DE602004004210D1 - Elektrischer Verbinder zum Verbinden von elektrischen Einheiten , elektrische Anordnung sowie Verfahren zur Herstellung - Google Patents

Elektrischer Verbinder zum Verbinden von elektrischen Einheiten , elektrische Anordnung sowie Verfahren zur Herstellung

Info

Publication number
DE602004004210D1
DE602004004210D1 DE602004004210T DE602004004210T DE602004004210D1 DE 602004004210 D1 DE602004004210 D1 DE 602004004210D1 DE 602004004210 T DE602004004210 T DE 602004004210T DE 602004004210 T DE602004004210 T DE 602004004210T DE 602004004210 D1 DE602004004210 D1 DE 602004004210D1
Authority
DE
Germany
Prior art keywords
electrical
manufacture
units
assembly
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004004210T
Other languages
English (en)
Other versions
DE602004004210T2 (de
Inventor
Nagao Miyazaki
Yoshihiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MIYAZAKI, NAGAO, TONDABAYASHI-SHI, OSAKA, JP
Osaka Prefecture
Original Assignee
Osaka Prefecture
Japan Electronics Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osaka Prefecture, Japan Electronics Industry Ltd filed Critical Osaka Prefecture
Publication of DE602004004210D1 publication Critical patent/DE602004004210D1/de
Application granted granted Critical
Publication of DE602004004210T2 publication Critical patent/DE602004004210T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09963—Programming circuit by using small elements, e.g. small PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE602004004210T 2003-07-28 2004-07-28 Elektrischer Verbinder zum Verbinden von elektrischen Einheiten , elektrische Anordnung sowie Verfahren zur Herstellung Expired - Lifetime DE602004004210T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003202198 2003-07-28
JP2003202198 2003-07-28

Publications (2)

Publication Number Publication Date
DE602004004210D1 true DE602004004210D1 (de) 2007-02-22
DE602004004210T2 DE602004004210T2 (de) 2007-10-11

Family

ID=33535580

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004004210T Expired - Lifetime DE602004004210T2 (de) 2003-07-28 2004-07-28 Elektrischer Verbinder zum Verbinden von elektrischen Einheiten , elektrische Anordnung sowie Verfahren zur Herstellung

Country Status (3)

Country Link
US (1) US7281931B2 (de)
EP (1) EP1503452B1 (de)
DE (1) DE602004004210T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7190328B1 (en) * 2004-05-07 2007-03-13 James Clar Three-dimensional display
JP4055787B2 (ja) * 2005-04-26 2008-03-05 船井電機株式会社 液晶表示装置
DE102008041497A1 (de) * 2008-08-25 2010-03-04 Robert Bosch Gmbh Bauteil mit einem mechanischen Kontakt und Verfahren zur Herstellung des Bauteils

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
US4737112A (en) * 1986-09-05 1988-04-12 American Telephone And Telegraph Company, At&T Bell Laboratories Anisotropically conductive composite medium
US4832455A (en) * 1986-09-11 1989-05-23 Kabushiki Kaisha Toshia Liquid crystal apparatus having an anisotropic conductive layer between the lead electrodes of the liquid crystal device and the circuit board
JPS63316885A (ja) * 1987-06-19 1988-12-26 キヤノン株式会社 液晶装置及び液晶パネルの接続法
US4917466A (en) * 1987-08-13 1990-04-17 Shin-Etsu Polymer Co., Ltd. Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
US5029984A (en) * 1988-03-15 1991-07-09 Mitsubishi Denki Kabushiki Kaisha Liquid crystal display device
JPH0291360U (de) * 1988-12-29 1990-07-19
US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure
US5180888A (en) * 1989-08-10 1993-01-19 Casio Computer Co., Ltd. Conductive bonding agent and a conductive connecting method
US6032520A (en) * 1990-03-19 2000-03-07 Japan Electronics Industry, Limited Device for measuring action force of wheel and device for measuring stress of structure
JP2736395B2 (ja) 1990-03-19 1998-04-02 日本電子工業 株式会社 車輪作用力測定装置及び構造体の応力測定装置
US5186042A (en) * 1990-03-19 1993-02-16 Japan Electronics Industry, Ltd. Device for measuring action force of wheel and device for measuring stress of structure
JP2737647B2 (ja) * 1994-03-10 1998-04-08 カシオ計算機株式会社 異方導電性接着剤およびそれを用いた導電接続構造
JP3131642B2 (ja) 1994-09-14 2001-02-05 日本電子工業株式会社 応力複合化センサ及びこれを用いた構造体の応力測定装置
EP1223612A4 (de) * 2000-05-12 2005-06-29 Matsushita Electric Ind Co Ltd Leiterplatte für halbleiterbauelemente, ihre herstelllungsmethode und herstellung der bestückungsanlage für die leiterplatten
TWI258160B (en) * 2004-01-08 2006-07-11 Au Optronics Corp Electrode connection structure and flat panel display employing the same

Also Published As

Publication number Publication date
US7281931B2 (en) 2007-10-16
EP1503452B1 (de) 2007-01-10
US20050033125A1 (en) 2005-02-10
DE602004004210T2 (de) 2007-10-11
EP1503452A1 (de) 2005-02-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: OSAKA PREFECTURE, OSAKA, JP

Owner name: MIYAZAKI, NAGAO, TONDABAYASHI-SHI, OSAKA, JP