer stromaufnahme Expired - Lifetime DE602004008075T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0350278A FR2857153B1 (fr) 2003-07-01 2003-07-01 Micro-commutateur bistable a faible consommation.
FR0350278 2003-07-01
PCT/FR2004/050298 WO2005006364A1 (fr) 2003-07-01 2004-06-30 Micro-commutateur bistable a faible consommation

Publications (2)

Publication Number Publication Date
DE602004008075D1 true DE602004008075D1 (de) 2007-09-20
DE602004008075T2 DE602004008075T2 (de) 2008-05-15

Family

ID=33523072

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004008075T Expired - Lifetime DE602004008075T2 (de) 2003-07-01 2004-06-30 Bistabiler mikroschalter mit geringer stromaufnahme

Country Status (7)

Country Link
US (1) US7489228B2 (de)
EP (1) EP1639613B1 (de)
JP (1) JP4464397B2 (de)
AT (1) ATE369612T1 (de)
DE (1) DE602004008075T2 (de)
FR (1) FR2857153B1 (de)
WO (1) WO2005006364A1 (de)

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WO1999052006A2 (en) 1998-04-08 1999-10-14 Etalon, Inc. Interferometric modulation of radiation
US8928967B2 (en) 1998-04-08 2015-01-06 Qualcomm Mems Technologies, Inc. Method and device for modulating light
WO2003007049A1 (en) 1999-10-05 2003-01-23 Iridigm Display Corporation Photonic mems and structures
FR2865724A1 (fr) * 2004-02-04 2005-08-05 St Microelectronics Sa Microsysteme electromecanique pouvant basculer entre deux positions stables
US20050269688A1 (en) * 2004-06-03 2005-12-08 Lior Shiv Microelectromechanical systems (MEMS) devices integrated in a hermetically sealed package
US8008736B2 (en) 2004-09-27 2011-08-30 Qualcomm Mems Technologies, Inc. Analog interferometric modulator device
US7372613B2 (en) 2004-09-27 2008-05-13 Idc, Llc Method and device for multistate interferometric light modulation
US7724993B2 (en) * 2004-09-27 2010-05-25 Qualcomm Mems Technologies, Inc. MEMS switches with deforming membranes
US7944599B2 (en) 2004-09-27 2011-05-17 Qualcomm Mems Technologies, Inc. Electromechanical device with optical function separated from mechanical and electrical function
US7446927B2 (en) * 2004-09-27 2008-11-04 Idc, Llc MEMS switch with set and latch electrodes
US7289259B2 (en) 2004-09-27 2007-10-30 Idc, Llc Conductive bus structure for interferometric modulator array
US7719500B2 (en) 2004-09-27 2010-05-18 Qualcomm Mems Technologies, Inc. Reflective display pixels arranged in non-rectangular arrays
US7420725B2 (en) 2004-09-27 2008-09-02 Idc, Llc Device having a conductive light absorbing mask and method for fabricating same
US7936497B2 (en) 2004-09-27 2011-05-03 Qualcomm Mems Technologies, Inc. MEMS device having deformable membrane characterized by mechanical persistence
US7893919B2 (en) 2004-09-27 2011-02-22 Qualcomm Mems Technologies, Inc. Display region architectures
US7283030B2 (en) * 2004-11-22 2007-10-16 Eastman Kodak Company Doubly-anchored thermal actuator having varying flexural rigidity
US7339454B1 (en) * 2005-04-11 2008-03-04 Sandia Corporation Tensile-stressed microelectromechanical apparatus and microelectromechanical relay formed therefrom
US7916980B2 (en) 2006-01-13 2011-03-29 Qualcomm Mems Technologies, Inc. Interconnect structure for MEMS device
US7649671B2 (en) 2006-06-01 2010-01-19 Qualcomm Mems Technologies, Inc. Analog interferometric modulator device with electrostatic actuation and release
US7835061B2 (en) 2006-06-28 2010-11-16 Qualcomm Mems Technologies, Inc. Support structures for free-standing electromechanical devices
US7527998B2 (en) 2006-06-30 2009-05-05 Qualcomm Mems Technologies, Inc. Method of manufacturing MEMS devices providing air gap control
US7684106B2 (en) 2006-11-02 2010-03-23 Qualcomm Mems Technologies, Inc. Compatible MEMS switch architecture
US7724417B2 (en) * 2006-12-19 2010-05-25 Qualcomm Mems Technologies, Inc. MEMS switches with deforming membranes
FR2911448B1 (fr) * 2007-01-16 2009-07-10 St Microelectronics Sa Resonateur acoustique en volume a frequence de resonance reglable et utilisation d'un tel resonateur dans le domaine de la telephonie
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US8022896B2 (en) * 2007-08-08 2011-09-20 Qualcomm Mems Technologies, Inc. ESD protection for MEMS display panels
JP2009077479A (ja) * 2007-09-19 2009-04-09 Japan Radio Co Ltd 無線スイッチ制御装置
US20090146773A1 (en) * 2007-12-07 2009-06-11 Honeywell International Inc. Lateral snap acting mems micro switch
US7642135B2 (en) * 2007-12-17 2010-01-05 Skyworks Solutions, Inc. Thermal mechanical flip chip die bonding
US8232858B1 (en) * 2008-02-20 2012-07-31 Sandia Corporation Microelectromechanical (MEM) thermal actuator
US7944604B2 (en) 2008-03-07 2011-05-17 Qualcomm Mems Technologies, Inc. Interferometric modulator in transmission mode
DE102009018744A1 (de) 2009-04-27 2010-10-28 Stock E.K. Bernd Vorrichtung zur mechanischen Fixierung von Gegenständen
US8582254B2 (en) 2009-05-29 2013-11-12 General Electric Company Switching array having circuitry to adjust a temporal distribution of a gating signal applied to the array
US8427792B2 (en) 2009-05-29 2013-04-23 General Electric Company Method and system to enhance reliability of switch array
JP5263203B2 (ja) * 2010-03-12 2013-08-14 オムロン株式会社 静電リレー
US8339787B2 (en) * 2010-09-08 2012-12-25 Apple Inc. Heat valve for thermal management in a mobile communications device
CN102142338A (zh) * 2010-12-16 2011-08-03 上海交通大学 面内运动的多向多通道多稳态微机电开关
US9134527B2 (en) 2011-04-04 2015-09-15 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US8963159B2 (en) 2011-04-04 2015-02-24 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
FR2984008B1 (fr) * 2011-12-13 2014-01-10 Commissariat Energie Atomique Dispositif electronique
FR2990320B1 (fr) 2012-05-07 2014-06-06 Commissariat Energie Atomique Haut-parleur digital a performance amelioree
ITTO20120691A1 (it) * 2012-08-01 2014-02-02 Milano Politecnico Sensore d'urto con meccanismo bistabile e metodo per il rilevamento di urti
FR3012671B1 (fr) * 2013-10-29 2015-11-13 St Microelectronics Rousset Dispositif mecanique integre a mouvement vertical
WO2017082985A2 (en) 2015-08-20 2017-05-18 Northeaslem University Zero power plasmonic microelectromechanical device
KR101968650B1 (ko) * 2018-05-15 2019-04-12 울산과학기술원 3d 프린팅으로 제조되는 회전 가능한 쌍안정성 구조체 및 이의 용도
KR101968644B1 (ko) * 2018-05-15 2019-08-13 울산과학기술원 3d 프린팅으로 제조되는 트위스트 유형의 쌍안정성 구조체 및 이의 용도

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5619061A (en) * 1993-07-27 1997-04-08 Texas Instruments Incorporated Micromechanical microwave switching
US5536963A (en) * 1994-05-11 1996-07-16 Regents Of The University Of Minnesota Microdevice with ferroelectric for sensing or applying a force
FR2772512B1 (fr) * 1997-12-16 2004-04-16 Commissariat Energie Atomique Microsysteme a element deformable sous l'effet d'un actionneur thermique
US6188301B1 (en) * 1998-11-13 2001-02-13 General Electric Company Switching structure and method of fabrication
DE19937811C2 (de) * 1999-08-11 2001-07-26 Bosch Gmbh Robert Relais, insbesondere Mikro Relais zum Schalen eines Stromkreises
US6239685B1 (en) * 1999-10-14 2001-05-29 International Business Machines Corporation Bistable micromechanical switches
FR2818795B1 (fr) * 2000-12-27 2003-12-05 Commissariat Energie Atomique Micro-dispositif a actionneur thermique
US6911891B2 (en) * 2001-01-19 2005-06-28 Massachusetts Institute Of Technology Bistable actuation techniques, mechanisms, and applications
SE0101183D0 (sv) * 2001-04-02 2001-04-02 Ericsson Telefon Ab L M Micro electromechanical switches
US6768412B2 (en) * 2001-08-20 2004-07-27 Honeywell International, Inc. Snap action thermal switch
US6621392B1 (en) * 2002-04-25 2003-09-16 International Business Machines Corporation Micro electromechanical switch having self-aligned spacers
JP3969228B2 (ja) * 2002-07-19 2007-09-05 松下電工株式会社 機械的変形量検出センサ及びそれを用いた加速度センサ、圧力センサ
US7283030B2 (en) * 2004-11-22 2007-10-16 Eastman Kodak Company Doubly-anchored thermal actuator having varying flexural rigidity

Also Published As

Publication number Publication date
DE602004008075T2 (de) 2008-05-15
FR2857153B1 (fr) 2005-08-26
US7489228B2 (en) 2009-02-10
JP2007516560A (ja) 2007-06-21
EP1639613A1 (de) 2006-03-29
EP1639613B1 (de) 2007-08-08
FR2857153A1 (fr) 2005-01-07
WO2005006364A1 (fr) 2005-01-20
ATE369612T1 (de) 2007-08-15
JP4464397B2 (ja) 2010-05-19
US20060152328A1 (en) 2006-07-13

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