DE60118030D1 - Baugruppenträger für von der vorderseite und rückseite eingeschobenen einschübe - Google Patents

Baugruppenträger für von der vorderseite und rückseite eingeschobenen einschübe

Info

Publication number
DE60118030D1
DE60118030D1 DE60118030T DE60118030T DE60118030D1 DE 60118030 D1 DE60118030 D1 DE 60118030D1 DE 60118030 T DE60118030 T DE 60118030T DE 60118030 T DE60118030 T DE 60118030T DE 60118030 D1 DE60118030 D1 DE 60118030D1
Authority
DE
Germany
Prior art keywords
rear panels
assembly support
module bay
chassis
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60118030T
Other languages
English (en)
Other versions
DE60118030T2 (de
Inventor
Guy Sucharczuk
Pradzynski Krzsztof
Artie Avlonitis
Jose Salinas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aurora Networks Inc
Original Assignee
Aurora Networks Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aurora Networks Inc filed Critical Aurora Networks Inc
Application granted granted Critical
Publication of DE60118030D1 publication Critical patent/DE60118030D1/de
Publication of DE60118030T2 publication Critical patent/DE60118030T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H05K7/1445—Back panel mother boards with double-sided connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/928—Modular electrically interengaging parts, e.g. stove with replaceable heating elements formed on coupling parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Pallets (AREA)
  • Battery Mounting, Suspending (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
DE60118030T 2000-12-22 2001-12-18 Baugruppenträger für von der vorderseite und rückseite eingeschobene einschübe Expired - Lifetime DE60118030T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/748,746 US6498732B2 (en) 2000-12-22 2000-12-22 Chassis for front and back inserted modules
US748746 2000-12-22
PCT/US2001/049279 WO2002052911A2 (en) 2000-12-22 2001-12-18 Chassis for front and back inserted modules

Publications (2)

Publication Number Publication Date
DE60118030D1 true DE60118030D1 (de) 2006-05-11
DE60118030T2 DE60118030T2 (de) 2006-08-31

Family

ID=25010742

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60118030T Expired - Lifetime DE60118030T2 (de) 2000-12-22 2001-12-18 Baugruppenträger für von der vorderseite und rückseite eingeschobene einschübe

Country Status (9)

Country Link
US (2) US6498732B2 (de)
EP (1) EP1344438B1 (de)
AT (1) ATE320701T1 (de)
AU (1) AU2002231088B2 (de)
CA (1) CA2432691C (de)
DE (1) DE60118030T2 (de)
ES (1) ES2256322T3 (de)
IL (2) IL156396A0 (de)
WO (1) WO2002052911A2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6700797B2 (en) * 2000-11-29 2004-03-02 General Instrument Corporation Nested plug-in modules
US7266298B2 (en) * 2001-05-07 2007-09-04 Aurora Networks, Inc. N-way broadcast/narrowcast optical combiner demultiplexing a multiplexed narrowcast input signal
US6833996B2 (en) * 2002-06-10 2004-12-21 Sun Microsystems, Inc. Electronics assembly
DE50306934D1 (de) * 2003-01-03 2007-05-10 Rohde & Schwarz Messgerätmodule und messgerät
US6870743B2 (en) * 2003-03-17 2005-03-22 Unisys Corporation Cellular computer system
US7136283B2 (en) * 2003-06-11 2006-11-14 Hewlett-Packard Development Company, L.P. Multi-computer system
US7236358B2 (en) * 2003-06-11 2007-06-26 Hewlett-Packard Development Company, L.P. Computer system
US6960720B2 (en) * 2004-03-19 2005-11-01 Shuttle Inc. Lift-type positioning structure for bracket of computer interface card
JP2006059448A (ja) * 2004-08-20 2006-03-02 Hitachi Ltd ディスクアレイ装置
US7382624B2 (en) * 2004-10-22 2008-06-03 Hewlett-Packard Development Company, L.P. Power supply including multiple AC receptacles
US7453707B2 (en) * 2005-07-28 2008-11-18 Dell Products L.P. Tool-less, translating hard drive bay
US8079481B2 (en) * 2005-10-28 2011-12-20 International Business Machines Corporation Integrated frame and central electronic complex structure
US7388757B2 (en) * 2005-11-28 2008-06-17 Emerson Network Power - Embedded Computing, Inc. Monolithic backplane having a first and second portion
JP5135453B2 (ja) * 2011-05-31 2013-02-06 株式会社東芝 電子機器
TWI470584B (zh) * 2012-07-10 2015-01-21 Wistron Corp 用於伺服器之主動警示裝置及其警示方法
EP3438676B1 (de) 2017-08-04 2020-07-15 Rohde & Schwarz GmbH & Co. KG Struktur eine modularen gerätes
US10609825B1 (en) * 2018-12-17 2020-03-31 Adtran, Inc. Cable access platform having external electronic modules

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1129193B (de) * 1960-08-16 1962-05-10 Siemens Ag Gestell fuer Bauelemente tragende Einschuebe fuer Fernmelde-, insbesondere Fernsprechanlagen
US5027254A (en) * 1989-11-09 1991-06-25 International Business Machines Corporation Apparatus for cooling electronics components
US5023754A (en) * 1990-01-19 1991-06-11 International Business Machines Corporation Double-sided backplane assembly
US5031075A (en) * 1990-01-19 1991-07-09 International Business Machines Corporation Double-sided logic cage
GB2276275A (en) * 1993-03-20 1994-09-21 Ibm Cooling modular electrical apparatus
US5381314A (en) * 1993-06-11 1995-01-10 The Whitaker Corporation Heat dissipating EMI/RFI protective function box
US5398161A (en) * 1993-07-23 1995-03-14 Excel, Inc. Telecommunications switch chassis having housing with front and rear compartments divided by interior partition and removable cover over rear compartment
JPH07307962A (ja) * 1994-03-17 1995-11-21 Fujitsu Ltd 回路基板の実装構造
US5579204A (en) * 1994-08-05 1996-11-26 Emc Corporation Disk carrier assembly
EP0886992B1 (de) * 1996-03-13 1999-08-11 Siemens Nixdorf Informationssysteme AG Gerätechassis für elektronische geräte
US5808876A (en) * 1997-06-20 1998-09-15 International Business Machines Corporation Multi-function power distribution system
ATE217475T1 (de) * 1997-12-16 2002-05-15 Siemens Ag Baugruppenrahmen zur aufnahme von unterschiedlichen baugruppen
DE19810571C1 (de) * 1998-03-11 1999-05-20 Siemens Nixdorf Inf Syst Anordnung zur Zuführung einer Versorgungsspannung zu einer Messerleiste eines Baugruppenträgers
US6563706B1 (en) * 1998-06-23 2003-05-13 Hewlett-Packard Development Company, L.P. Typically high-availability information storage product
US6181552B1 (en) * 1998-10-27 2001-01-30 Robert J. Neville, Jr. Computer assembly
US6608762B2 (en) * 2001-06-01 2003-08-19 Hyperchip Inc. Midplane for data processing apparatus

Also Published As

Publication number Publication date
DE60118030T2 (de) 2006-08-31
IL156396A0 (en) 2004-01-04
US6498732B2 (en) 2002-12-24
WO2002052911A2 (en) 2002-07-04
US20020080589A1 (en) 2002-06-27
CA2432691A1 (en) 2002-07-04
ATE320701T1 (de) 2006-04-15
US20030031003A1 (en) 2003-02-13
CA2432691C (en) 2007-08-07
WO2002052911A9 (en) 2003-09-18
IL156396A (en) 2008-03-20
ES2256322T3 (es) 2006-07-16
US6847528B2 (en) 2005-01-25
EP1344438A2 (de) 2003-09-17
EP1344438B1 (de) 2006-03-15
WO2002052911A3 (en) 2002-12-19
AU2002231088B2 (en) 2003-09-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition