DE60132037D1 - Gegossene Verpackung für integrierte Schaltung - Google Patents
Gegossene Verpackung für integrierte SchaltungInfo
- Publication number
- DE60132037D1 DE60132037D1 DE60132037T DE60132037T DE60132037D1 DE 60132037 D1 DE60132037 D1 DE 60132037D1 DE 60132037 T DE60132037 T DE 60132037T DE 60132037 T DE60132037 T DE 60132037T DE 60132037 D1 DE60132037 D1 DE 60132037D1
- Authority
- DE
- Germany
- Prior art keywords
- chip
- tape
- mould
- housing
- reinforcement plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title 1
- 230000002787 reinforcement Effects 0.000 abstract 4
- 238000000465 moulding Methods 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000007935 neutral effect Effects 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Transmitters (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0001965A FR2805392B1 (fr) | 2000-02-17 | 2000-02-17 | Boitier de circuit integre surmoule |
FR0001965 | 2000-02-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60132037D1 true DE60132037D1 (de) | 2008-02-07 |
DE60132037T2 DE60132037T2 (de) | 2008-12-18 |
Family
ID=8847093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60132037T Expired - Lifetime DE60132037T2 (de) | 2000-02-17 | 2001-02-15 | Gegossene Verpackung für integrierte Schaltung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1130641B1 (de) |
AT (1) | ATE382191T1 (de) |
DE (1) | DE60132037T2 (de) |
FR (1) | FR2805392B1 (de) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827350A (ja) * | 1981-08-11 | 1983-02-18 | Citizen Watch Co Ltd | Icの実装方法 |
JPH01135050A (ja) * | 1987-11-20 | 1989-05-26 | Hitachi Ltd | 半導体装置 |
JP2531382B2 (ja) * | 1994-05-26 | 1996-09-04 | 日本電気株式会社 | ボ―ルグリッドアレイ半導体装置およびその製造方法 |
JPH10242333A (ja) * | 1997-03-01 | 1998-09-11 | Nitto Denko Corp | 半導体装置及び半導体装置の製造方法 |
-
2000
- 2000-02-17 FR FR0001965A patent/FR2805392B1/fr not_active Expired - Fee Related
-
2001
- 2001-02-15 AT AT01400403T patent/ATE382191T1/de not_active IP Right Cessation
- 2001-02-15 EP EP01400403A patent/EP1130641B1/de not_active Expired - Lifetime
- 2001-02-15 DE DE60132037T patent/DE60132037T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE382191T1 (de) | 2008-01-15 |
FR2805392A1 (fr) | 2001-08-24 |
EP1130641B1 (de) | 2007-12-26 |
EP1130641A1 (de) | 2001-09-05 |
DE60132037T2 (de) | 2008-12-18 |
FR2805392B1 (fr) | 2003-08-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |